JPH0276006U - - Google Patents
Info
- Publication number
- JPH0276006U JPH0276006U JP15622988U JP15622988U JPH0276006U JP H0276006 U JPH0276006 U JP H0276006U JP 15622988 U JP15622988 U JP 15622988U JP 15622988 U JP15622988 U JP 15622988U JP H0276006 U JPH0276006 U JP H0276006U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pin
- removal device
- resin burr
- burr removal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 2
- 230000001154 acute effect Effects 0.000 claims 1
Landscapes
- Nonmetal Cutting Devices (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988156229U JP2514858Y2 (ja) | 1988-11-30 | 1988-11-30 | 樹脂バリ除去装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988156229U JP2514858Y2 (ja) | 1988-11-30 | 1988-11-30 | 樹脂バリ除去装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0276006U true JPH0276006U (US20110009641A1-20110113-C00116.png) | 1990-06-11 |
| JP2514858Y2 JP2514858Y2 (ja) | 1996-10-23 |
Family
ID=31434583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988156229U Expired - Lifetime JP2514858Y2 (ja) | 1988-11-30 | 1988-11-30 | 樹脂バリ除去装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2514858Y2 (US20110009641A1-20110113-C00116.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100801150B1 (ko) * | 2006-06-26 | 2008-02-11 | (주)엠아이반도체 | 패키지된 반도체 및 전자부품의 몰딩수지 제거장치 및몰딩수지 제거방법 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5167357A (ja) * | 1974-12-07 | 1976-06-10 | Toyoda Gosei Kk | Tenzopurasuchitsukuhagurumano barijokyohoho |
| JPS58124255A (ja) * | 1982-01-21 | 1983-07-23 | Toshiba Corp | 半導体装置のリ−ドフレ−ム |
| JPS63107521A (ja) * | 1986-10-24 | 1988-05-12 | Hitachi Ltd | ばり取り装置 |
| JPS6450454A (en) * | 1987-08-21 | 1989-02-27 | Hitachi Ltd | Manufacture of lead frame and semiconductor device |
-
1988
- 1988-11-30 JP JP1988156229U patent/JP2514858Y2/ja not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5167357A (ja) * | 1974-12-07 | 1976-06-10 | Toyoda Gosei Kk | Tenzopurasuchitsukuhagurumano barijokyohoho |
| JPS58124255A (ja) * | 1982-01-21 | 1983-07-23 | Toshiba Corp | 半導体装置のリ−ドフレ−ム |
| JPS63107521A (ja) * | 1986-10-24 | 1988-05-12 | Hitachi Ltd | ばり取り装置 |
| JPS6450454A (en) * | 1987-08-21 | 1989-02-27 | Hitachi Ltd | Manufacture of lead frame and semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2514858Y2 (ja) | 1996-10-23 |
