JPH0282694A - Heat radiation structure for slim type communication apparatus - Google Patents

Abstract

PURPOSE:To improve heat radiation characteristics by supplementing, with the selection of a rack material and a heat radiating fin, the reduction of heat radiation which might be produced owing to mounting heating parts contained in a transmitter section unit in a slim type rack. CONSTITUTION:Any heat produced on the front side of a transmitter section unit 2c is transmitted through the interiors of a microwave confinement casing 58 and a mount member 64 and radiated through a heat radiating fin 66a provided on a front surface section 66. Part of the heat transmitting to the front surface side of the mount member 64 is transmitted through an aluminum side support 12 and radiated through a heat radiating fin 44 fixed to connection portions 36, 34 into the air. Further, any heat produced on the rear side of the transmitter section unit 26 in the same is allowed to pass through a slit formed in a side panel 16 and enter a flue 15 for drawing-up thereof. Further, the heat is radiated through heat radiating fins 68a, 70a and a slit 21 formed in a rear cover 20. Since the side plate 16 and the rear cover 20 have been formed of aluminum, the heat is further radiated also through heat conduction. Hereby, reduction of the heat radiation effect owing to mounting the heating parts in a slim type rack can be compensated for to improve heat radiation characteristics.

Description

[Detailed Description of the Invention] Summary Regarding the heat dissipation structure of a slim type communication device, the present invention aims to provide a heat dissipation structure of a slim type communication device with improved heat dissipation characteristics, and a plurality of shelves are integrally defined by a vertically long rack. death,
In each shelf there are a transmitter unit, a receiver unit,
In a narrow-width slim type communication device equipped with a power supply unit, etc., there is a pair of side columns that integrally connect the racks at the top and bottom, and a side plate that has multiple slits for heat dissipation and is fixed to each side column. , a microwave storage housing configured with a plurality of slits for heat dissipation and a back cover connecting both side plates, and housing the microwave circuit section of the transmitter unit, is attached to a mounting member of a good thermal conductor; The mounting member is extended to cover the front side of the transmitter unit so that the mounting member comes into contact with the side column of the rack when mounted on the shelf, and a heat dissipation fin is integrally provided on at least the front side of the mounting member, so that at least the transmitter unit A heat dissipation fin is fixed to the front surface of the connection between the shelf where the rack is mounted and the shelf one step above, and a recess extending vertically is provided in the side plate of the rack, so that it faces the rack when multiple racks are installed side by side. The two recesses form a chimney.

Industrial applications The present invention relates to a heat dissipation structure for a slim communication device.

Communication equipment is generally made into two units, such as a transmitter unit, receiver unit, modem unit, and power supply unit, and each unit is configured by being mounted on a shelf installed in a rack. There is. Vertical mounting of printed wiring boards is generally adopted as a mounting method, and in this printed wiring board w device mounting, multiple electronic components such as ICs and LSIs with electronic circuits are printed together. Multiple electronic circuit packages mounted on a board are attached to a shelf via connectors.
A shelf unit is constructed by mounting on two back wiring boards (hereinafter referred to as backboards), and a plurality of Schertz unilateral racks are mounted on the rack to form a communication device.

In communication devices configured in this way, the transmitter unit in particular contains many heat-generating components such as transistors that make up the microwave circuit, so heat radiation is required to efficiently dissipate heat from these heat-generating components. Structure is needed.

Conventional technology The external dimensions of conventional communication devices mounted on racks are generally 520 mm in width, and one or more communication devices with such width dimensions can be arranged in parallel depending on the purpose. I was trying to use it as a.

This general communication device has a width of 520 mm, so there is no need for high-density packaging, and the space is sufficiently large, making it an advantageous structure in terms of heat dissipation characteristics. Therefore, it was easy to achieve heat dissipation characteristics that were consistent with the operation of the device without taking any special heat dissipation measures.

Problems to be Solved by the Invention Recently, due to the demand for downsizing of devices, demand for slim communication devices has been increasing from customers. The general external dimensions of a slim type communication device are 120 [11111 width x 225]
m depth x 2700 mm height, and each one needs to be independent. Compared to the 520 mm width of the external dimensions of a conventional general communication device, splitting loss occurs in the width direction, which is extremely disadvantageous in terms of thermal design since ventilation at the side portions is obstructed. Furthermore, the division loss in the width direction requires high-density mounting, which is also disadvantageous in terms of thermal design. However, there was a problem in that sufficient heat dissipation characteristics could not be obtained.

The present invention has been made in response to these points, and its purpose is to provide a heat dissipation structure for a slim type communication device that has improved heat dissipation characteristics.

