JPH0272558U - - Google Patents
Info
- Publication number
- JPH0272558U JPH0272558U JP15086788U JP15086788U JPH0272558U JP H0272558 U JPH0272558 U JP H0272558U JP 15086788 U JP15086788 U JP 15086788U JP 15086788 U JP15086788 U JP 15086788U JP H0272558 U JPH0272558 U JP H0272558U
- Authority
- JP
- Japan
- Prior art keywords
- pad portion
- anchor
- view
- anchor piece
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15086788U JPH0272558U (sr) | 1988-11-18 | 1988-11-18 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15086788U JPH0272558U (sr) | 1988-11-18 | 1988-11-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0272558U true JPH0272558U (sr) | 1990-06-01 |
Family
ID=31424395
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15086788U Pending JPH0272558U (sr) | 1988-11-18 | 1988-11-18 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0272558U (sr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001085591A (ja) * | 1999-08-24 | 2001-03-30 | Fairchild Korea Semiconductor Kk | チップパッドが放熱通路として用いられるリードフレーム及びこれを含む半導体パッケージ |
-
1988
- 1988-11-18 JP JP15086788U patent/JPH0272558U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001085591A (ja) * | 1999-08-24 | 2001-03-30 | Fairchild Korea Semiconductor Kk | チップパッドが放熱通路として用いられるリードフレーム及びこれを含む半導体パッケージ |