JPH0281076U - - Google Patents
Info
- Publication number
- JPH0281076U JPH0281076U JP16056988U JP16056988U JPH0281076U JP H0281076 U JPH0281076 U JP H0281076U JP 16056988 U JP16056988 U JP 16056988U JP 16056988 U JP16056988 U JP 16056988U JP H0281076 U JPH0281076 U JP H0281076U
- Authority
- JP
- Japan
- Prior art keywords
- attached
- copper foil
- solder resist
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16056988U JPH0281076U (bs) | 1988-12-09 | 1988-12-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16056988U JPH0281076U (bs) | 1988-12-09 | 1988-12-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0281076U true JPH0281076U (bs) | 1990-06-22 |
Family
ID=31442747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16056988U Pending JPH0281076U (bs) | 1988-12-09 | 1988-12-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0281076U (bs) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005142405A (ja) * | 2003-11-07 | 2005-06-02 | Orion Denki Kk | Ledの輝度を向上させるプリント基板を配置した電子機器 |
JP5799138B1 (ja) * | 2014-06-09 | 2015-10-21 | ▲き▼邦科技股▲分▼有限公司 | 可撓性基板 |
-
1988
- 1988-12-09 JP JP16056988U patent/JPH0281076U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005142405A (ja) * | 2003-11-07 | 2005-06-02 | Orion Denki Kk | Ledの輝度を向上させるプリント基板を配置した電子機器 |
JP5799138B1 (ja) * | 2014-06-09 | 2015-10-21 | ▲き▼邦科技股▲分▼有限公司 | 可撓性基板 |