JPH028037U - - Google Patents
Info
- Publication number
- JPH028037U JPH028037U JP8359788U JP8359788U JPH028037U JP H028037 U JPH028037 U JP H028037U JP 8359788 U JP8359788 U JP 8359788U JP 8359788 U JP8359788 U JP 8359788U JP H028037 U JPH028037 U JP H028037U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- needles
- probe card
- testing
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 4
- 239000000523 sample Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8359788U JPH028037U (lv) | 1988-06-24 | 1988-06-24 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8359788U JPH028037U (lv) | 1988-06-24 | 1988-06-24 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH028037U true JPH028037U (lv) | 1990-01-18 |
Family
ID=31308310
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8359788U Pending JPH028037U (lv) | 1988-06-24 | 1988-06-24 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH028037U (lv) |
-
1988
- 1988-06-24 JP JP8359788U patent/JPH028037U/ja active Pending