JPH0275746U - - Google Patents

Info

Publication number
JPH0275746U
JPH0275746U JP15474988U JP15474988U JPH0275746U JP H0275746 U JPH0275746 U JP H0275746U JP 15474988 U JP15474988 U JP 15474988U JP 15474988 U JP15474988 U JP 15474988U JP H0275746 U JPH0275746 U JP H0275746U
Authority
JP
Japan
Prior art keywords
flat package
laminated
terminal mounting
mounting electrode
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15474988U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15474988U priority Critical patent/JPH0275746U/ja
Publication of JPH0275746U publication Critical patent/JPH0275746U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP15474988U 1988-11-30 1988-11-30 Pending JPH0275746U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15474988U JPH0275746U (ko) 1988-11-30 1988-11-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15474988U JPH0275746U (ko) 1988-11-30 1988-11-30

Publications (1)

Publication Number Publication Date
JPH0275746U true JPH0275746U (ko) 1990-06-11

Family

ID=31431759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15474988U Pending JPH0275746U (ko) 1988-11-30 1988-11-30

Country Status (1)

Country Link
JP (1) JPH0275746U (ko)

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