JPH027382A - Cooker - Google Patents

Cooker

Info

Publication number
JPH027382A
JPH027382A JP15852688A JP15852688A JPH027382A JP H027382 A JPH027382 A JP H027382A JP 15852688 A JP15852688 A JP 15852688A JP 15852688 A JP15852688 A JP 15852688A JP H027382 A JPH027382 A JP H027382A
Authority
JP
Japan
Prior art keywords
heat sink
blades
thick
thick part
lower directions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15852688A
Other languages
Japanese (ja)
Other versions
JP2503253B2 (en
Inventor
Haruo Ishikawa
春生 石川
Takashi Koshio
隆 小塩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15852688A priority Critical patent/JP2503253B2/en
Publication of JPH027382A publication Critical patent/JPH027382A/en
Application granted granted Critical
Publication of JP2503253B2 publication Critical patent/JP2503253B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To achieve smallness of a heat sink, smallness and low rotation of an air blowing fan, by linking a thick part for parts attachment and a thick part to which wings are provided in both the upper and the lower directions at a thick part. CONSTITUTION:A heat sink 5 has a thick part for parts attachment and a thick part 15 located at a higher position with wings 16, 17 provided in both the upper and in the lower directions, and the thick part 14 for parts attachment and the thick part 15 to which wings are provided in both the upper and the lower directions are linked at a thick part 18. Hence, the flow of air through rotation of an air blowing fan can be blown effectively to a heat sink. Thereby, cooling ability can be improved with heat exchange efficiency being raised, and smallness and lightness of a heat sink, smallness and low rotation of an air blowing fan, smallness of a motor, reduction in piling thicknesses of a coil and a core can be achieved.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、一般家庭などにおいて使用され、かつ誘導加
熱源を利用した炊飯器等の調理器に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a cooking appliance such as a rice cooker that is used in general households and utilizes an induction heating source.

従来の技術 従来、誘導加熱源を利用した調理器としては、たとえば
次のような構造のものが知られている。
2. Description of the Related Art Conventionally, cooking appliances using an induction heating source are known, for example, as having the following structure.

すなわち、第4図および第6図において、101は鍋等
の調理物を置く置台、102は置台101を保持する下
枠、103は誘導加熱源である誘導コイル、104は誘
導コイル103を保持するカバー、105は誘導コイル
103を励振するインバータ回路の基板、106はイン
バータ回路の部品である半導体スイッチ素子、107は
下枠102に取付ケたヒートシンクで、このヒートシン
ク107の上面には誘導コイル103への電流をスイッ
チングして自己発熱してしまう半導体スイッチ素子10
6が取付けてあり、冷却を行なっている。1o8はモー
タ、109はモータ108に軸支され、かつ送風を行な
う送風ファン、110は吸気穴、111は排気穴である
That is, in FIGS. 4 and 6, 101 is a stand on which cooking items such as pots are placed, 102 is a lower frame that holds the stand 101, 103 is an induction coil that is an induction heating source, and 104 is a stand that holds the induction coil 103. A cover, 105 is a substrate of an inverter circuit that excites the induction coil 103, 106 is a semiconductor switch element which is a component of the inverter circuit, 107 is a heat sink attached to the lower frame 102, and the upper surface of this heat sink 107 has a circuit board for the inverter circuit that excites the induction coil 103. Semiconductor switch element 10 that self-heats by switching the current of
6 is installed and performs cooling. 108 is a motor, 109 is a blower fan which is pivotally supported by the motor 108 and blows air, 110 is an intake hole, and 111 is an exhaust hole.

