JPH0280244A - Laminate - Google Patents
LaminateInfo
- Publication number
- JPH0280244A JPH0280244A JP23297088A JP23297088A JPH0280244A JP H0280244 A JPH0280244 A JP H0280244A JP 23297088 A JP23297088 A JP 23297088A JP 23297088 A JP23297088 A JP 23297088A JP H0280244 A JPH0280244 A JP H0280244A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- film
- modified polypropylene
- acid
- foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 polypropylene Polymers 0.000 claims abstract description 55
- 239000004743 Polypropylene Substances 0.000 claims abstract description 51
- 229920001155 polypropylene Polymers 0.000 claims abstract description 51
- 239000011888 foil Substances 0.000 claims abstract description 27
- 239000002985 plastic film Substances 0.000 claims abstract description 19
- 229920006255 plastic film Polymers 0.000 claims abstract description 19
- 239000010408 film Substances 0.000 claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 239000002184 metal Substances 0.000 claims description 31
- 239000010409 thin film Substances 0.000 claims description 14
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 abstract description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 8
- 229920000098 polyolefin Polymers 0.000 abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011889 copper foil Substances 0.000 abstract description 4
- 238000010030 laminating Methods 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 abstract 2
- 239000007767 bonding agent Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 14
- 230000001070 adhesive effect Effects 0.000 description 14
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- FPIPGXGPPPQFEQ-OVSJKPMPSA-N all-trans-retinol Chemical compound OC\C=C(/C)\C=C\C=C(/C)\C=C\C1=C(C)CCCC1(C)C FPIPGXGPPPQFEQ-OVSJKPMPSA-N 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 241000414967 Colophon Species 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 208000037062 Polyps Diseases 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 239000011717 all-trans-retinol Substances 0.000 description 1
- 235000019169 all-trans-retinol Nutrition 0.000 description 1
- 150000008430 aromatic amides Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
本発明は、耐熱性プラスチックフィルムと金属箔とが積
層接着されてなる積層体に関し、主にフレキシブルプリ
ント基板として用いるのに適した積層体に関するもので
ある。The present invention relates to a laminate formed by laminating and bonding a heat-resistant plastic film and a metal foil, and mainly relates to a laminate suitable for use as a flexible printed circuit board.
【従来の技術及び発明が解決しようとする課題】従来よ
り、耐熱性フィルムと金属箔とをウレタン系接着剤やエ
ポキシ系接着剤等で接着させてなる積層体が、フレキシ
ブルプリント基板として用いられている。フレキシブル
プリント基板は電子機器内で折り曲げて収納されたり、
折り曲げ可能な電子機器内の折り曲げ部に収納されたり
している。従って、フレキシブルプリント基板は耐折り
曲げ性に優れていることや折り曲げによって金属箔と耐
熱性フィルムとが剥離しないこと等が要求されている。
しかるに、従来のフレキシブルプリント基板は折り曲げ
によって、金属箔と耐熱性フィルムとが剥離するという
ことがあった。これは、金属箔と耐熱性フィルムとの剥
離強度が低いからである。
そこで、本発明は金属箔と耐熱性フィルムとの剥離強度
を高め、フレキシブルプリント基板として好適な性能を
持つ積層体を提供することを目的とするものである。[Prior Art and Problems to be Solved by the Invention] Conventionally, a laminate made by bonding a heat-resistant film and a metal foil with a urethane adhesive or an epoxy adhesive has been used as a flexible printed circuit board. There is. Flexible printed circuit boards are often folded and stored inside electronic devices,
They are often stored in foldable parts of foldable electronic devices. Therefore, flexible printed circuit boards are required to have excellent bending resistance and to prevent the metal foil and heat-resistant film from peeling off when bent. However, when the conventional flexible printed circuit board is bent, the metal foil and the heat-resistant film may peel off. This is because the peel strength between the metal foil and the heat-resistant film is low. Therefore, an object of the present invention is to provide a laminate that increases the peel strength between the metal foil and the heat-resistant film and has suitable performance as a flexible printed circuit board.
即ち本発明は、耐熱性プラスチックフィルムの片面に、
少なくとも酸変性ポリプロピレン層を具備する樹脂層を
貼合したベースフィルムと、金属箔の片面に酸変性ポリ
プロピレン層が積層された金属薄膜とを、前記ベースフ
ィルムの酸変性ポリプロピレン層と前記金属薄膜の酸変
性ポリプロピレン層とを当接させ、前記ベースフィルム
と前記金属薄膜とを積層接着させてなることを特徴とす
る積層体に関するものである。
本発明に係る積層体は、ベースフィルム(1)と金属薄
膜(2)とがある特定の接着剤で積層接着されたもので
ある。
ベースフィルム(1)は耐熱性プラスチックフィルム(
3)と少なくとも酸変性ポリプロピレン層(4)を具備
する層とが接着剤(5)で貼合されたものである。
耐熱性プラスチックフィルム(3)としては、主に軟化
温度又は溶融温度が250°C以上のものが用いられ、
具体的にはフッ素樹脂系フィルム、ポリエチレンテレフ
タレート系フィルム、ポリピロメリット酸イミド系フィ
ルム、ポリビフェニルイミド系フィルム、ポリケトンイ
ミド系フィルム、ポリパラバン酸系フィルム、ポリアミ
ドイミド系フィルム、ポリエーテルエーテルケトン系フ
ィルム。
ポリエーテルサルフォン系フィルム、ポリエーテルイミ
ド系フィルム、ポリサルフォン系フィルム。
ポリフェニレンサルファイド系フィルム、 芳香族アミ
ド系フィルム、ボリアリレート系フィルム。
ポリエチレンナフレート系フィルム ポリブチレンナフ
レート系フィルム等が用いられる。
少なくとも酸変性ポリプロピレン層(4)を具備する層
としては、図示の如く酸変性ポリプロピレン層(4)の
みよりなるものであってもよいし、酸変性ポリプロピレ
ン層(4)とポリオレフィン層やポリエステル層等等が
積層された多層構造の層であってもよい。多層構造の例
としては、酸変性ポリプロピレン層(4)とポリオレフ
ィン層とよりなる共押出二層フィル11やポリオレフィ
ン層の両面に酸変性ポリプロピレン層(4)を配置した
共押出三層フィルム等が挙げられる。多層構造のものを
用いた場合には、酸変性ポリプロピレン層(4)が最上
層、即ち露出面を形成しなければならない。
ここで、酸変性ポリプロピレンとは、ポリプロピレンの
側鎖にジカルボン酸を付加したものであり、一般的には
側鎖にマレイン酸を付加させたものが用いられる。具体
的には、市販品である三井石油化学工業■製ユニストー
ルR100,R12OR200又は東洋インキ製造■製
すオフレックス4000等が用いられる。酸変性ポリプ
ロピレンはフィルムの形態であってもよいし、オルガノ
ゾル等の溶液状であってもよい。ベースフィルム(1)
に用いられる酸変性ポリプロピレン層(4)は、一般的
にフィルムの形態のまま適用される場合が多い。しかし
、他のポリオレフィン層等に酸変性ポリプロピレンを溶
液状で塗布、乾燥して酸変性ポリプロピレン層(4)と
してもよいので、溶液状で用いても差し支えない。
この耐熱性プラスチックフィルム(3)と少なくとも酸
変性ポリプロピレンN(4)を具備する層とが貼合され
てベースフィルム(1)となる。貼合手段としては、一
般的には接着剤(5)を用いて行われる。接着剤(5)
としては、ウレタン系接着剤、エポキシ系接着剤、アク
リル系接着剤、フェノール系接着剤等が用いられる。熱
圧着で貼合しうる場合には、少なくとも酸変性ポリプロ
ピレン層(4)を具備する層の熱可塑性成分を用いて熱
接着すればよい。例えば、酸変性ポリプロピレン層(4
)のみを用いる場合には、この層(4)と耐熱性プラス
チンクフィルム層(3)とを熱圧着して貼合すればよい
。また、酸変性ポリプロピレン層(4)と他のポリオレ
フィン層との多層構造の場合には、ポリオレフィン層と
耐熱性プラスチックフィルム(3)とを熱圧着して貼合
すればよい。
金属薄膜(2)は、金属箔(6)に酸変性ポリプロピレ
ン層(7)を積層したものである。
金属箔(6)としては、アルミニウム箔、銅箔、錫箔、
鉄箔等が用いられる。特に、フレキシブルプリント基板
として適用する場合には、電気抵抗の小さい銅箔が好ま
しい。
酸変性ポリプロピレン層(7)における、酸変性ポリプ
ロピレンは前記のベースフィルムに用いたのと同様のも
のが用いられる。金属箔(6)上への積層方法としては
、一般的に酸変性ポリプロピレンのオルガノゾルを溶液
状で金属箔(6)に塗布し、乾燥させて皮膜を得、それ
を酸変性ポリプロピレン層(力とする。また、酸変性ポ
リプロピレンのフィルムを金属’;Is (6)に熱圧
着して酸変性ポリプロピレン層(7)とすることもでき
る。
このようにして得られた、ベースフィルム(1)と金属
薄膜(2)とを積層接着する。ベースフィルム(1)の
−表面には酸変性ポリプロピレン層(4)が形成されて
おり、金属薄膜(2)の−表面にも酸変性ポリプロピレ
ン層(7)が形成されている。ここで、ベースフィルム
(1)の酸変性ポリプロピレンN(4)と金属薄膜(2
)の酸変性ポリプロピレン層(7)とを当接して、熱圧
着することにより、ベースフィルム(1)と金属薄膜(
2)とを積層接着することができる。
従って、本発明に係る積層体は、耐熱性プラスチックフ
ィルム(3)、所望により接着剤(5)、少なくとも酸
変性ポリプロピレン層(4)を具備する層、酸変性ポリ
プロピレン層(7)、金属箔(6)の順で積層されてな
るものである。That is, in the present invention, on one side of a heat-resistant plastic film,
A base film laminated with a resin layer having at least an acid-modified polypropylene layer, and a metal thin film having an acid-modified polypropylene layer laminated on one side of a metal foil, are bonded to each other. The present invention relates to a laminate characterized in that the base film and the metal thin film are laminated and bonded by contacting with a modified polypropylene layer. The laminate according to the present invention is one in which a base film (1) and a metal thin film (2) are laminated and bonded with a certain adhesive. The base film (1) is a heat-resistant plastic film (
3) and a layer comprising at least an acid-modified polypropylene layer (4) are bonded together with an adhesive (5). As the heat-resistant plastic film (3), those having a softening temperature or melting temperature of 250°C or higher are mainly used,
Specifically, fluororesin films, polyethylene terephthalate films, polypyromellitic acid imide films, polybiphenylimide films, polyketone imide films, polyparabanic acid films, polyamideimide films, and polyether ether ketone films. Polyether sulfone film, polyetherimide film, polysulfone film. Polyphenylene sulfide film, aromatic amide film, polyarylate film. Polyethylene naphlate film, polybutylene naphlate film, etc. are used. The layer comprising at least the acid-modified polypropylene layer (4) may be composed of only the acid-modified polypropylene layer (4) as shown in the figure, or may be a layer including the acid-modified polypropylene layer (4) and a polyolefin layer, a polyester layer, etc. The layer may have a multi-layer structure in which layers such as the like are laminated. Examples of multilayer structures include a coextruded two-layer film 11 consisting of an acid-modified polypropylene layer (4) and a polyolefin layer, and a co-extruded three-layer film in which acid-modified polypropylene layers (4) are arranged on both sides of the polyolefin layer. It will be done. If a multilayer structure is used, the acid-modified polypropylene layer (4) must form the top layer, ie the exposed surface. Here, the acid-modified polypropylene is polypropylene with dicarboxylic acid added to the side chain, and generally used is polypropylene with maleic acid added to the side chain. Specifically, commercially available products such as UNISTOL R100 and R12OR200 manufactured by Mitsui Petrochemical Industries (2) or OFLEX 4000 manufactured by Toyo Ink Manufacturing (2) are used. The acid-modified polypropylene may be in the form of a film or in the form of a solution such as an organosol. Base film (1)
The acid-modified polypropylene layer (4) used for this is generally applied in the form of a film in many cases. However, since the acid-modified polypropylene layer (4) may be formed by applying acid-modified polypropylene in a solution form to other polyolefin layers and drying it, there is no problem in using the acid-modified polypropylene layer (4). This heat-resistant plastic film (3) and a layer comprising at least acid-modified polypropylene N (4) are bonded together to form a base film (1). As a bonding means, an adhesive (5) is generally used. Adhesive (5)
As the adhesive, urethane adhesive, epoxy adhesive, acrylic adhesive, phenolic adhesive, etc. are used. When bonding can be carried out by thermocompression bonding, thermal bonding may be carried out using the thermoplastic component of the layer comprising at least the acid-modified polypropylene layer (4). For example, an acid-modified polypropylene layer (4
), this layer (4) and the heat-resistant plastic film layer (3) may be bonded together by thermocompression bonding. Furthermore, in the case of a multilayer structure consisting of an acid-modified polypropylene layer (4) and another polyolefin layer, the polyolefin layer and the heat-resistant plastic film (3) may be bonded together by thermocompression bonding. The metal thin film (2) is a metal foil (6) laminated with an acid-modified polypropylene layer (7). As the metal foil (6), aluminum foil, copper foil, tin foil,
