JPH0282550A - Wafer handler - Google Patents

Abstract

PURPOSE:To secure freedom only in linear moving direction of a wafer supporting member without applying complicated structure by arranging a pair of articulated arms so that each moving plane thereof crosses. CONSTITUTION:A wafer supporting member 12 is attached to each one end of a pair of articulated arms 10, 11 to constrain the end. A pair of articulated arms 10, 11 are arranged so that their moving planes cross. A first articulated arm 10 is provided with arms 10a, 10b with three points a, b, c as articulation sections, and a second articulated arm 11 which makes a pair therewith is also provided with arms 11a, 11b with three points a, b, c as articulation sections. The wafer supporting member 12 which is attached to one end of the first and the second articulated arms 10, 11 constrains in vertical direction alone and is moved by rotating any of arms 10a, 10b, 11a, 11b. As a result, the number of members can be reduced since any other members are not required to secure freedom in one direction alone.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) FIELD OF THE INVENTION The present invention relates to wafer handlers.

(Prior Art) In semiconductor manufacturing processes, wafer handlers are used, for example, to transfer wafers housed in cassettes to wafer processing equipment.

A typical example of this type of wafer handler is a handler called the flag-leg method (Japanese Patent Laid-Open No. 61
-71383. Japanese Patent Publication No. 61-90887. Unexamined Japanese Patent Publication 1986-
90903, JP-A-61-99344. Unexamined Japanese Patent Publication 1986-
99345. JP-A-61-160949, JP-A-61
-184841, JP-A-61-278149, JP-A-62-21644. JP-A-62-1t1607, JP-A-62-161608, JP-A-62-21649. JP-A-62-45038, JP-A-62-41129. Japanese Patent Publication No. 150735/1983).

As shown in FIG. 7, this handler includes a wafer support member 1 capable of placing a wafer on a surface, and a pair of first arm members 2 and 2 rotatably connected to the wafer support member 1. and a pair of second arm members 3.3 whose one ends are rotatably supported by the first arm members 2, 2.

The 11th arm member 3.3 is provided with a drive shaft provided at one end of the second arm member 3.3. Second arm 2.
A second pulley 5 is provided on the rotating shaft connecting the first and second pulleys. The ratio of the diameters of the second pulleys 4 and 5 is set to 2:1, and a belt 6 is passed between the two pulleys 4.5. Further, the wafer support member 1 is connected to the first arm 2.2.
In order to prevent the shaft from rotating freely against the shaft, a structure in which gears (not shown) are engaged with each other is adopted.

(Problems to be Solved by the Invention) According to the flag leg type wafer handler described above, if only the first and second arm members arranged in parallel on the same plane are connected, the joint portion of the arm cannot be moved. Since the position is not uniquely determined, it is not possible to ensure the degree of freedom of the wafer support member l in only one direction. It becomes essential to use the second pulleys 4, 5 and the belt 6, and also to use gears between the support member 1 and the first arm member 2.2 to allow the free rotation of the wafer support member 1. must be restrained.

As described above, the above configuration requires a relatively large number of components, which inevitably increases costs.Also, since gears are used, the handler has a strong force due to backlash when the gears mesh. It ends up.

The present invention has been made in view of the above circumstances, and while reducing the number of component parts, it is possible to obtain the degree of freedom of linear movement of the wafer support member in only one direction, and the structure is simple and inexpensive. The purpose is to provide wafer handlers.

[Structure of the Invention] (Means for Solving Problems) The wafer handler of the present invention supports a wafer support member at one end of each of a pair of multi-joint arms, and supports a wafer support member at one end of each of the pair of multi-joint arms. The wafer support member is arranged so as to intersect the movement plane, and the wafer support member is moved linearly by rotating the other end of one multi-jointed arm.

In order to linearly move the wafer support member to both sides of the position where the pair of multi-joint arms are arranged, it is preferable to arrange the pair of multi-joint arms at a position where they do not interfere with the wafer support member when moving in both directions. Furthermore, the entire wafer handler can be configured to be rotatable so that one end of the wafer support member can be placed on the opposite side, and furthermore, the wafer can be supported at both ends of the wafer support member. In addition, in the case where the wafer support member moves in both directions, it is possible to adopt a configuration in which at least when a plurality of arms constituting a multi-jointed arm overlap each other, this overlap is canceled by applying an external force. can.

