JPH028047U - - Google Patents
Info
- Publication number
- JPH028047U JPH028047U JP8548888U JP8548888U JPH028047U JP H028047 U JPH028047 U JP H028047U JP 8548888 U JP8548888 U JP 8548888U JP 8548888 U JP8548888 U JP 8548888U JP H028047 U JPH028047 U JP H028047U
- Authority
- JP
- Japan
- Prior art keywords
- longitudinal direction
- pellet
- leads
- lead frame
- mounts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8548888U JPH028047U (bg) | 1988-06-27 | 1988-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8548888U JPH028047U (bg) | 1988-06-27 | 1988-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH028047U true JPH028047U (bg) | 1990-01-18 |
Family
ID=31310156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8548888U Pending JPH028047U (bg) | 1988-06-27 | 1988-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH028047U (bg) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5262095U (bg) * | 1975-10-31 | 1977-05-07 | ||
| JP2003518733A (ja) * | 1999-11-01 | 2003-06-10 | ゼネラル セミコンダクター，インク． | プレーナハイブリッドダイオード整流器ブリッジ |
-
1988
- 1988-06-27 JP JP8548888U patent/JPH028047U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5262095U (bg) * | 1975-10-31 | 1977-05-07 | ||
| JP2003518733A (ja) * | 1999-11-01 | 2003-06-10 | ゼネラル セミコンダクター，インク． | プレーナハイブリッドダイオード整流器ブリッジ |
| JP4975925B2 (ja) * | 1999-11-01 | 2012-07-11 | ゼネラル セミコンダクター，インク． | プレーナ型ハイブリッドダイオード整流器ブリッジ |