Iron foil etc. are used. In particular, when used as a flexible printed circuit board, copper foil with low electrical resistance is preferred. The acid-modified polypropylene in the acid-modified polypropylene layer (7) is the same as that used for the base film. The method for laminating on the metal foil (6) is generally to apply an organosol of acid-modified polypropylene in the form of a solution to the metal foil (6), dry it to obtain a film, and apply it to the acid-modified polypropylene layer (with force and In addition, the acid-modified polypropylene layer (7) can be formed by thermocompression bonding the acid-modified polypropylene film to the metal';Is (6).The base film (1) thus obtained and the metal The thin film (2) is laminated and bonded. An acid-modified polypropylene layer (4) is formed on the surface of the base film (1), and an acid-modified polypropylene layer (7) is also formed on the surface of the metal thin film (2). Here, the acid-modified polypropylene N (4) of the base film (1) and the metal thin film (2) are formed.
) and the acid-modified polypropylene layer (7) of the base film (1) and the metal thin film (
2) can be laminated and bonded. Therefore, the laminate according to the present invention includes a heat-resistant plastic film (3), an adhesive (5) if desired, a layer comprising at least an acid-modified polypropylene layer (4), an acid-modified polypropylene layer (7), a metal foil ( 6) are laminated in this order.
厚さ188μの耐熱性プラスチックフィルム(ポリエチ
レンテレフタレート系フィルム、東し■製、商品名ルミ
ラーTタイプ)と酸変性ポリプロピレンフィルム(東七
口化学■製、商品名アトマーQE305C)とをウレタ
ン系接着剤(東洋モートン−製、商品名アトコート76
P−1)で貼合し、耐熱性プラスチックフィルム、接着
剤、酸変性ポリプロピレン層の順で積層されたベースフ
ィルムを作成した。
また、厚さ30μのアルミニウム箔上に、酸変性ポリプ
bピレンのオルガノゾル(三井石油化学工業(m製ユニ
ストール)をロールコータ−で塗布シ、乾燥して厚さ2
μの酸変性ポリプロピレンよりなる塗膜を得、アルミニ
ウム箔と酸変性ポリプロピレン層とが積層された金属薄
膜を得た。
上記のベースフィルムと金属箔とを、各酸変性ポリプロ
ピレン層が当接する如く積層して、温度200°C1圧
力1kg/alIN、時間1秒の条件で熱圧着して積層
体を得た。
この積層体を15mmの短冊状に裁断し、アルミニウム
箔と耐熱性プラスチンクフィルムとを把持して、2+1
離強度を測定したところ、両者が剥離する前にアルミニ
ウム箔が損傷し、剥離不能であった。
比較のため、実施例で用いた耐熱性プラスチックフィル
ムとアルミニウム箔をウレタン系接着剤で接着した積層
tオを、上記と同一の条件で剥離試験を行ったところ、
剥離強度は0.7 kg715m+n巾であった。
従って、実施例に係る積層体は剥離強度が高く、フレキ
シブルプリント基板として用いて折り曲げられても、耐
熱性プラスチックフィルムとアルミニウム箔とが剥離し
にくいことが判る。A 188μ thick heat-resistant plastic film (polyethylene terephthalate film, manufactured by Toshi ■, trade name: Lumirror T type) and an acid-modified polypropylene film (manufactured by Higashi Shichiguchi Chemical ■, trade name: Atmer QE305C) were bonded together using a urethane adhesive ( Manufactured by Toyo Morton, product name Atcoat 76
P-1) to create a base film in which a heat-resistant plastic film, an adhesive, and an acid-modified polypropylene layer were laminated in this order. In addition, an organosol of acid-modified polyp b-pyrene (Mitsui Petrochemical Industries (M UniStall)) was applied onto an aluminum foil with a thickness of 30 μm using a roll coater, and dried to a thickness of 2 μm.
