JPH0275733U - - Google Patents
Info
- Publication number
- JPH0275733U JPH0275733U JP15431088U JP15431088U JPH0275733U JP H0275733 U JPH0275733 U JP H0275733U JP 15431088 U JP15431088 U JP 15431088U JP 15431088 U JP15431088 U JP 15431088U JP H0275733 U JPH0275733 U JP H0275733U
- Authority
- JP
- Japan
- Prior art keywords
- cutter blade
- adhesive tape
- semiconductor wafer
- cuts
- dicing tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15431088U JPH073633Y2 (ja) | 1988-11-29 | 1988-11-29 | ダイシングテープカット装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15431088U JPH073633Y2 (ja) | 1988-11-29 | 1988-11-29 | ダイシングテープカット装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0275733U true JPH0275733U (ro) | 1990-06-11 |
| JPH073633Y2 JPH073633Y2 (ja) | 1995-01-30 |
Family
ID=31430926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15431088U Expired - Lifetime JPH073633Y2 (ja) | 1988-11-29 | 1988-11-29 | ダイシングテープカット装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073633Y2 (ro) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010005781A (ja) * | 2008-05-28 | 2010-01-14 | Shin Etsu Polymer Co Ltd | 半導体ウェーハの支持テープ用カッタ |
| JP2011165822A (ja) * | 2010-02-08 | 2011-08-25 | Hitachi Chem Co Ltd | 半導体ウェハ加工用フィルム及びこのフィルムを用いた半導体チップの製造方法 |
-
1988
- 1988-11-29 JP JP15431088U patent/JPH073633Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010005781A (ja) * | 2008-05-28 | 2010-01-14 | Shin Etsu Polymer Co Ltd | 半導体ウェーハの支持テープ用カッタ |
| JP2011165822A (ja) * | 2010-02-08 | 2011-08-25 | Hitachi Chem Co Ltd | 半導体ウェハ加工用フィルム及びこのフィルムを用いた半導体チップの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH073633Y2 (ja) | 1995-01-30 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |