JPH0279052U - - Google Patents
Info
- Publication number
- JPH0279052U JPH0279052U JP15953788U JP15953788U JPH0279052U JP H0279052 U JPH0279052 U JP H0279052U JP 15953788 U JP15953788 U JP 15953788U JP 15953788 U JP15953788 U JP 15953788U JP H0279052 U JPH0279052 U JP H0279052U
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- side wall
- parallel
- exterior resin
- external leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15953788U JPH0279052U (de) | 1988-12-07 | 1988-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15953788U JPH0279052U (de) | 1988-12-07 | 1988-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279052U true JPH0279052U (de) | 1990-06-18 |
Family
ID=31440838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15953788U Pending JPH0279052U (de) | 1988-12-07 | 1988-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279052U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004179A (ja) * | 2010-06-14 | 2012-01-05 | Mitsubishi Electric Corp | 半導体装置、半導体装置の実装方法、および実装用治具 |
-
1988
- 1988-12-07 JP JP15953788U patent/JPH0279052U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004179A (ja) * | 2010-06-14 | 2012-01-05 | Mitsubishi Electric Corp | 半導体装置、半導体装置の実装方法、および実装用治具 |