JPH0273759U - - Google Patents
Info
- Publication number
- JPH0273759U JPH0273759U JP15360988U JP15360988U JPH0273759U JP H0273759 U JPH0273759 U JP H0273759U JP 15360988 U JP15360988 U JP 15360988U JP 15360988 U JP15360988 U JP 15360988U JP H0273759 U JPH0273759 U JP H0273759U
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- heat dissipation
- metal plate
- dissipation metal
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15360988U JPH0273759U (da) | 1988-11-28 | 1988-11-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15360988U JPH0273759U (da) | 1988-11-28 | 1988-11-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0273759U true JPH0273759U (da) | 1990-06-05 |
Family
ID=31429607
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15360988U Pending JPH0273759U (da) | 1988-11-28 | 1988-11-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0273759U (da) |
-
1988
- 1988-11-28 JP JP15360988U patent/JPH0273759U/ja active Pending