JPH0274113A - Manufacture of bus bar circuit board - Google Patents

Abstract

PURPOSE:To achieve complete insulation by applying synthetic resin insulator from one side of a bus bar network board integrally punched from a metal board and hardening the insulator thereafter applying synthetic resin onto the other side of the network board and hardening the coated film. CONSTITUTION:UV setting resin, for example, 18 is sprayed onto one face of a bus bar network board punched into a desired network pattern except the coupling chips 22, and after the punched space S is filled with resin and one face of each bus bar 17a, 17b... is smoothed, the UV resin 18 is set through irradiation of ultraviolet rays. Thereafter, the coupling chips 22 are punched to form punched holes 22b. Then the bus bar network board is turned over and applied again with the UV setting resin 18 thus providing a completely molded body. Then a tab hole 19 is made therein and a tab 20 is pressure inserted into the tab hole 19 thus completing the bus bar network board.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a busbar circuit board that constitutes an internal circuit in an electrical junction box used for wiring an electrical circuit of an automobile.

[Prior Art] In a conventional busbar circuit board, a circuit network board indicated by reference numeral 1 in FIG.
, 2b, . . . are integrally punched out, leaving a connecting piece 3 that connects them, placed on an insulating substrate 4, and then cutting the connecting piece 3 using a punching hole 5 provided in the substrate. A method is adopted in which the bus bars 2a, 2b, . . . are separated and made independent.

However, as it is, each bus bar 'la, 2b...
・Since the electrical connection box is exposed, there is a problem of leakage if conductive foreign matter adheres between them, so if the electrical junction box is used in an environment where water may enter, such as an engine room, it is necessary to consider a waterproof structure. There is.

Therefore, in Japanese Patent Application Laid-open No. 154414/1983, the present applicant has prepared a circuit network board 1 in advance as shown in FIGS.
Cut the insulating sheet 7 according to the circuit pattern of the bus bar that constitutes the bus bar, place the temporary 1 on top of it (a), cover it with another insulating sheet 7' in the same way (b), and cut the sheet 7.
．． 7' are heat-treated to make them stick together, and the 6 groups of external connection terminals (tabs) connected to each bus bar are made to stand up by bending (c). A method of insulating coating was proposed. In FIG. 5, parallel diagonal lines indicate this insulating coating portion.

[Problem to be solved by the invention]

Although each bus bar is covered with an insulating sheet 7, 7' shown in FIG. 6, the cut surface of the connecting piece 3 remains exposed due to punching, so there is a risk of leakage. Water enters between the eyebrows,
Water accumulates. Furthermore, the degree of freedom of the circuit bar is limited due to the bending of the tab 6, making it difficult to wire the bus bar in high density.

Furthermore, there is a portion where the insulating sheets 7, 7' of the bus bar overlap with the insulating substrate 4, resulting in wasted material, and there is a risk that the insulator may also adhere to the tab 6 when insulating the bus bar.

The object of the present invention is to solve the above-mentioned problems, to ensure that each bus bar has perfect insulation and waterproof properties, to eliminate the risk of insulators adhering to external connection terminals (tabs), and to enable high-density wiring. An object of the present invention is to provide a method for manufacturing a busbar circuit board.

[Means to solve the problem]

In order to achieve the above object, the present invention forms a busbar circuit network board by integrally punching out a plurality of busbars having a desired circuit pattern from a metal plate, leaving connecting pieces between adjacent busbars. , After coating and filling a synthetic resin insulator from one side of the circuit network board and curing it, the connecting pieces are cut and removed, and then a synthetic resin insulator is applied to the other side of the circuit network board to remove the exposed bus bar. Further, the cut surface of the connecting piece is coated and cured, and a plurality of bus bars are integrally molded.

The above configuration will be specifically described below with reference to drawings showing examples.

〔Example〕

In FIG. 1, A is an electrical connection box, IO and 10' are bus bar circuit boards according to the present invention, 11 is an under cover, 12 is an upper cover 13, which is a waterproof cover, and the upper cover 12 has a fuse cavity 14, An insertion portion for electrical components such as a relay cavity 15 is provided, and a plurality of tab insertion holes 11 are provided in the undercover 11.
A connector insertion portion 16 is provided together with a.

The busbar circuit board 10 (10') includes a plurality of busbars 17.
a, 17b... are integrally molded with a synthetic resin insulator 18, and after molding, each bus bar 17a, 17b...
A tab hole 19 is provided at a desired location, and a tab 20 is press-fitted and connected.

FIG. 2 shows a manufacturing device for the busbar circuit board 10, and FIG. 3 (al.
～(gl is a perspective view of the manufacturing process, FIG. 4(al～(d
i shows a cross-sectional view of the main part of the busbar circuit board in each manufacturing process.

In these figures, 21 indicates a busbar network board;
The cough cloth 21 is integrally formed in a chain shape by punching out a long metal plate M using a known device. That is, a plurality of bus bars 17a, 17b, and
... leaves a connecting piece 22 between adjacent busbars, and a chain frame 23 to hold the circuit M4vi21 on the metal plate M, and a connecting piece 24 connecting the frame 23 and the outside of the busbars 17a, 17b... It is punched out and formed in one piece, leaving . Therefore, in the busbar circuit network board 21, there are many punched spaces S of various shapes between adjacent busbars and between the chain frames 23.

In FIG. 2, reference numeral 25 denotes an endless conveyor belt for transporting the metal plate M on which the busbar circuit network board 21 is formed.
Hook pieces 25a that engage with some of the hook pieces 25a are provided in a protruding manner.