Means to solve the problem Multiple shelves are integrally defined by vertical racks,
In each shelf there are a transmitter unit, a receiver unit,
In a narrow-width slim type communication device equipped with a power supply unit, etc., there is a pair of side columns that integrally connect the racks at the top and bottom, and a side plate that has multiple slits for heat dissipation and is fixed to each side column. , and a back cover that has a plurality of slits for heat dissipation and connects both side plates. Attach the microwave housing housing that houses the microwave circuit section of the transmitter unit to a mounting member that is a good thermal conductor, extend the mounting member to cover the front side of the transmitter unit, and attach the mounting member to the rack when mounting on a shelf. A radiation fin is integrally provided on at least the front side of the mounting member. Furthermore, a heat dissipation fin is fixed to the front surface of the connection between the transmitter unit/elf and the shelf one level above, and a recess that extends vertically is provided on the side plate of the rack to prevent multiple damage to the rack. When arranged side by side, the two opposing recesses form a chimney.

The heat generated in the front side of the transmitter unit for operation is radiated from the heat radiation fins attached to the front side of the unit itself, and is also conducted through the side pillars of the rank and from the heat radiation fins at the connection part. Heat is dissipated.

Furthermore, the heat generated in the rear side within the transmitter unit is actively radiated by being sucked up by the chimney effect of the side panels, and is also radiated through the heat radiating slits formed in the back cover. Heat dissipation efficiency can be further improved by forming the side columns, side plates, back cover, the microwave storage case, and the mounting members of the storage case all from aluminum, which has good thermal conductivity.

In this way, the present invention reduces the heat dissipation effect by mounting the heat-generating parts included in the transmitter unit in the slim rank by selecting the material that constitutes the rack and by improving the heat dissipation fin attached to the front of the transmitter unit. This is supplemented by heat dissipation fins fixed to the connecting portion of the rack, thereby obtaining practically sufficient heat dissipation characteristics.

Example Embodiments of the present invention will be described in detail below based on the drawings.

First, referring to FIG. 2, this figure is an external perspective view of an embodiment of the present invention, and a slim type communication device (for example, an I
! 120 mm) rack 10. Reference numeral 12 denotes a side post of the rack 10, which is made of extruded aluminum. The pair of side columns 12, 12 are connected and integrated by a top plate 14 and a bottom plate (not shown). Side plates 16.18 are screwed to the side post 12, and each side plate 16.18 is formed with a recess 16a, 18a. A large number of slits 17 are provided in the recess 16a, and a large number of slits 19 are provided in the recess tl18a. As shown in FIG. 1, a pair of side plates 16.
16 are connected by a back cover 20 having a large number of slits 21. Similarly, the pair of side plates 18.18 are also connected by a back cover (not shown). Side plate 16
．． 18 and the back cover 20 are made of aluminum, which has excellent thermal conductivity.

22 is a terminal board (TERM), which houses a large number of terminal groups. 24 is a receiving unit (R
X), and this receiver unit is connected to a waveguide provided on the back side of the rack via two coaxial cables 46, and this waveguide is connected to an antenna device.

The reason why two coaxial cables 46 are connected to the receiver unit 24 is that the received signal is received by two antennas, and one of the received signals is selected and supplied to the receiver unit 24 due to spatial diversity. It's for a reason.

Reference numeral 26 denotes a transmitter unit (TX). This transmitter unit houses heat-generating components such as a heat-generating transistor, and requires sufficient heat dissipation to stabilize the operation of the transmitter unit. The transmitter unit 26 is connected to a waveguide provided on the rear side of the rack 10 via a coaxial cable 48, and this waveguide is connected to an antenna device. 28 is a common unit (COM), 3
0 is a modem unit (MD), and 32 is a power supply unit (PS).

Each of the above units is housed within a shelf integrally defined by the rack 10. That is, in this embodiment, the rank 10 defines six shelves, each shelf is provided with a guide rail (not shown), and the printed boards constituting each unit are placed vertically in the guide rails. It is about to be implemented. Connecting parts 34, 36, 38, 40, 42 are formed between each unit, and an aluminum heat radiation fin 44 is fixed to the connecting part 34 between the terminal board unit 22 and the receiving unit 24. has been done. Similarly, a radiation fin 44 made of aluminum is fixed to the connecting portion 36 between the receiver unit 24 and the transmitter unit 26 (see FIG. 3). A plurality of slits 41 for taking in cold air are provided at the connecting portion 38, 40° 42 and the bottom front side 43 of the rack.

Referring now to FIG. 1, this figure shows a cross-sectional view of the transmitter unit 26 of FIG. 2, with a bank board 50 having a connector 52 attached to the side plate 16. 54 is a printed board, and this printed board 5
Intermediate frequency circuit sections 55, 57, and 59 are mounted on 4, and a mounting member 64 having a generally U-shaped cross section is attached. The rack lO defines a shelf for storing the transmitter unit 26, the printed board 54 is inserted into the guide rails provided above and below this shelf, and the connector 56 of the printed board 54 is connected to the connector 5 of the backboard 50.
2, the transmitter unit 26 is vertically mounted in the shelf.

Reference numeral 58 denotes a microwave storage case made of aluminum, and a microwave circuit section composed of parts such as a heat generating transistor 60 is housed in this case 58. 62 is a lid also made of aluminum, and by housing the microwave circuit section in the microwave storage housing 58 with a lid,
The microwave circuit section is electromagnetically shielded.