発明が解決しようとする課題 上記従来の調理器では、ヒートシンク107が送風ファ
ン109と横向きに対面した位置にあり、かつ半導体ス
イッチ素子106をヒートシンク107の上面に取付け
て、ヒートシンク107を下枠102に全面で固定して
おり、さらに半導体スイッチ素子106の取付用肉厚部
は平面であシ、特にヒートシンク107の下向きの羽根
107aの長さも短いため、送風ファン109が送風す
る風向き及び流れが有効的にヒートシンク107に働か
ず、したがって最も冷却したい半導体スイッチ素子10
6を取付けたヒートシンク10了が充分な冷却を得るこ
とができなかった。
Problems to be Solved by the Invention In the conventional cooking appliance described above, the heat sink 107 is located in a position facing the blower fan 109 laterally, the semiconductor switch element 106 is attached to the upper surface of the heat sink 107, and the heat sink 107 is attached to the lower frame 102. It is fixed on the entire surface, and the thick part for mounting the semiconductor switch element 106 is flat, and the length of the downward blade 107a of the heat sink 107 is particularly short, so the direction and flow of the air blown by the ventilation fan 109 is effective. Therefore, the semiconductor switch element 10 that does not act on the heat sink 107 and that is most desired to be cooled
The heat sink 10 with which No. 6 was installed could not provide sufficient cooling.

そしてこの構成において、ヒートシンク107を充分に
冷却するためには、ヒートシンク107の表面積の増加
と送風量の増加が必要であシ、この場合、ヒートシンク
1070表面積を増加させるためには、その形状を大き
く、しかも重くするしかなく、その結果、コストがアッ
プするとともに、製品が重量的に重くなるという問題点
を有していた。
In this configuration, in order to sufficiently cool the heat sink 107, it is necessary to increase the surface area of the heat sink 107 and increase the amount of air blown. Moreover, there was no choice but to make the product heavier, which resulted in problems in that the cost increased and the product became heavier.

また送風量を増加させるためには、送風ファン109の
直径と高さを大きくし、しかも回転数を増加させて、そ
の回転のトルクアップをはかるため、モータ108の巻
線増加とコアの積厚増加が必要となシ、その結果、コス
トが大巾にアップするとともに、製品形状も大きくなり
、しかも騒音が高いという問題点があった。
In order to increase the amount of air blown, the diameter and height of the fan 109 are increased, and the number of revolutions is also increased to increase the rotational torque. As a result, there were problems in that the cost increased significantly, the product shape became larger, and the noise was higher.

本発明は上記の課題を解決するもので、ヒートシンクに
取付けたインバータ回路の部品の冷却を向上させて、ヒ
ートシンクの小型化、送風ファンの小型化、低回転化が
はかれる調理器を提供することを目的とするものである
The present invention solves the above-mentioned problems, and aims to improve the cooling of the inverter circuit components attached to the heat sink, and to provide a cooking device in which the heat sink can be made smaller, the blower fan can be made smaller, and the rotation speed can be lowered. This is the purpose.

課題を解決するだめの手段 上記の課題を解決するために本発明の調理器は、誘導コ
イルを励振するインバータ回路と、このインバータ回路
の部品を肉厚部の下面に取付けたヒートシンクと、この
ヒートシンクの下部に配置した送風ファンと、この送風
ファンを回転駆動させるモータとを備え、前記ヒートシ
ンクは前記部品取付用の肉厚部と、それよυ高位置で羽
根を上下両方向に具備した肉厚部とを有し、前記部品取
付用の肉厚部と羽根を上下両方向に具備した肉厚部とを
肉厚部で結合したものである。
Means for Solving the Problems In order to solve the above problems, the cooker of the present invention includes an inverter circuit that excites an induction coil, a heat sink in which components of the inverter circuit are attached to the lower surface of the thick part, and the heat sink. The heat sink includes a blower fan disposed at the bottom of the heat sink, and a motor that rotationally drives the blower fan, and the heat sink has a thick wall portion for mounting the component, and a thick wall portion having blades in both the upper and lower directions at positions υ higher than the thick wall portion. The thick part for attaching parts and the thick part provided with blades in both the upper and lower directions are connected by the thick part.

作  用 上記構成によれば、モータによ多回転駆動される送風フ
ァンの回転により、吸気部の吸気穴から空気が吸い込ま
れ、そしてこの吸い込まれた空気は、送風ファンからモ
ータを介してヒートシンクの上面を流れる風向きと、送
風ファンの上部に配置したヒートシンクの側面にあたっ
てこの側面を冷却してヒートシンクの上面に流れる風向
きと、同じくヒートシンクの下面にあたシ、かつこの下
面に沿って流れる風向きとなるもので、この場合、ヒー
ト7ンクの部品取付用の肉厚部は最も温度が高く、かつ
その部分が送風ファンに近接しているため、直接送風フ
ァンの風があたって冷却される。
According to the above configuration, air is sucked in from the intake hole of the intake section by the rotation of the blower fan driven by the motor at multiple rotations, and this sucked air is sent from the blower fan to the heat sink via the motor. The direction of the wind flowing on the top surface, the direction of the wind hitting the side of the heat sink placed on the top of the fan and cooling this side and flowing to the top surface of the heat sink, and the direction of the wind hitting the bottom surface of the heat sink and flowing along this bottom surface. In this case, the thick part of the heat 7 tank for attaching parts has the highest temperature, and since that part is close to the blower fan, it is cooled by direct blowing air from the blower fan.

さらに熱は部品取付用の肉厚部から結合肉厚部を伝導し
て羽根を上下両方向に具備した肉厚部に伝わるが、送風
ファンによるヒートシンクの上面及び下面への空気の流
れは羽根を上下両方向に具備した肉厚部の上下の羽根に
効率よくあたるため、さらに冷却は進むものである。
Furthermore, heat is conducted from the thick wall part for attaching parts to the thick joint wall part and then to the thick wall part with blades in both the upper and lower directions. Since it efficiently hits the upper and lower blades of the thick walled portion in both directions, cooling progresses even further.

このように、ファンの回転による空気流れは無駄なくヒ
ートシンクに送風されるため、この作用によシ、ヒート
シンクの小型化、送風ファンの小型化、低回転化をはか
ることができ、これによシ、コストダウンと製品のコン
パクト化、軽量化、そして低騒音化がはかれるものであ
る。
In this way, the airflow generated by the rotation of the fan is blown to the heat sink without waste, so this action allows the heat sink to be made smaller, the blower fan to be smaller, and the rotation speed to be lowered. , it is possible to reduce costs, make the product more compact, lightweight, and reduce noise.

実施例 以下、本発明の一実施例を添付図面に基づいて説明する
EXAMPLE Hereinafter, an example of the present invention will be described based on the accompanying drawings.

第1図〜第3図において、1は誘導加熱源である誘導コ
イルで、この誘導コイル1はカバー2のリプで保持され
ている。3は誘導コイル1を励振するインバータ回路で
、このインバータ回路3の上方にはインバータ回路3の
部品である半導体スイッチ素子4が設けられている。6
はスイッチングロス等で発熱する半導体スイッチ素子4
をネジ5aで取付けたヒートシンクで、このヒートシン
ク6と前記カバー2は下枠6にネジ締め等によシ保持さ
れている。7は金具によシ下枠6に取付けたモータで、
このモータ7に軸支されて回転駆動されるプロペラ型の
送風ファン8の吸気側は吸気カバー9で囲まれている。
In FIGS. 1 to 3, reference numeral 1 denotes an induction coil which is an induction heating source, and this induction coil 1 is held by a lip of a cover 2. Reference numeral 3 denotes an inverter circuit that excites the induction coil 1, and above the inverter circuit 3, a semiconductor switch element 4, which is a component of the inverter circuit 3, is provided. 6
is a semiconductor switch element 4 that generates heat due to switching loss, etc.
The heat sink 6 is attached with screws 5a, and the heat sink 6 and the cover 2 are held on the lower frame 6 by screwing or the like. 7 is a motor attached to the lower frame 6 with a metal fitting,
The intake side of a propeller-type blower fan 8 that is rotatably supported by the motor 7 is surrounded by an intake cover 9 .

10は吸気カバー9に設けた吸気穴で、この吸気穴1o
よシ送風ファン8の回転によって外部の空気が吸い込ま
れる。11は送風ファン8の排気側を囲むガイドである
。12は誘導コイル1を保持し、かつ加熱される炊飯鍋
21と対向する保護枠下である。13は下枠6に設けた
排気穴である。14はヒートシンク5の部品取付用の肉
厚部、16は前記ヒートシンク5の肉厚部14より高位
置に設けられた肉厚部で、この肉厚部16は下向きの羽
根16と上向きの羽根17を具備している。18は部品
取付用の肉厚部14と上下両方向に羽根16.17を具
備した肉厚部15とを熱的、構造的に結合する結合肉厚
部である。
10 is an intake hole provided in the intake cover 9, and this intake hole 1o
External air is sucked in by the rotation of the ventilation fan 8. Reference numeral 11 denotes a guide surrounding the exhaust side of the blower fan 8. Reference numeral 12 denotes the lower portion of the protective frame that holds the induction coil 1 and faces the rice cooker 21 that is heated. 13 is an exhaust hole provided in the lower frame 6. 14 is a thick part of the heat sink 5 for attaching parts; 16 is a thick part provided at a higher position than the thick part 14 of the heat sink 5; this thick part 16 has a downward wing 16 and an upward wing 17; Equipped with: Reference numeral 18 denotes a connecting thick part that thermally and structurally connects the thick part 14 for attaching parts to the thick part 15 provided with blades 16 and 17 in both the upper and lower directions.

上記構成の調理器において、誘導コイル1への電流をス
イッチングする半導体スイッチ素子4は、スイッチング
ロス、オンロス等で30〜50 wの発熱ロスがあるた
め、その温度上昇を低下させる構成を次に説明する。す
なわち、モータ7に軸支した送風ファン8の回転により
、吸気カバー9に設けた吸気穴1oから外部の空気を吸
い込む。そして吸い込まれた空気は、送風ラアン8から
モータ7を介してヒートシンク6の上面を流れる風向き
と、送風ファン8の上部に配置したヒートシンク5の側
面にあたってこの側面を冷却してヒートシンク5の上面
に流れる風向きと、同じくヒートシンク5の下面にあた
り、かつこの下面に沿って流れる風向きとなるもので、
この場合、ヒートシンクの部品取付用の肉厚部14は最
も温度が高く、かつその部分が送風ファン8に近接して
いるため、直接送風ファン8の風があたって冷却される
。さらに熱は部品取付用の肉厚部14から結合肉厚部1
8を伝導して上下両方向に羽根16.17を具備した肉
厚部16に伝わるが、送風ファン8によるヒートシンク
6の上面及び下面への空気の流れは上下両方向に羽根1
6.17を具備した肉厚部16の上の羽根17と下の羽
根16とに効率よくあたるため、さらに冷却は進むもの
である。
In the cooker with the above configuration, the semiconductor switching element 4 that switches the current to the induction coil 1 has a heat loss of 30 to 50 W due to switching loss, on-loss, etc., so a configuration for reducing the temperature rise will be described below. do. That is, by the rotation of the blower fan 8 that is pivotally supported by the motor 7, external air is sucked in through the intake hole 1o provided in the intake cover 9. The sucked air then flows from the blower fan 8 through the motor 7 to the top surface of the heat sink 6, hits the side surface of the heat sink 5 placed above the blower fan 8, cools this side surface, and flows to the top surface of the heat sink 5. The direction of the wind is also the direction of the wind that hits the bottom surface of the heat sink 5 and flows along this bottom surface.
In this case, the thick part 14 of the heat sink for attaching parts has the highest temperature, and since that part is close to the blower fan 8, the air from the blower fan 8 directly hits it and cools it. Furthermore, the heat is transferred from the thick part 14 for attaching parts to the joint thick part 1.
8 and is transmitted both upward and downward to the thick walled part 16 equipped with blades 16 and 17. However, the flow of air to the upper and lower surfaces of the heat sink 6 by the blower fan 8 is caused by the blades 16 and 17 both upward and downward.
6.17, the upper blade 17 and the lower blade 16 of the thick walled portion 16 are efficiently hit, so that cooling further progresses.

このように、ファン8の回転による空気流れは無駄なく
ヒートシンク5に送風されることになる。
In this way, the air flow due to the rotation of the fan 8 is blown to the heat sink 5 without waste.

この作用によシ、ヒートシンク5の小型化、送風ファン
8の小型化、低回転化をはかることができるため、モー
タ7の巻線、コアの積厚も減少し、コストダウンをはか
ることができるとともに、製品のコンパクト化、軽量化
、そして低騒音化がはかれるものである。
Due to this effect, it is possible to make the heat sink 5 smaller, the blower fan 8 smaller, and the rotation speed lower, so that the stacked thickness of the windings and core of the motor 7 can be reduced, and costs can be reduced. At the same time, the product can be made more compact, lighter, and less noisy.

また、上下両方向に羽根16.17を具備した肉厚部1
5を部品取付用の肉厚部14の両側に配置することによ
シ、熱の伝導は半導体スイッチ素子4を中央として熱分
散が良くなるとともに、空気の流れを上下の羽根16.
17で効率良く熱変換することができるため、冷却が増
加するものである。この構成によシ、半導体スイッチ素
子4の温度上昇を約3dey低下させる効果が得られる
ものである。
In addition, the thick wall portion 1 is provided with blades 16 and 17 in both the upper and lower directions.
5 on both sides of the thick part 14 for attaching parts, heat conduction improves heat dispersion with the semiconductor switch element 4 in the center, and air flow is directed to the upper and lower blades 16 .
Since heat can be efficiently converted at 17, cooling is increased. With this configuration, it is possible to obtain the effect of reducing the temperature rise of the semiconductor switching element 4 by about 3 days.

そしてまた結合肉厚部18を傾斜させて設けることによ
シ、上向きの羽根17がその傾斜部に1枚増えることに
なるため、ヒートシンク6の表面積は増加して、半導体
スイッチ素子4の温度上昇を約1dey低下させる効果
が得られるものである。
Furthermore, by providing the joint thick portion 18 at an angle, one more upwardly facing blade 17 is added to the inclined portion, so the surface area of the heat sink 6 increases and the temperature of the semiconductor switch element 4 increases. This has the effect of reducing the amount by about 1 day.

さらに、上下両方向に羽根16.17を具備した肉厚部
15の上向きの羽根17と下向きの羽根16の長さがほ
ぼ同じとなる位置に上下両方向に羽根16.17を具備
した肉厚部16を設けたことにより、上下の羽根16.
17から肉厚部16への冷却度合と熱伝導が均一化され
るため、熱伝導が向上した分だけ、冷却効果が増大する
ことになり、その結果、半導体スイッチ素子4の温度上
昇を約1dey低下させる効果が得られるものである。
Furthermore, the thick part 16 is provided with blades 16.17 in both the up and down directions at a position where the lengths of the upward blades 17 and the downward blades 16 of the thick part 15 are approximately the same. By providing the upper and lower blades 16.
Since the degree of cooling and heat conduction from the thick portion 17 to the thick portion 16 are made uniform, the cooling effect is increased by the amount that the heat conduction is improved.As a result, the temperature rise of the semiconductor switch element 4 is reduced by about 1 day. This has the effect of reducing the

また、ヒートシンク6を取付ける下枠6の側面側に近接
してヒートシンクに設けられ、かつ上下両方向に羽根1
6.17を具備した肉厚部15の端部に、放射状の羽根
19を設けたことによシ、空気の流れは、下枠6の側面
に沿ってスムーズに流れ、そして下枠6の側面に沿った
部分のヒートシンク6の面積を増大させる放射状の羽根
19によシその冷却効果は向上するため、半導体スイッ
チ素子4の温度上昇を約1dey低下させる効果が得ら
れるものである。
In addition, blades 1 are provided on the heat sink close to the side surface of the lower frame 6 to which the heat sink 6 is attached, and are provided with blades 1 in both the upper and lower directions.
By providing the radial vanes 19 at the end of the thick walled portion 15 having a diameter of 6.17, the air flows smoothly along the side surface of the lower frame 6. The cooling effect is improved by the radial blades 19 that increase the area of the heat sink 6 in the portion along the radial direction, thereby reducing the temperature rise of the semiconductor switch element 4 by about 1 day.

また、ヒートシンク5の下向きの羽根16の先端20と
、この先端20が対面する下枠6の面との間に隙間を設
け、さらにヒートシンク5の下向きの羽根16の先端2
oとインバータ回路3の基板3aの面との間に隙間を設
けた構成とすることによシ、送風ファン8からの送風は
ヒートシンク5の下面にあたり、そして空気の流れは下
向きの羽根16の先端2oと下枠6の面との間の隙間及
びインバータ回路3の基板3a面との間の隙間をスムー
ズに流れていくため、半導体スイッチ素子4の温度上昇
を約2 dey低下させる効果が得られるものである。
Further, a gap is provided between the tip 20 of the downward facing blade 16 of the heat sink 5 and the surface of the lower frame 6 that this tip 20 faces, and furthermore, a gap is provided between the tip 20 of the downward facing blade 16 of the heat sink 5.
By providing a gap between the surface of the board 3a of the inverter circuit 3 and the surface of the board 3a of the inverter circuit 3, the air from the blower fan 8 hits the bottom surface of the heat sink 5, and the air flow is directed toward the tips of the downward blades 16. 2o and the surface of the lower frame 6 and the gap between the surface of the substrate 3a of the inverter circuit 3, the temperature rise of the semiconductor switch element 4 can be reduced by about 2 days. It is something.

この時、前記隙間は2〜8nが効果的であり、前記隙間
を持たせた羽根の数が多い程効果もある−8 また、上下両方向に羽根16.17を具備した肉厚部1
5の下向きの羽根16の長さは、ヒートシンク6を取付
ける下枠6の側面側を長くすることにより、空気の流れ
は下枠6の側面に沿って流れ、そしてその部分の羽根の
面積を増大することになるため、冷却性能は向上し、そ
の結果、半導体スイッチ素子4の温度上昇を約1dep
低下させる効果が得られるものである。
At this time, it is effective that the gap is 2 to 8n, and the larger the number of blades provided with the gap, the more effective it is.
The length of the downward facing blade 16 in 5 is determined by lengthening the side surface of the lower frame 6 to which the heat sink 6 is attached, so that the air flows along the side surface of the lower frame 6, and the area of the blade in that part is increased. As a result, the cooling performance is improved, and as a result, the temperature rise of the semiconductor switch element 4 is reduced by about 1 dep.
This has the effect of reducing the

上記した構成の組み合わせによシ、ヒートシンク6はさ
らに小型化がはかれ、かつ送風ファン8もさらに小型化
、低回転となるため、大巾なコストダウンがはかれ、か
つ製品のコンパクト化、低騒音化がはかれるものである
By combining the above-mentioned configurations, the heat sink 6 can be further miniaturized, and the blower fan 8 can also be further miniaturized and rotate at a lower speed, resulting in significant cost reductions and a more compact and low-cost product. This can be used to reduce noise.

発明の効果 上記実施例の説明から明らかなように本発明の調理器は
、誘導コイルを励振するインバータ回路と、このインバ
ータ回路の部品を肉厚部の下面に取付けたヒートシンク
と、このヒートシンクの下部に配置した送風ファンと、
この送風ファンを回転駆動させるモータとを備え、前記
ヒートシンクは前記部品取付用の肉厚部と、それより高
位置で羽根を上下両方向に具備した肉厚部とを有し、前
記部品取付用の肉厚部と羽根を上下両方向に具備した肉
厚部とを肉厚部で結合しているため、送風ファンの回転
による空気の流れを無駄なくヒートシンクに送風するこ
とができ、これによシ、熱交換効率を高めて冷却性能を
向上させることができるものである。そしてこの効果に
よシ、ヒートシンクの小型化、軽量化、それに送風ファ
ンの小型化、低回転化及びモータの小型化と巻線、コア
の積み厚の減少をはかることができ、その結果、コスト
ダウンと、製品のコンパクト化、軽量化、そして低騒音
化が可能となるものである。
Effects of the Invention As is clear from the description of the embodiments above, the cooking appliance of the present invention includes an inverter circuit that excites an induction coil, a heat sink in which parts of the inverter circuit are attached to the lower surface of the thick part, and a lower part of the heat sink. A blower fan placed in the
The heat sink has a thick wall portion for mounting the component, and a thick wall portion having blades in both vertical directions at a higher position, and a motor for rotating the blower fan. Since the thick part and the thick part with blades in both the upper and lower directions are connected by the thick part, the air flow generated by the rotation of the blower fan can be blown to the heat sink without waste. It is possible to improve cooling performance by increasing heat exchange efficiency. Due to this effect, it is possible to make the heat sink smaller and lighter, the blower fan smaller and have lower rotation speed, the motor smaller, and the stacked thickness of the windings and core reduced.As a result, the cost is reduced. This makes it possible to make products more compact, lighter, and less noisy.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示す調理器の部分断面図、
第2図は第1図のA−A線断面矢視図、第3図は同調理
器の全体を示す断面図、第4図は従来例を示す調理器の
断面図、第6図は同調理器の部分断面図である。 1・・・・・・誘導コイル、2・・川・カバー、3・・
・・・・インバータ回路、4・・・・・・半導体スイッ
チ素子、5・・・・・・ヒートシンク、6・・・・・・
下枠、7・・・・・・モータ、8・・・・・・ファン、
14・・・・・・部品取付用の肉厚部、15・・・・・
・肉厚部、16・・・・・・下向きの羽根、17・・曲
上向きの羽根、 8・・・・・・結合肉厚部。
FIG. 1 is a partial sectional view of a cooking device showing an embodiment of the present invention;
Fig. 2 is a sectional view taken along the line A-A in Fig. 1, Fig. 3 is a sectional view showing the entire cooker, Fig. 4 is a sectional view of the conventional cooker, and Fig. 6 is the same. It is a partial sectional view of a cooking appliance. 1...Induction coil, 2...River/cover, 3...
... Inverter circuit, 4 ... Semiconductor switch element, 5 ... Heat sink, 6 ...
Lower frame, 7...motor, 8...fan,
14... Thick part for mounting parts, 15...
・Thick part, 16...Downward blade, 17...Curved upward blade, 8...Connected thick part.

Claims (8)

【特許請求の範囲】[Claims] (1)誘導コイルを励振するインバータ回路と、このイ
ンバータ回路の部品を肉厚部の下面に取付けたヒートシ
ンクと、このヒートシンクの下部に配置した送風ファン
と、この送風ファンを回転駆動させるモータとを備え、
前記ヒートシンクは前記部品取付用の肉厚部と、それよ
り高位置で羽根を上下両方向に具備した肉厚部とを有し
、前記部品取付用の肉厚部と羽根を上下両方向に具備し
た肉厚部とを肉厚部で結合してなる調理器。
(1) An inverter circuit that excites an induction coil, a heat sink with the parts of this inverter circuit attached to the bottom surface of the thick part, a blower fan placed at the bottom of this heat sink, and a motor that rotationally drives this blower fan. Prepare,
The heat sink has a thick part for attaching the component, and a thick part having blades in both the upper and lower directions at a higher position than the thick part for attaching the component, and a thick part having the thick part for attaching the component and the blade in both the upper and lower directions. A cooking utensil made by connecting thick parts with thick parts.
(2)羽根を上下両方向に具備した肉厚部を部品取付用
の肉厚部の両側に配置してなる特許請求の範囲第1項記
載の調理器。
(2) The cooking appliance according to claim 1, wherein the thick wall portion provided with blades in both the upper and lower directions is arranged on both sides of the thick wall portion for attaching parts.
(3)羽根を上下両方向に具備した肉厚部と部品取付用
の肉厚部とを結合する肉厚部を傾斜させて設けた特許請
求の範囲第1項記載の調理器。
(3) The cooking appliance according to claim 1, wherein the thick wall portion that connects the thick wall portion having the blades in both the upper and lower directions and the thick wall portion for attaching parts is provided in an inclined manner.
(4)羽根を上下両方向に具備した肉厚部の位置は、上
下の羽根の長さとほぼ同じ位置とした特許請求の範囲第
1項記載の調理器。
(4) The cooking device according to claim 1, wherein the position of the thick wall portion having the blades in both the upper and lower directions is substantially the same as the length of the upper and lower blades.
(5)ヒートシンクを取付ける下枠の側面側に近接して
ヒートシンクに設けられ、かつ上下両方向に羽根を具備
した肉厚部の端部に、放射状に羽根を設けた特許請求の
範囲第1項記載の調理器。
(5) Claim 1, in which the blades are provided radially at the end of the thick part that is provided on the heat sink close to the side surface of the lower frame to which the heat sink is attached, and is provided with blades in both the upper and lower directions. cooker.
(6)ヒートシンクの下向きの羽根の先端とヒートシン
クを取付けた下枠との間に隙間を設けた特許請求の範囲
第1項記載の調理器。
(6) The cooking appliance according to claim 1, wherein a gap is provided between the tips of the downward blades of the heat sink and the lower frame to which the heat sink is attached.
(7)ヒートシンクの下向きの羽根の先端とヒートシン
クを取付けたインバータ回路の基板との間に隙間を設け
た特許請求の範囲第1項記載の調理器。
(7) The cooking appliance according to claim 1, wherein a gap is provided between the tips of the downward blades of the heat sink and the board of the inverter circuit to which the heat sink is attached.
(8)羽根を上下両方向に具備した肉厚部の下向きの羽
根の長さは、ヒートシンクを取付ける下枠の側面側を長
くしてなる特許請求の範囲第2項記載の調理器。
(8) The cooking appliance according to claim 2, wherein the length of the downwardly directed blades of the thick walled portion, which is provided with blades in both the upper and lower directions, is longer on the side surface of the lower frame to which the heat sink is attached.
JP15852688A 1988-06-27 1988-06-27 Cooking device Expired - Lifetime JP2503253B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15852688A JP2503253B2 (en) 1988-06-27 1988-06-27 Cooking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15852688A JP2503253B2 (en) 1988-06-27 1988-06-27 Cooking device

Publications (2)

Publication Number Publication Date
JPH027382A true JPH027382A (en) 1990-01-11
JP2503253B2 JP2503253B2 (en) 1996-06-05

Family

ID=15673661

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15852688A Expired - Lifetime JP2503253B2 (en) 1988-06-27 1988-06-27 Cooking device

Country Status (1)

Country Link
JP (1) JP2503253B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07284443A (en) * 1994-04-18 1995-10-31 Tiger Vacuum Bottle Co Ltd Electromagnetic rice cooker

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07284443A (en) * 1994-04-18 1995-10-31 Tiger Vacuum Bottle Co Ltd Electromagnetic rice cooker
JP2638473B2 (en) * 1994-04-18 1997-08-06 タイガー魔法瓶株式会社 Electromagnetic rice cooker

Also Published As

Publication number Publication date
JP2503253B2 (en) 1996-06-05

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