(Function) A wafer support member is attached to one end of each of a pair of multi-joint arms to restrain this end, and by arranging the movement planes of the pair of multi-joint arms to intersect, one of the multi-joint arms When the other end of the arm is rotationally driven, the position of the joint part is uniquely determined by the restraint between the pair of multi-jointed arms, and therefore the degree of freedom of the wafer support member is the same as the one you want to move the wafer support member in a straight line. Only one direction is possible.

This will be explained with reference to FIG. 5, which is the most simplified and schematic representation of the m-structure of the present invention. Arm 10a
, 10b, and the second multi-jointed arm 2 paired therewith also has a, b.

It has arms lla and llb with three points C as joints. And this first one. Second articulated arm 10.
If one plane 12 fitted at one end of 11 is used as a wafer support member, arms 10a, 10b, lla, ll
If either arm b is rotated, the wafer support member 12 is moved while being restrained only in the vertical direction in the figure.

As a result, there is no need for a curved member to ensure the degree of freedom in only one direction, so the number of members can be reduced.
Furthermore, since no gears are required, there is no handler rattling due to backlash.

(Example) Hereinafter, an example in which the present invention is applied to a wafer handler for semiconductor wafers will be specifically described with reference to the drawings.

As shown in FIGS. 1 and 2, this wafer handler has a pair of multi-jointed arms 20.30 arranged at an angle so that their planes of movement intersect. Then, an arm connecting member 40 is provided, which includes an inclined part 42 whose both ends are inclined at the same angle as the multi-joint arm 20.30, and a horizontal part 44 formed between the inclined parts 42 and 42.
is rotatably supported at the movable ends of the pair of multi-jointed arms 20.30. And this arm connecting member 40
At the top, along a direction perpendicular to the longitudinal direction of the arm connecting member 40, a pair of tweezers 5, which is an example of a support member, is attached.
0 is fixed. The tweezers 50 have vacuum suction parts 52 and 52 on both ends thereof, which can support the Ueno X60 by vacuum suction, for example.

Next, details of the pair of multi-joint arms 20.30 will be explained.

The multi-joint arms 20.30 have the same external configuration except for the drive system. That is, one multi-joint arm 20 is composed of a first arm 22 and a second arm 24, and similarly, the other multi-joint arm 30 is also composed of a first arm 32 and a second arm 34, It has a structure in which each arm has three joints (a, b, c) that are rotatable at both ends. Note that one end side of the first arm 22.degree. 32 is referred to as a first joint a, and the first. The connecting portion of the second arm is assumed to be a second joint, and the inclined portion 42° 42 and the second
The connection part with the arm 24.34 is defined as the third joint C.

Further, the first joint a of the pair of multi-joint arms 20.30
The side is rotatably supported by the slope 72.72 of the base 70, which has a slope 72.72 inclined at the same angle as the slope of the pair of articulated arms 20.30. The slope 72 on the side of the multi-joint arm 20 is further formed to extend diagonally downward, and this area is used as a mounting portion 74 for the motor 80 that drives the first arm 22 of the multi-joint arm 20. .

Further, the base 70 is rotatable in the θ direction in FIGS. 1 and 2 with the vertical line as the rotation axis.

Next, the drive system of the pair of multi-joint arms 20.30 will be explained with reference to FIG.

The wafer handler of this embodiment has one multi-jointed arm 2.
It has a drive system only on the 0 side, and when this - side multi-joint arm 20 is driven, the other multi-joint arm 30 follows it, and while the side joint arms 20 and 30 restrain each other, Vincento 50 will be moved. The Vince yto 52 moves while maintaining a horizontal state during any movement.

As a drive system for the multi-joint arm 20, first, a first boot 982 is fixed to the output shaft of the motor 80. on the other hand,
A second pulley 86 is fixed to the rotating shaft 84 of the first arm 22 at the first joint a, and a belt 88 is hung between the second pulley 86 and the first pulley 82. It has been passed.

As a result, when the motor 80 is rotationally driven, this rotational output is transmitted to the first pulley 82. Belt 88. Second pulley 86
The signal is transmitted to the rotating shaft 84 of the first arm 22 via the rotating shaft 84, and the first arm is driven to rotate about the rotating shaft 84.

According to the configuration of this embodiment, the one multi-joint arm 20
By rotationally driving the first arm 22, the movement position of each joint of the pair of multi-joint arms 20.30 is uniquely determined, and the tweezers 50 are reliably driven in one of the long plane directions. , and there is no freedom of movement in other directions.

