JPH02792U - - Google Patents
Info
- Publication number
- JPH02792U JPH02792U JP1988078357U JP7835788U JPH02792U JP H02792 U JPH02792 U JP H02792U JP 1988078357 U JP1988078357 U JP 1988078357U JP 7835788 U JP7835788 U JP 7835788U JP H02792 U JPH02792 U JP H02792U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- cooling device
- inner flange
- flange
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- 238000005219 brazing Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078357U JPH02792U (enExample) | 1988-06-15 | 1988-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988078357U JPH02792U (enExample) | 1988-06-15 | 1988-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02792U true JPH02792U (enExample) | 1990-01-05 |
Family
ID=31303286
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988078357U Pending JPH02792U (enExample) | 1988-06-15 | 1988-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02792U (enExample) |
-
1988
- 1988-06-15 JP JP1988078357U patent/JPH02792U/ja active Pending
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