JPH028042U - - Google Patents

Info

Publication number
JPH028042U
JPH028042U JP8385088U JP8385088U JPH028042U JP H028042 U JPH028042 U JP H028042U JP 8385088 U JP8385088 U JP 8385088U JP 8385088 U JP8385088 U JP 8385088U JP H028042 U JPH028042 U JP H028042U
Authority
JP
Japan
Prior art keywords
nut
external connection
outer envelope
plate material
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8385088U
Other languages
English (en)
Other versions
JPH0451486Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8385088U priority Critical patent/JPH0451486Y2/ja
Publication of JPH028042U publication Critical patent/JPH028042U/ja
Application granted granted Critical
Publication of JPH0451486Y2 publication Critical patent/JPH0451486Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第１図〜第７図は、本考案による電子部品の実
施例を示し、第１図は電力用ハイブリツドＩＣの
分解斜視図、第２図は組立側面断面図、第３図は
外部端子集合体の平面図、第４図は外部端子集合
体を装着した成形型の断面図、第５図は離型後の
外囲体の平面図、第６図は本考案の変形例を示す
部分的断面図、第７図は本考案の他の変形例を示
す部分的断面図、第８図および第９図は従来例の
側面断面図および正面図を示す。 ２１……端子部材、２１ｃ……連結部、２２…
…外部接続端子、２２ａ……導出部、２２ｂ……
折曲部、２２ｃ……貫通孔、２４……外囲体、３
０……外部端子集合体、４０……隔壁部、４１…
…間隙、４６……ナツト、４７……板材、４９…
…放熱板。

Claims (1)

  1. 【実用新案登録請求の範囲】 絶縁体から成る外囲体と、該外囲体に取り付け
    られた放熱板と、前記外囲体の側面から導出され
    た複数の外部接続端子とを有し、該外部接続端子
    の各々は前記外囲体からの導出部とこれに続く折
    曲部とを有するとともにビス挿通用の貫通孔を有
    する電子部品において、 前記折曲部と前記外囲体の側面との間に形成さ
    れた間隙内にナツトが該ナツトのねじ穴と前記ビ
    ス挿通用の貫通孔が略同軸上に位置するように配
    置され、前記外囲体に当接する板材が前記外部接
    続端子の導出部と対向する側から前記間隙にふた
    をするように配置され、かつ前記板材が前記放熱
    板と前記外囲体との間に狭まれて固定されること
    により、前記ナツトは前記外囲体と前記外部接続
    端子と前記板材とによつて包囲されて前記間隙内
    に保持されていることを特徴とする電子部品。
JP8385088U 1988-06-27 1988-06-27 Expired JPH0451486Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8385088U JPH0451486Y2 (ja) 1988-06-27 1988-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8385088U JPH0451486Y2 (ja) 1988-06-27 1988-06-27

Publications (2)

Publication Number Publication Date
JPH028042U true JPH028042U (ja) 1990-01-18
JPH0451486Y2 JPH0451486Y2 (ja) 1992-12-03

Family

ID=31308559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8385088U Expired JPH0451486Y2 (ja) 1988-06-27 1988-06-27

Country Status (1)

Country Link
JP (1) JPH0451486Y2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0474860U (ja) * 1990-11-13 1992-06-30

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0474860U (ja) * 1990-11-13 1992-06-30

Also Published As

Publication number Publication date
JPH0451486Y2 (ja) 1992-12-03

Similar Documents

Publication Publication Date Title
JPH028042U (ja)
JPH0241375U (ja)
JPS6257372U (ja)
JPS62201965U (ja)
JPS6059526U (ja) チツプ型電子部品
JPS58196892U (ja) 電子部品取付体
JPS623934Y2 (ja)
JPH01152489U (ja)
JPS63160024U (ja)
JPS6441173U (ja)
JPH0328682U (ja)
JPH0258310U (ja)
JPS5996879U (ja) コ−ド付電気器具
JPS63200998U (ja)
JPS6456154U (ja)
JPH02129739U (ja)
JPH0340596U (ja)
JPH0564520B2 (ja)
JPS61157368U (ja)
JPS63109456U (ja)
JPS6011437U (ja) コンデンサ
JPH02103724U (ja)
JPH01135684U (ja)
JPS618768U (ja) バ−ナ用点火装置
JPS63174491U (ja)