Therefore, as the drive system for this wafer handler, only the one described above is sufficient, but in this embodiment, the tweezers 5
An additional drive system is provided to ensure zero linear reciprocating drive. This fixes the third pulley 90 above the rotating shaft 84, and further fixes the third pulley 90 to the upper side of the rotating shaft 84. 2nd arm 2
A fourth pulley 94 is fixed to the rotating shaft 92 of the connecting portion of 2.24. A bell 96 is passed between the fourth pulleys 90 and 94. Note that the ratio of the diameters of the third pulley 90 and the fourth pulley 94 is 2:1.

Furthermore, in order to prevent the diffusion of dust during operation of a wafer handler having such a moving part, the interior of the multi-joint arm 20.30 can be evacuated in this embodiment.

That is, if one multi-joint arm 20 is explained, the first. As shown in FIG. 3, the second arms 22 and 24 have a hollow shape with a cutout inside.
．． Second. Each third joint a.

The rotating shafts 84, 92, and 98 disposed at b and c are similarly hollow shafts, and the interior of the multi-joint arm 20 is in a state of communication. This configuration is the same for the other multi-joint arm 30.

Next, the effect will be explained.

First, in the wafer handler of this embodiment, the moving planes of a pair of multi-joint arms 20 and 30 are arranged to intersect with each other, and the first arm 22 of one multi-joint arm 20
The rotating shaft 84 of the sensor Ha is rotated and driven by the motor 80.

When the first arm 22 rotates at the first joint a due to the drive of the motor 80, the pair of multi-joint arms 2
The movement position of the other joint of 0.30 is uniquely determined, and as in the conventional 7-lag method, both of the pair of arms are rotated synchronously, and the rotation ratio of the 1st and 2nd arms is set to 2 = 1. There is no need to employ complex configurations to manage and drive the system.

In the wafer handler of this embodiment, as shown in FIG. It is possible. That is, the wafer handler of this embodiment has a pair of multi-jointed arms 20.degree. and 30.as shown in FIG. Even if the second arms 22, 24 and 32° 34 are able to completely overlap each other, and the bin set 50 moves in either direction to the left or right from this state, there are no members that interfere with the movement of the bin set 50. It seems like it doesn't exist at all. Therefore, a large movement stroke of the bin set 50 can be ensured.

Here, when moving to both sides of the pair of multi-joint arms 2030 in this way, there is always a state in which the arms overlap each other as shown in FIG. In this case, even if the first arm 22 is driven, the first. Second arm 22.
There is a possibility that the relative positions of the arms 22 and 24 remain overlapped and do not change, and that both arms 22 and 24 rotate about the rotation axis 84 of the first joint a in the overlapped state. This also applies to the other multi-joint arm 30.

This phenomenon occurs when the bin set 50 moves continuously due to its inertial force, which causes the bottle set 50 to move from the state shown in FIG. 2 to the state shown in FIG. Since the position of the second arms 22 and 24 is shifted, it is unlikely that this will actually occur, but this countermeasure is necessary since there is a possibility that a phenomenon similar to that caused by the all-stage design may occur.

In this embodiment, the rotational force of the rotating shaft 84 at the first joint a is
Third. It is also transmitted to the rotation axis 92 of the second joint using the fourth pulley 90.94 and belt 96, and the second arm 24
It uses a rotating configuration. Note that because it is necessary to rotate the second arm 24 under the constraint condition of the pair of multi-joint arms 20.30, the third. The diameter ratio of the fourth pulley 90.94 is set to 2:1.

Next, the operation of transporting the wafer 60 using this wafer handler will be described with reference to FIG.

In the figure, a bin set 50 of this wafer handler is shown.
A cassette 100 containing, for example, 25 wafers 60 at a predetermined pitch in the vertical direction is provided at one end of the moving path of fl! ! A processing device 110 for performing wafer processing such as wafer etching and ashing is provided on the end side. Then, the wafers 60 to be taken out from the cassette 100 are supplied to the processing apparatus 110, the processed wafers 60 are returned to the cassette 100, and new wafers 60 are transferred from the cassette 100 to the processing apparatus 110. In such a case, first, as shown in FIG. 6(A), one end of the bin set 50 is inserted into the cassette 100, and -
The wafer 60-1 is vacuum-adsorbed onto the tweezers 50.

Next, the bin set 50 is removed from the cassette 100 (see FIG. 6(B)), and in this state waits for the processing of the wafers 60 to 0 that have already been carried into the processing apparatus 110 to be completed.

When the processing in the processing apparatus 110 is completed, the bin set 50 is moved to the right from the state shown in FIG. 6(B), and the processed wafer 600 is supported by the other vacuum suction unit 52 (FIG. 6(C)). ), and the tweezers 50 are moved to the left and stopped at a position where they are removed from the processing bag f110 (see FIG. 6(D)).

Thereafter, the base 70 is rotated 180 degrees, and the wafer 60-1 is
The bin set 50 on the side that supported the processing device 110
On the other hand, the side supporting the processed wafer 60-0 is set to face the cassette 100 (see FIG. 6(E)).

Then, the bin set 50 is moved to the left from the above state, and a new wafer 60-1 is transferred to the processing apparatus 110 (see FIG. 6(F)).

From this point on, processing in the processing device 110 is started, so
Using this processing time, the processed wafer 60-0 is transported back to the cassette 100, and thereafter the process returns to FIG. 6(A) and the operation is repeated.

In this way, if the double tweezers structure as described above is used and the base 70 is made rotatable, it is possible to support a processed wafer without supporting a new wafer in the bin set 50. If the base 70 is rotated in this state, this new wafer can be immediately transferred to the processing device 110. Therefore, when there is only one suction section, after receiving the processed wafer 60-0, it is returned to the cassette 100 and a new wafer 60-1 is placed.
is received from the cassette 100 and processed by the processing device 110.
However, in the above embodiment, after receiving the processed wafer 60-0 from the processing bag [110], the bin set 50 is rotated to remove the new wafer 60-1 already held therein. Since the receiver can be immediately transferred to the processing bag [110], the throughput for receiving and transferring wafers can be greatly improved.

Note that when semiconductor wafers are to be transported, this type of wafer handler is placed in a clean room, and dust generated by the operation of the moving parts is not to be spread, so in this example, the arms and their connecting parts are made hollow. By evacuating the inside of this structure, it is possible to reliably prevent dust in the moving parts from dispersing to the outside.

Note that the present invention is not limited to the above embodiments,
Various modifications are possible within the scope of the invention.

The present invention provides a pair of articulated arms 20 of a wafer handler.
．． 30 so that their planes of movement intersect, the movement position of each joint is uniquely determined when a part of a pair of multi-joint arms is driven. It is not necessarily limited to the configuration in which the tweezers ellipse, the rotation S mechanism of the base 70, the configuration in which the bottle set moves to both sides of a pair of multi-jointed arms, etc. are adopted.

[Effects of the Invention] As explained above, according to the present invention, by arranging a pair of multi-jointed arms so that their respective movement planes intersect, the degree of freedom of the wafer support member in the linear movement direction can be increased. This can be achieved without employing a complicated configuration, and a wafer handler with a simpler and cheaper configuration than conventional ones can be provided.

[Brief explanation of the drawing]

11 is a schematic perspective view of an embodiment of a wafer handler to which the present invention is applied; FIG. 2 is a schematic perspective view for explaining a neutral state in which the arms of the wafer handler shown in FIG. 3 is a schematic sectional view for explaining the internal structure of one multi-jointed arm of the wafer handler not shown in FIG. 1, and FIG. 4 is a schematic sectional view for explaining the movement of the bin set to both sides of the wafer handler. A schematic perspective view, FIG. 5 is a schematic explanatory view schematically showing the most simplified m-lateral when the movement planes of a pair of multi-joint arms intersect, and FIG.
FIG. 7 is an operational explanatory diagram for explaining a wafer transfer operation using the wafer handler shown in the figure, and FIG. 7 is a schematic explanatory diagram for explaining a conventional flag-rec type wafer handler. 2030...Pair of multi-joint arms, 40...Arm connection member, 50...Wafer support member (bin set), 60...
Wafer, 70...base, 80...motor. Figure Figure Figure Figure Figure

Claims (1)

[Claims] (1) A wafer support member is supported at one end of each of a pair of multi-joint arms, and the movement planes of each of the pair of multi-joint arms are arranged to intersect, and one of the multi-joint arms A wafer handler characterized in that the wafer support member is moved linearly by rotating the other end.