JPH028174U - - Google Patents
Info
- Publication number
- JPH028174U JPH028174U JP1988085290U JP8529088U JPH028174U JP H028174 U JPH028174 U JP H028174U JP 1988085290 U JP1988085290 U JP 1988085290U JP 8529088 U JP8529088 U JP 8529088U JP H028174 U JPH028174 U JP H028174U
- Authority
- JP
- Japan
- Prior art keywords
- board
- hole
- layer board
- inner layer
- circuit conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 5
- 230000003014 reinforcing effect Effects 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988085290U JPH0717166Y2 (ja) | 1988-06-28 | 1988-06-28 | 多層フレキシブルプリント配線板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988085290U JPH0717166Y2 (ja) | 1988-06-28 | 1988-06-28 | 多層フレキシブルプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH028174U true JPH028174U (en:Method) | 1990-01-19 |
| JPH0717166Y2 JPH0717166Y2 (ja) | 1995-04-19 |
Family
ID=31309966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988085290U Expired - Lifetime JPH0717166Y2 (ja) | 1988-06-28 | 1988-06-28 | 多層フレキシブルプリント配線板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0717166Y2 (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020241775A1 (ja) * | 2019-05-29 | 2020-12-03 | 京セラ株式会社 | 電子素子実装用基板、電子装置、および電子モジュール |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4717968A (en:Method) * | 1971-02-10 | 1972-09-11 | ||
| JPS5122060A (ja) * | 1974-08-19 | 1976-02-21 | Fujitsu Ltd | Tasopurintoban |
| JPS5381955A (en) * | 1976-12-27 | 1978-07-19 | Fujitsu Ltd | Multilayer printed board |
-
1988
- 1988-06-28 JP JP1988085290U patent/JPH0717166Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4717968A (en:Method) * | 1971-02-10 | 1972-09-11 | ||
| JPS5122060A (ja) * | 1974-08-19 | 1976-02-21 | Fujitsu Ltd | Tasopurintoban |
| JPS5381955A (en) * | 1976-12-27 | 1978-07-19 | Fujitsu Ltd | Multilayer printed board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020241775A1 (ja) * | 2019-05-29 | 2020-12-03 | 京セラ株式会社 | 電子素子実装用基板、電子装置、および電子モジュール |
| US12144114B2 (en) | 2019-05-29 | 2024-11-12 | Kyocera Corporation | Electronic element mounting substrate, electronic device, and electronic module |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0717166Y2 (ja) | 1995-04-19 |