JPH0275729U - - Google Patents
Info
- Publication number
- JPH0275729U JPH0275729U JP15500688U JP15500688U JPH0275729U JP H0275729 U JPH0275729 U JP H0275729U JP 15500688 U JP15500688 U JP 15500688U JP 15500688 U JP15500688 U JP 15500688U JP H0275729 U JPH0275729 U JP H0275729U
- Authority
- JP
- Japan
- Prior art keywords
- jig
- chip thermistor
- pellet
- monitoring
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims description 3
- 238000011156 evaluation Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000012544 monitoring process Methods 0.000 claims 2
- 238000009413 insulation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Description
第１図は本考案の第１の実施例の外観図、第２
図は第２の実施例の外観図、第３図は従来のペレ
ツト特性評価治具の一例の外観図である。
１……半導体素子、２……チツプサーミスタ、
３……絶縁ブロツク、４……電極ブロツク、５…
…モニタ電極、６……測定電極。
Figure 1 is an external view of the first embodiment of the present invention;
The figure is an external view of the second embodiment, and FIG. 3 is an external view of an example of a conventional pellet characteristic evaluation jig. 1... Semiconductor element, 2... Chip thermistor,
3... Insulation block, 4... Electrode block, 5...
...Monitor electrode, 6...Measurement electrode.
Claims (1)
レツト特性評価治具において、治具に温度モニタ
用のチツプサーミスタを設置し、そのチツプサー
ミスタ抵抗値のモニタ用電極を設けたことを特徴
とするペレツト特性評価治具。 A pellet characteristic evaluation jig for evaluating a semiconductor element in a pellet state, characterized in that a chip thermistor for temperature monitoring is installed in the jig, and an electrode for monitoring the resistance value of the chip thermistor is provided. jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15500688U JPH0275729U (en) | 1988-11-28 | 1988-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15500688U JPH0275729U (en) | 1988-11-28 | 1988-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0275729U true JPH0275729U (en) | 1990-06-11 |
Family
ID=31432241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15500688U Pending JPH0275729U (en) | 1988-11-28 | 1988-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0275729U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015137023A1 (en) * | 2014-03-11 | 2015-09-17 | 新東工業株式会社 | Inspection system for device to be tested, and method for operating inspection system for device to be tested |
| WO2016117105A1 (en) * | 2015-01-23 | 2016-07-28 | 三菱電機株式会社 | Semiconductor device evaluation jig, semiconductor device evaluation apparatus, and semiconductor device evaluation method |
-
1988
- 1988-11-28 JP JP15500688U patent/JPH0275729U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015137023A1 (en) * | 2014-03-11 | 2015-09-17 | 新東工業株式会社 | Inspection system for device to be tested, and method for operating inspection system for device to be tested |
| JPWO2015137023A1 (en) * | 2014-03-11 | 2017-04-06 | 新東工業株式会社 | Device under test inspection system and operation method thereof |
| US10161990B2 (en) | 2014-03-11 | 2018-12-25 | Sintokogio, Ltd. | Inspection system for device to be tested, and method for operating inspection system for device to be tested |
| WO2016117105A1 (en) * | 2015-01-23 | 2016-07-28 | 三菱電機株式会社 | Semiconductor device evaluation jig, semiconductor device evaluation apparatus, and semiconductor device evaluation method |
| JPWO2016117105A1 (en) * | 2015-01-23 | 2017-10-05 | 三菱電機株式会社 | Semiconductor device evaluation jig, semiconductor device evaluation device, and semiconductor device evaluation method |
| US10168380B2 (en) | 2015-01-23 | 2019-01-01 | Mitsubishi Electric Corporation | Semiconductor device evaluation jig, semiconductor device evaluation apparatus, and semiconductor device evaluation method |