A coating film made of μ acid-modified polypropylene was obtained, and a metal thin film in which an aluminum foil and an acid-modified polypropylene layer were laminated was obtained. The above base film and metal foil were laminated so that each acid-modified polypropylene layer was in contact with each other, and thermocompression bonded at a temperature of 200° C., a pressure of 1 kg/alin, and a time of 1 second to obtain a laminate. Cut this laminate into 15 mm strips, hold aluminum foil and heat-resistant plastic film, and
When the peeling strength was measured, it was found that the aluminum foil was damaged before both were peeled off and could not be peeled off. For comparison, a peel test was conducted on the laminated t-shirt made by bonding the heat-resistant plastic film and aluminum foil used in the example with a urethane adhesive under the same conditions as above.
The peel strength was 0.7 kg 715 m+n width. Therefore, it can be seen that the laminate according to the example has high peel strength, and the heat-resistant plastic film and aluminum foil are difficult to peel off even when used as a flexible printed circuit board and bent.
以上説明したように、本発明に係る積層体は、耐熱性プ
ラスチックフィルムを具備するベースフィルムと金属箔
を具備する金属薄膜とが、各々の酸変性ポリプロピレン
層を介して積層接着されているので、接着強度が高く、
従って積層体の剥離強度が高いという効果を奏する。
依って、本発明に係る積層体をフレキシブルプリント基
板として用いた場合には、繰り返し折り曲げられても、
耐熱性プラスチックフィルムと金属箔とが剥離しにくく
、電子機器の寿命を長くするという効果を奏するもので
ある。As explained above, in the laminate according to the present invention, the base film including the heat-resistant plastic film and the metal thin film including the metal foil are laminated and bonded via the respective acid-modified polypropylene layers. High adhesive strength
Therefore, the effect is that the peel strength of the laminate is high. Therefore, when the laminate according to the present invention is used as a flexible printed circuit board, even if it is repeatedly bent,
The heat-resistant plastic film and the metal foil are difficult to peel off, and this has the effect of extending the life of the electronic device.