The microwave storage case 58 is attached to the aluminum attachment member 64 mentioned above. The mounting member 64 includes a front part 66 that covers the front side of the transmitter unit 26 and a side post 12.
It is integrally constituted by a side surface portion 68 facing the side surface plate 16 and a rear surface portion 70, and has a generally U-shaped cross section. A plurality of heat radiation fins 66a are integrally formed on the front part 66. Similarly, side portion 68. Rear part 7
Also, heat dissipation fins 68a and 70a are integrally formed. Connector 56 of printed board 54 to backboard 5
When the connector 52 of 0 is completely fitted, the mounting member 64
Both inner end portions of the front surface portion 66 are brought into contact with the side pillar 12. As is clear from the cross-sectional view in Figure 1,
When a plurality of racks 10 are arranged side by side, a chimney 15 is formed by the recesses 16a of adjacent side plates 16.

The heat dissipation operation of the above-mentioned embodiment will be explained below.

Heat generated from the heat generating transistor 60 and the like on the front side of the transmitter unit is conducted through the microwave housing casing 58 and the mounting member 64, and is transferred to the heat dissipation fin 66a provided on the front part 66.
Heat is dissipated through the Further, a part of the heat conducted to the front side of the mounting member 64 is conducted upward through the aluminum side column 12 and is fixed to the radiation fin 44 fixed to the connection part 36 and the connection part 34. Heat is radiated into the air via the heat radiating fins 44.

On the other hand, the heat on the rear side inside the transmitter unit enters the chimney 15 through the slit 17 of the side plate 16 and is sucked upward by the chimney effect. In addition, heat is also radiated by the heat radiation fins 68a and 70a of the mounting member 64, and the back cover 2
A part of the heat is discharged to the outside of the device through the slit 21 provided at 0. Since the side plate 16 and the back cover 20 are made of aluminum, heat dissipation is also promoted by heat conduction. Cool air is drawn into the shelf by slits 41 in the bottom front face 43 of the rack and in the connections 38, 40, 42.

FIG. 4 shows a schematic configuration diagram of another embodiment of the present invention,
(A) shows a schematic front view, and (B) shows a schematic side view. This embodiment is a receiver unit 2 that is not a heat generating part.
A heat dissipation fin 72 is integrally attached to the surface plate of No. 4 to expand the heat dissipation area on the front side of the device, thereby further improving the heat dissipation characteristics.

Effects of the Invention Since the heat dissipation structure of the slim type communication device of the present invention is configured as detailed above, the heat dissipation effect due to the heat generating components being mounted in the slim type rack can be reduced by using the heat dissipation structure provided on the front side of the transmitter unit. This can be supplemented by the heat dissipating fins fixed to the connecting portions of the racks, and has the effect of providing a slim type communication device with good heat dissipation characteristics.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of the transmitter unit of the embodiment of the present invention, Fig. 2 is an external perspective view of the embodiment of the invention, Fig. 3 is a side view of the main part of the embodiment, and Fig. 4 is the main part of the embodiment of the invention. It is a schematic configuration diagram of another embodiment, (A)
(B) shows a front view, and (B) shows a side view. 0... Rack, 2... Side pillar, 6.18... Side plate, 6a, 18a... Recessed part, 7, 21... Pickpocket/Soto,
O... Back cover 2... Terminal board unit, 4... Receiving section unit, 6... Transmitting section unit, 8... Common section unit, 0... Modem unit, 2... Power supply Unit, 4.36.38.40.42... Connection part, 1...
Slit, 6.48...Coaxial cable, 0...Backboard, 4...Printed board, 5.57.59...Intermediate frequency circuit section, 8...Microwave storage housing , 0...Heating transistor, 4...Mounting member, 5a, 68a, 7Qa...Radiating fin.

Claims (1)

[Claims] A vertically long rack (10) integrally defines a plurality of shelves, and each shelf includes a transmitter unit (26),
In a slim communication device with a narrow width that includes a receiver unit (24), a power supply unit (32), etc., a rack (
10) integrally connected at the top and bottom, and side plates (16, 18) each having a plurality of heat dissipation slits (17, 19) and fixed to each side column (12). ) and both side plates (16,
16) and a back cover (20) that connects the
The microwave storage case (58) that houses the microwave circuit section of the transmitter unit (26) is attached to the mounting member (6) made of a good thermal conductor.
4), and the mounting member (64) is extended to cover the front side of the transmitter unit (26), and the mounting member (64) is installed when the shelf is mounted.
) is brought into contact with the side column (12) of the rack, and heat dissipation fins (66a) are integrally provided on at least the front side (66) of the mounting member (64), and at least the transmitter unit (26) is mounted on the shelf. A heat dissipation fin (44) is fixed to the front surface (36) of the connection between the rack (10) and the shelf one step above, and recesses (16a, 18a) extending in the vertical direction are provided in the side plates (16, 18) of the rack (10). and two opposing recesses (16a, 1) when a plurality of racks are arranged side by side.
6a; 18a, 18a) to form a chimney.