JPH0270437U - - Google Patents
Info
- Publication number
- JPH0270437U JPH0270437U JP15024088U JP15024088U JPH0270437U JP H0270437 U JPH0270437 U JP H0270437U JP 15024088 U JP15024088 U JP 15024088U JP 15024088 U JP15024088 U JP 15024088U JP H0270437 U JPH0270437 U JP H0270437U
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- lead frame
- lead
- recess
- electrode terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15024088U JPH0270437U (ko) | 1988-11-17 | 1988-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15024088U JPH0270437U (ko) | 1988-11-17 | 1988-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270437U true JPH0270437U (ko) | 1990-05-29 |
Family
ID=31423205
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15024088U Pending JPH0270437U (ko) | 1988-11-17 | 1988-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270437U (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325739A (zh) * | 2012-03-23 | 2013-09-25 | 南茂科技股份有限公司 | 半导体封装基板 |
-
1988
- 1988-11-17 JP JP15024088U patent/JPH0270437U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325739A (zh) * | 2012-03-23 | 2013-09-25 | 南茂科技股份有限公司 | 半导体封装基板 |
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