26 is a resin coating device, 27 is a resin curing device equipped with an ultraviolet lamp inside, 28 is a press cutting device for the connecting pieces 22, 24, etc., 29 is a device for gripping and inverting (turning over) the busbar circuit network board 21; A reversing transfer device is shown for transfer to another conveyor belt 25'. Also, 26' and 27' are a resin coating device and a resin curing device, respectively, as described above, and 30 is a press punching device for punching tab holes 19 in each of the bus bars 17a, 17b, . . . .

The busbar circuit board 10 is manufactured as follows.

First, each busbar circuit network board 21 of the metal plate M transferred by the hooking piece 25a of the conveyor belt 25 is spray-coated with, for example, UV curable resin 18 in a resin coating device 26 equipped with a plate-shaped nozzle. ,1
After one side of 7b and the punching space S are filled and smoothed, it enters the resin curing device 27 and is irradiated with ultraviolet rays for a certain period of time to be cured. This results in Figure 3 (
b), Fig. 4 (as shown in al, each bus bar 17a, 17b
A primary molded product P is obtained in which one side of ... and the chain frame 23 are integrally molded. This primary molded product P1 is separated from the chain frame 23 by cutting the connecting pieces 24 in the press cutting device 28, and the connecting pieces 22 between adjacent busbars are cut so that the cut surfaces 22a thereof are exposed to the punched holes 22b. However, each bus bar 17a is filled with a hardened resin 18 that fills the punching space S.

A secondary molded product P2 in which 17b... are held integrally is obtained (FIG. 3(C), FIG. 4 fbl).

Next, the two-time molded product P2 is turned over by the reversing transfer device 29 (FIG. 3(d)), placed on the B conveying belt 25', and subjected to the resin coating device 26' and the resin curing device 27' in the same manner as described above. and each bus bar 17a.

A tertiary molded crystal P3 is obtained in which the exposed back side of 17b and the punched hole 22b are covered and filled with the resin 18 (
FIG. 3(e), FIG. 4(C)).

This tertiary molded product P3 is inserted into a tab hole 19 at a desired position of each bus bar 17a, 17b, . . . in a press punching device 30.
The final product, the busbar circuit board 10, is obtained by drilling the tabs 20 into each tab hole 19 (Fig. 3(g)). ,
Figure 4(d)).

The above is an example in which UV-curable resin is used in the integral mold of each bus bar 17a, 17b, etc., but the curing method is not limited to this, and ordinary electrical insulation is used, using heating, cooling, electron beam irradiation, etc. [Function] The busbar circuit board 10 (10') of the present invention can be made of a thermosetting resin or a thermoplastic resin. hole 22
b is integrally molded and filled with resin, maintaining perfect insulation and waterproof properties. Further, since the tabs 20 as external connection terminals of each bus bar are also fixed to the engineering university, it is easy to design the circuit pattern of the bus bar, and the wiring density can be increased.

In addition, when laminating the busbar circuits Fi10, 10', .

〔Effect of the invention〕

As explained above, in the busbar circuit board of the present invention, since each busbar is completely molded, leakage is completely prevented not only within the same layer but also between the upper and lower layers, and there is no hole for punching out the connection piece, so water leakage is prevented. There will be no water build-up. By using a method in which the tabs are fixed in place, it is easy to design the circuit pattern, and high-density wiring is possible.

Furthermore, since the tab and the busbar are separate bodies, there is no possibility that insulators will adhere to the tab as foreign matter, and the reliability of the contact portion for outputting data from an external person is improved.

[Brief explanation of the drawing]

FIG. 1 is an exploded perspective view of an electrical connection box using a busbar circuit board according to the present invention; FIG. 2 is a schematic perspective view showing an example of an apparatus for manufacturing the busbar circuit board of the present invention; Figures (a) to (g) are explanatory diagrams showing the manufacturing process of an embodiment of the method of the present invention, respectively, and Figures 4 (a) to (di) are cross-sectional views of important parts in each manufacturing process of the busbar circuit board, respectively. , FIGS. 5 and 6 are explanatory diagrams of conventional busbar circuit boards. 1... Electrical connection box, 10. 10'... Busbar circuit board, 17a, 17b -... Busbar 18...・Synthetic resin (insulator), 19... tab hole, 20... tab,
21...Circuit network board, 22...Connection piece.

Claims (2)

[Claims] (1) A busbar circuit network board is formed by integrally punching out a plurality of busbars having a desired circuit pattern from a metal plate, leaving connection pieces between adjacent busbars, and a synthetic resin insulator is formed from one side of the circuit network board. After coating and curing, the connecting pieces are cut and removed, and then a synthetic resin insulator is applied to the other side of the circuit network board to cover the exposed bus bars and the cut surfaces of the connecting pieces, and then cured. A method for manufacturing a busbar circuit board, characterized in that a plurality of busbars are integrally molded. (2) A busbar circuit network board is formed by punching out a plurality of busbars having a desired circuit pattern from a metal plate, leaving connection pieces between adjacent busbars, and a synthetic resin insulator is formed from one side of the circuit network board. After coating and curing, the connecting pieces are cut and removed, and then a synthetic resin insulator is applied to the other side of the circuit network board to cover the exposed bus bars and the cut surfaces of the connecting pieces, and then cured. A method of manufacturing a busbar circuit board, comprising: molding a plurality of busbars together, then drilling holes at desired positions in each busbar, and press-fitting and fixing external connection terminals into the holes.