図面は本発明の一例に係る積層体の模式的横断面図であ
る。
(1)・・・ベースフィルム、(2)・・・金属薄膜(
3)・・・耐熱性プラスチックフィルム。
(4)・・・酸変性ポリプロピレン層、(6)・・・金
8’4(7)・・・酸変性ポリプロピレン層
実用新案登録出願人 日本製箔株式会社代理人 弁理
士 奥付 茂樹The drawing is a schematic cross-sectional view of a laminate according to an example of the present invention. (1)...Base film, (2)...Metal thin film (
3)...Heat-resistant plastic film. (4)... Acid-modified polypropylene layer, (6)... Gold 8'4 (7)... Acid-modified polypropylene layer Utility model registration applicant Nippon Foil Co., Ltd. Agent Patent attorney Shigeki Colophon
Claims (1)
性ポリプロピレン層を具備する樹脂層を貼合したベース
フィルムと、金属箔の片面に酸変性ポリプロピレン層が
積層された金属薄膜とを、前記ベースフィルムの酸変性
ポリプロピレン層と前記金属薄膜の酸変性ポリプロピレ
ン層とを当接させ、前記ベースフィルムと前記金属薄膜
とを積層接着させてなることを特徴とする積層体。A base film in which a resin layer having at least an acid-modified polypropylene layer is laminated on one side of a heat-resistant plastic film, and a metal thin film in which an acid-modified polypropylene layer is laminated on one side of a metal foil are combined. A laminate, characterized in that the polypropylene layer and the acid-modified polypropylene layer of the metal thin film are brought into contact with each other, and the base film and the metal thin film are laminated and bonded.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23297088A JP2634873B2 (en) | 1988-09-16 | 1988-09-16 | Laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23297088A JP2634873B2 (en) | 1988-09-16 | 1988-09-16 | Laminate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0280244A true JPH0280244A (en) | 1990-03-20 |
JP2634873B2 JP2634873B2 (en) | 1997-07-30 |
Family
ID=16947736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23297088A Expired - Fee Related JP2634873B2 (en) | 1988-09-16 | 1988-09-16 | Laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2634873B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016063019A (en) * | 2014-09-17 | 2016-04-25 | 凸版印刷株式会社 | Sealing material with electric wiring for back contact type battery module and back contact type battery module |
JP2017017227A (en) * | 2015-07-02 | 2017-01-19 | パナソニックIpマネジメント株式会社 | Solar battery module |
-
1988
- 1988-09-16 JP JP23297088A patent/JP2634873B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016063019A (en) * | 2014-09-17 | 2016-04-25 | 凸版印刷株式会社 | Sealing material with electric wiring for back contact type battery module and back contact type battery module |
JP2017017227A (en) * | 2015-07-02 | 2017-01-19 | パナソニックIpマネジメント株式会社 | Solar battery module |
Also Published As
Publication number | Publication date |
---|---|
JP2634873B2 (en) | 1997-07-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3788917B2 (en) | Method for manufacturing flexible multilayer printed circuit board | |
KR0168034B1 (en) | A multilayer film and laminate for use in producing printed circuit boards | |
JP2009105446A (en) | Method for manufacturing multilayer printed wiring board | |
KR20010105375A (en) | Laminate for multi-layer printed circuit | |
JP2790708B2 (en) | Process for protecting protected conductive oil and electrodeposited metal oil during processing | |
CN111642068A (en) | RCC substrate and multi-layer laminated flexible board | |
US5583320A (en) | Reinforcement for flexible printed circuit board and reinforced flexible printed circuit board | |
JPH0280244A (en) | Laminate | |
JP4231227B2 (en) | Method for producing heat-resistant flexible laminate | |
JPH098457A (en) | Manufacture of flex and rigid wiring board | |
JP2008251941A (en) | Manufacturing method of flexible copper-clad laminate using extra-thin copper foil with carrier copper foil | |
JP4916057B2 (en) | Protective film for FPC, resin conductor foil laminate with protective film for FPC, and method for producing flexible printed wiring board using the same | |
JP2721570B2 (en) | Multi-layer flexible printed wiring board | |
JP2005158974A (en) | Method for manufacturing multi-layer printed wiring board and sheet material for manufacturing the same | |
JPH07202417A (en) | Flexible printed wiring board | |
JPS61224492A (en) | Flexible printed circuit board | |
JPH084285Y2 (en) | Double-sided coverlay film for multilayering printed circuit boards | |
JP3305633B2 (en) | IC card manufacturing method | |
JP3943735B2 (en) | Manufacturing method of build-up type multilayer printed wiring board | |
JP4643861B2 (en) | Method for producing flexible laminate | |
JPS61134246A (en) | Base board for printed wiring board | |
JP2006278688A (en) | Cushioning material, and method for manufacturing wiring plate | |
JPS63289891A (en) | Printed circuit board material | |
JP3574092B2 (en) | Manufacturing method of heat resistant flexible laminate | |
JP4081874B2 (en) | Double-sided metal laminate |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |