JPH0279052U - - Google Patents
Info
- Publication number
- JPH0279052U JPH0279052U JP15953788U JP15953788U JPH0279052U JP H0279052 U JPH0279052 U JP H0279052U JP 15953788 U JP15953788 U JP 15953788U JP 15953788 U JP15953788 U JP 15953788U JP H0279052 U JPH0279052 U JP H0279052U
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- side wall
- parallel
- exterior resin
- external leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
Description
第１図乃至第４図はこの考案に係るフラツトパ
ツケージ型半導体装置を示し、第１図は平面図、
第２図は部分断面正面図、第３図は要部拡大斜視
図、第４図は要部拡大平面図である。第５図及び
第６図は従来のフラツトパツケージ型半導体装置
を示し、第５図は平面図、第６図は要部拡大斜視
図である。
１……外装樹脂材、１ａ……側壁、１ｂ……底
面、１ｃ……擁壁部、２……外部リード、２ａ…
…中間部、２ｂ……遊端部。
1 to 4 show a flat package type semiconductor device according to this invention, and FIG. 1 is a plan view;
FIG. 2 is a partially sectional front view, FIG. 3 is an enlarged perspective view of the main part, and FIG. 4 is an enlarged plan view of the main part. 5 and 6 show a conventional flat package type semiconductor device, with FIG. 5 being a plan view and FIG. 6 being an enlarged perspective view of the main parts. DESCRIPTION OF SYMBOLS 1... Exterior resin material, 1a... Side wall, 1b... Bottom surface, 1c... Retaining wall part, 2... External lead, 2a...
...middle part, 2b...free end part.
Claims (1)
外部リードの中間部を、側壁に平行に折曲して直
立させ、外部リードの遊端部を外装樹脂材の底面
と平行外方へ折曲したフラツトパツケージ型半導
体装置において、 外部リードの少なくとも中間部の両側に外装樹
脂材の側壁から擁壁部を突設したことを特徴とす
るフラツトパツケージ型半導体装置。[Claim for Utility Model Registration] The middle portions of a large number of external leads led out in parallel from the side wall of the exterior resin material are bent parallel to the side wall to stand upright, and the free ends of the external leads are connected to the side wall of the exterior resin material. A flat package type semiconductor device bent outward in parallel with the bottom surface, characterized in that retaining walls are provided on both sides of at least the middle portion of the external lead protruding from the side walls of the exterior resin material. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15953788U JPH0279052U (en) | 1988-12-07 | 1988-12-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15953788U JPH0279052U (en) | 1988-12-07 | 1988-12-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0279052U true JPH0279052U (en) | 1990-06-18 |
Family
ID=31440838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15953788U Pending JPH0279052U (en) | 1988-12-07 | 1988-12-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0279052U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004179A (en) * | 2010-06-14 | 2012-01-05 | Mitsubishi Electric Corp | Semiconductor device, mounting method of the same, and mounting tool |
-
1988
- 1988-12-07 JP JP15953788U patent/JPH0279052U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012004179A (en) * | 2010-06-14 | 2012-01-05 | Mitsubishi Electric Corp | Semiconductor device, mounting method of the same, and mounting tool |