JPH0276844U - - Google Patents
Info
- Publication number
- JPH0276844U JPH0276844U JP15674688U JP15674688U JPH0276844U JP H0276844 U JPH0276844 U JP H0276844U JP 15674688 U JP15674688 U JP 15674688U JP 15674688 U JP15674688 U JP 15674688U JP H0276844 U JPH0276844 U JP H0276844U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- semiconductor device
- heat dissipation
- dissipation fin
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15674688U JPH0276844U (sk) | 1988-11-30 | 1988-11-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15674688U JPH0276844U (sk) | 1988-11-30 | 1988-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0276844U true JPH0276844U (sk) | 1990-06-13 |
Family
ID=31435562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15674688U Pending JPH0276844U (sk) | 1988-11-30 | 1988-11-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0276844U (sk) |
-
1988
- 1988-11-30 JP JP15674688U patent/JPH0276844U/ja active Pending