JPH0275747U - - Google Patents
Info
- Publication number
- JPH0275747U JPH0275747U JP15576088U JP15576088U JPH0275747U JP H0275747 U JPH0275747 U JP H0275747U JP 15576088 U JP15576088 U JP 15576088U JP 15576088 U JP15576088 U JP 15576088U JP H0275747 U JPH0275747 U JP H0275747U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- leads
- integrated circuit
- lead
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15576088U JPH0275747U (da) | 1988-11-29 | 1988-11-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15576088U JPH0275747U (da) | 1988-11-29 | 1988-11-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275747U true JPH0275747U (da) | 1990-06-11 |
Family
ID=31433671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15576088U Pending JPH0275747U (da) | 1988-11-29 | 1988-11-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275747U (da) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04336459A (ja) * | 1991-05-13 | 1992-11-24 | Fuji Plant Kogyo Kk | バリ取り不要のリードフレーム、およびそのリードフレームへの樹脂モールド方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151933A (ja) * | 1984-08-22 | 1986-03-14 | Hitachi Ltd | 半導体装置の製法 |
-
1988
- 1988-11-29 JP JP15576088U patent/JPH0275747U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6151933A (ja) * | 1984-08-22 | 1986-03-14 | Hitachi Ltd | 半導体装置の製法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04336459A (ja) * | 1991-05-13 | 1992-11-24 | Fuji Plant Kogyo Kk | バリ取り不要のリードフレーム、およびそのリードフレームへの樹脂モールド方法 |