JPH01127238U - - Google Patents
Info
- Publication number
- JPH01127238U JPH01127238U JP1988023665U JP2366588U JPH01127238U JP H01127238 U JPH01127238 U JP H01127238U JP 1988023665 U JP1988023665 U JP 1988023665U JP 2366588 U JP2366588 U JP 2366588U JP H01127238 U JPH01127238 U JP H01127238U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- conductive pattern
- constant
- insulating film
- electrode body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 3
- 238000013459 approach Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988023665U JPH0530361Y2 (ko) | 1988-02-23 | 1988-02-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988023665U JPH0530361Y2 (ko) | 1988-02-23 | 1988-02-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01127238U true JPH01127238U (ko) | 1989-08-31 |
| JPH0530361Y2 JPH0530361Y2 (ko) | 1993-08-03 |
Family
ID=31242848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988023665U Expired - Lifetime JPH0530361Y2 (ko) | 1988-02-23 | 1988-02-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0530361Y2 (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03214638A (ja) * | 1990-01-19 | 1991-09-19 | Toshiba Corp | 半導体ウェハ |
| JP2011147671A (ja) * | 2010-01-22 | 2011-08-04 | Toyota Motor Corp | 着座シート |
-
1988
- 1988-02-23 JP JP1988023665U patent/JPH0530361Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03214638A (ja) * | 1990-01-19 | 1991-09-19 | Toshiba Corp | 半導体ウェハ |
| JP2011147671A (ja) * | 2010-01-22 | 2011-08-04 | Toyota Motor Corp | 着座シート |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0530361Y2 (ko) | 1993-08-03 |
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