JPH0279U - - Google Patents
Info
- Publication number
- JPH0279U JPH0279U JP7492488U JP7492488U JPH0279U JP H0279 U JPH0279 U JP H0279U JP 7492488 U JP7492488 U JP 7492488U JP 7492488 U JP7492488 U JP 7492488U JP H0279 U JPH0279 U JP H0279U
- Authority
- JP
- Japan
- Prior art keywords
- members
- lifting mechanism
- top surface
- hanging tool
- tensile force
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003028 elevating effect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 3
Description
第１図は本考案の原理説明図、第２図は本考案
による一実施例の説明図、第３図は従来の説明図
で、ａは正面図、ｂは要部側面図を示す。
図において、１はテーブル、２は昇降機構、３
は押圧機構、４は荷重計、５は第１の部材、６は
第２の部材、７は密着部、１３は吊具を示す。
FIG. 1 is an explanatory diagram of the principle of the present invention, FIG. 2 is an explanatory diagram of an embodiment according to the present invention, and FIG. 3 is an explanatory diagram of a conventional device, in which a shows a front view and b shows a side view of essential parts. In the figure, 1 is a table, 2 is a lifting mechanism, and 3 is a table.
4 is a pressing mechanism, 4 is a load cell, 5 is a first member, 6 is a second member, 7 is a contact portion, and 13 is a hanging tool.
Claims (1)
る昇降機構２と、水平方向に押圧を行う押圧機構
３と、該昇降機構２の引張力Ｆを計測する荷重計
４とを備え、密着された第１と第２の部材５，６
を該テーブル１の上面に積載し、該押圧機構３に
よつて該第１と第２の部材５，６の密着部７にス
ラスト力Ｓを作用させると共に、該昇降機構２の
上昇により該荷重計４による所定の引張力Ｆを作
用させることで該密着部７を引き離すリムーブ機
において、 前記第１と第２の部材のいずれか一方に係止さ
れる吊具１３を設け、該吊具１３と、前記昇降機
構２との間に荷重計４が連結されるように構成す
ることを特徴とするリムーブ機。[Claims for Utility Model Registration] A lifting mechanism 2 that moves up and down vertically with respect to the top surface of the table 1, a pressing mechanism 3 that presses in the horizontal direction, and a load meter that measures the tensile force F of the lifting mechanism 2. 4, and the first and second members 5 and 6 that are in close contact with each other.
is loaded on the top surface of the table 1, a thrust force S is applied to the contact portion 7 of the first and second members 5 and 6 by the pressing mechanism 3, and the load is lifted by raising the lifting mechanism 2. In the removal machine which separates the adhesion part 7 by applying a predetermined tensile force F of 4 in total, a hanging tool 13 that is latched to either one of the first and second members is provided, and the hanging tool 13 A removing machine characterized in that a load meter 4 is connected between the elevating mechanism 2 and the elevating mechanism 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7492488U JPH0279U (en) | 1988-06-06 | 1988-06-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7492488U JPH0279U (en) | 1988-06-06 | 1988-06-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279U true JPH0279U (en) | 1990-01-05 |
Family
ID=31300007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7492488U Pending JPH0279U (en) | 1988-06-06 | 1988-06-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101032173B1 (en) * | 2009-06-16 | 2011-05-02 | ( 주 ) 화신 | Kingpin assembly device for vehicle |
| CN102347241A (en) * | 2010-07-28 | 2012-02-08 | 富士通株式会社 | Heat sink device and method of repairing semiconductor device |
-
1988
- 1988-06-06 JP JP7492488U patent/JPH0279U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101032173B1 (en) * | 2009-06-16 | 2011-05-02 | ( 주 ) 화신 | Kingpin assembly device for vehicle |
| CN102347241A (en) * | 2010-07-28 | 2012-02-08 | 富士通株式会社 | Heat sink device and method of repairing semiconductor device |
| JP2012033523A (en) * | 2010-07-28 | 2012-02-16 | Fujitsu Ltd | Heat sink separation method and heat sink |
| US9117788B2 (en) | 2010-07-28 | 2015-08-25 | Fujitsu Limited | Heat sink device and method of repairing semiconductor device |
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