JPH0270396A - Laser processing machine - Google Patents

Laser processing machine

Info

Publication number
JPH0270396A
JPH0270396A JP63216275A JP21627588A JPH0270396A JP H0270396 A JPH0270396 A JP H0270396A JP 63216275 A JP63216275 A JP 63216275A JP 21627588 A JP21627588 A JP 21627588A JP H0270396 A JPH0270396 A JP H0270396A
Authority
JP
Japan
Prior art keywords
laser
laser beam
work
reflecting mirror
mirror
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63216275A
Other languages
Japanese (ja)
Inventor
Kazuo Nakayama
和雄 中山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP63216275A priority Critical patent/JPH0270396A/en
Publication of JPH0270396A publication Critical patent/JPH0270396A/en
Pending legal-status Critical Current

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  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To realize working of other work in the course of set-up a work by providing an He-Ne laser beam switching device in which a reflecting mirror is incorporated so as to be freely movable forward/backward between plural reflecting mirrors and condensing heads in a conventional laser beam machine. CONSTITUTION:He-Ne switching devices 8A, 8B and 8C in which reflecting mirrors 9A, 9B and 9C are incorporated so as to be freely movable forward/ backward are attached between laser switching devices 3A, 3B and 3C and condensing heads 6A, 6B and 6C, respectively. In such a constitution, in the case of replacing, for instance, a work 5a and executing set-up such as focusing, etc., a reflecting mirror 3a is drawn back and the reflecting mirror 9A of the He-Ne laser device 8A is placed on an optical path of a laser beam 2, and an He-Ne laser beam is condensed by a condensing mirror 7A and made incident on the work 5a. During this time, the laser beam 2 can be sent to a working table 5B by a reflecting mirror 3b, working of a work 5b and/or a work 5c can be executed, and the operation rate of the equipment is improved.

Description

【発明の詳細な説明】 [発明の目的] (産業上の利用分野) 本発明はレーザ加工装置−に係り、特に光軸調整装置に
関する。
DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a laser processing device, and particularly to an optical axis adjustment device.

(従来の技術) 第3図は従来の複数の加工テーブルを備えたレーザ光の
伝送路を示し、レーザ発振器1がら出射されたレーザ光
2は、反射鏡3aが移動自在に収納されたレーザ光切換
装置3Aを経て反射鏡3Bが移動自在に収納されたレー
ザ光切換装置3Bを貫通し、反射鏡11で折り曲げられ
て集光ヘッド6C内に収納された集光ミラー7Cで集光
され、加工テーブル5C上のワーク5C上に照射される
(Prior Art) Fig. 3 shows a conventional laser beam transmission path equipped with a plurality of processing tables. After passing through the switching device 3A, the reflecting mirror 3B passes through the movably housed laser beam switching device 3B, is bent by the reflecting mirror 11, is focused by the focusing mirror 7C housed in the focusing head 6C, and is processed. The workpiece 5C on the table 5C is irradiated with light.

そして、加工テーブル5A上のワーク5aを加工すると
きには、図示しない制御装置からの指令で第3図のよう
に反射@3 aをレーザ光路上に下ろしてレーザ光2を
集光ミラー7Aに伝送し、加工テーブル5B上のワーク
5bを加工するときには、反射鏡3aを退避させ反射鏡
3bを同じくレーザ光路上に出して集光ミラー7Bに伝
送する。
When processing the workpiece 5a on the processing table 5A, the laser beam 2 is transmitted to the condensing mirror 7A by lowering the reflection@3a onto the laser beam path as shown in FIG. 3 by a command from a control device (not shown). When processing the workpiece 5b on the processing table 5B, the reflecting mirror 3a is retracted and the reflecting mirror 3b is placed on the laser beam path to transmit the laser beam to the condensing mirror 7B.

更に、レーザ発振器1の出力側には、He −Neレー
ザ発振器7が設けられたHe−Neレーザ切換装置4が
取付けられ、このHe−Neレーザ切換装置4内には、
図示しない制御装置で移動される反射ミラー4aが取付
られている。
Furthermore, a He-Ne laser switching device 4 equipped with a He-Ne laser oscillator 7 is attached to the output side of the laser oscillator 1, and inside this He-Ne laser switching device 4,
A reflecting mirror 4a that is moved by a control device (not shown) is attached.

なお、第3図において、ワーク5a、5b及び5Cを同
時に加工するレーザ加工装置では、反射鏡3 a、 3
 bに半透過鏡を使い、固定する方法もある。
In addition, in FIG. 3, in a laser processing apparatus that processes works 5a, 5b, and 5C at the same time, reflecting mirrors 3a, 3
Another method is to use a semi-transparent mirror for b.

このように構成したレーザ加工装置において、今、加工
テーブル5A上で溶接されるワーク5aの開先線のレー
ザ光の焦点合せなどをするときには、レーザ発振器1か
らのレーザ光2の出射を止め、反射Xi 4 aをレー
ザ光2の光路に出してHeNeレーザ光7aをワーク5
aに当てて行う。
In the laser processing apparatus configured as described above, when focusing the laser beam on the groove line of the work 5a to be welded on the processing table 5A, the emission of the laser beam 2 from the laser oscillator 1 is stopped, The reflected Xi 4 a is sent to the optical path of the laser beam 2, and the HeNe laser beam 7a is directed to the workpiece 5.
Perform by applying to a.

そして、もし隣接する加工テーブル5Bのワーク5bを
取換えて別の加工をするときには、ワーク5aの位置合
せが終ってから行う。
If the workpiece 5b on the adjacent processing table 5B is to be replaced with another workpiece, this is done after the positioning of the workpiece 5a is completed.

(発明が解決しようとする課題) しかし、そのときに反射ff1fi 4 aをレーザ光
2の光路に突き出すため、前述のように発振器1を停め
るが、図示しないダンプコーンなどでレーザ光2の伝送
を止めて他の加工テーブルの加工も中止しなければなら
ない。これは、加工テーブル5C上のワーク5Cを取り
付けるときも同様で、とくに、溶接ヤ熱処理等の段取り
の回数が多く、時間も長い作業ではとくに設備の稼動率
が下がる。
(Problem to be Solved by the Invention) However, at this time, in order to project the reflected ff1fi 4 a into the optical path of the laser beam 2, the oscillator 1 is stopped as described above, but the transmission of the laser beam 2 is stopped using a dump cone (not shown) or the like. The machine must be stopped and machining on other machining tables must also be stopped. This is also the case when attaching the workpiece 5C on the processing table 5C, and the operating rate of the equipment decreases especially in operations that require a large number of setups such as welding or heat treatment and take a long time.

そこで、本発明の目的は、複数の加工テーブルを備えた
レーザ加工装置の稼動率を上げることのできるレーザ加
工装置を得ることでおる。
SUMMARY OF THE INVENTION Therefore, an object of the present invention is to obtain a laser processing apparatus that can increase the operating rate of a laser processing apparatus equipped with a plurality of processing tables.

[発明の構成] (課題を解決するための手段と作用) 本発明は、レーザ発振器から出射されたレーザ光を複数
の反射鏡で折り曲げて集光ヘッドに伝送し、複数の加工
テーブル上のワークに照射してこのワークを加工するレ
ーザ加工装置において、上記複数の反射鏡と各集光ヘッ
ド間に、進退自在に反射鏡を収納したHe−Neレーザ
光切換装置を設けて、ワークの段取り中の他の加工テー
ブル上のワークの加工を可能にして設備の稼動率を上げ
たレーザ加工装置でおる。
[Structure of the Invention] (Means and Effects for Solving the Problems) The present invention bends laser light emitted from a laser oscillator with a plurality of reflecting mirrors and transmits it to a condensing head, thereby collapsing a laser beam onto a plurality of workpieces on processing tables. In a laser processing device that processes a workpiece by irradiating the workpiece, a He-Ne laser beam switching device in which a reflecting mirror is housed so as to be able to move forward and backward is provided between the plurality of reflecting mirrors and each focusing head, and the He-Ne laser beam switching device is installed between the plurality of reflecting mirrors and each of the focusing heads. This is a laser processing device that can process workpieces on other processing tables, increasing the operating rate of the equipment.

(実施例) 以下、本発明のレーザ加工装置の一実施例を図面を参照
して説明する。但し、第3図と重複する部分は省く。
(Example) Hereinafter, an example of the laser processing apparatus of the present invention will be described with reference to the drawings. However, parts that overlap with Figure 3 are omitted.

第1図において、レーザ切換装置3Aと集光ヘッド間に
は、図示しない制御装置からの指令で進退する反射鏡9
Aを収納したHe−Ne切換装置8Aが取付られ、同じ
く、レーザ切換装置3Bと集光ヘッド6B間と反射鏡1
1と集光ヘッド6C間にもHe−Ne切換装置88.8
Cが取付けられている。
In FIG. 1, between the laser switching device 3A and the focusing head, there is a reflecting mirror 9 that moves forward and backward according to commands from a control device (not shown).
A He-Ne switching device 8A containing A is installed, and similarly between the laser switching device 3B and the focusing head 6B and the reflecting mirror 1.
There is also a He-Ne switching device 88.8 between 1 and the focusing head 6C.
C is installed.

このように構成したレーザ加工装置において、今、ワー
ク5aを取替えて焦点合せなどの段取りをするときには
、反射鏡3aを退避させてHe −Neレーザ装置の反
射19Aをレーザ光2の光路に出しHe−Neレーザ光
を集光ミラー7Aで集光しワーク5aに当てて行う。す
ると、この間にレーザ光2は反射ミラー3bで加工テー
ブル5Bへ送ることができ、ワーク5b及び又はワーク
5Cの加工を行うことができる。
In the laser processing apparatus configured as described above, when changing the workpiece 5a and making preparations such as focusing, the reflector 3a is retracted and the reflection 19A of the He-Ne laser device is brought out into the optical path of the laser beam 2. -Ne laser light is focused by a condensing mirror 7A and applied to the workpiece 5a. Then, during this time, the laser beam 2 can be sent to the processing table 5B by the reflection mirror 3b, and the work 5b and/or the work 5C can be processed.

又、同じくワーク5bを取替えて新しいワークの段取り
をするときには、反射鏡3bを退避させ反!149Bを
光路に出して行う。
Similarly, when replacing the workpiece 5b and setting up a new workpiece, the reflector 3b should be retracted and the mirror 3b should be moved away! 149B to the optical path.

したがって、溶接や熱処理などの段取り時間・回数の多
い作業では、レーザ加工装置の稼動率をとくに上げるこ
とができる。
Therefore, the operating rate of the laser processing apparatus can be particularly increased in operations such as welding and heat treatment that require a large number of setup times.

第2図は本発明のレーザ加工機の他の実施例を示し、集
光ヘッド6Aの側面には収納室6aが設けられ、この収
納ff1ea内には下部に図示しない集光ミラーと駆動
装置15を備えた可視領域のレーザ光14を出す半導体
レーザ装置13が図示しない制御装置で左右に移動自在
に収納されている。
FIG. 2 shows another embodiment of the laser processing machine of the present invention, in which a storage chamber 6a is provided on the side surface of the focusing head 6A, and inside this storage ff1ea, a focusing mirror (not shown) and a driving device 15 are provided at the bottom. A semiconductor laser device 13 that emits a laser beam 14 in the visible region is housed so as to be movable left and right by a control device (not shown).

この場合でも第1図と同じく、あるテーブルで加工中に
伯のテーブルのワークの位置合せを行うことができる。
In this case as well, as in FIG. 1, it is possible to align the workpiece on the table during machining with a certain table.

なお、この場合には、半導体レーザ装置の代りに発光ダ
イオードを使って小形化を図ってもよい。
In this case, a light emitting diode may be used instead of the semiconductor laser device to achieve miniaturization.

なお、上記実施例ではレーザ光の分岐にレーザ光切換装
置を使ったが、代りに従来と同様に半透過鏡を使っても
よい。
In the above embodiment, a laser beam switching device is used to branch the laser beam, but a semi-transmissive mirror may be used instead as in the conventional case.

[発明の効果] 以上、本発明のレーザ加工装置によれば、レーザ発振器
から出射されたレーザ光を複数の反射鏡と集光ヘッドを
経て複数の加工テーブルへ伝送するレーザ加工装置にお
いて、複数の反!)1鏡と集光ヘッド間に、可視光線を
出射し反射鏡を進退自在に収納したHe−Neレーザ光
切換装置を設けたので、ある加工テーブル上のワークの
段取り中に他の加工テーブルで加工することができ、設
備稼動率を上げることのできるレーザ加工装置を1qる
ことかできる。
[Effects of the Invention] As described above, according to the laser processing device of the present invention, the laser processing device transmits the laser beam emitted from the laser oscillator to the plurality of processing tables via the plurality of reflecting mirrors and the focusing head. Against! ) A He-Ne laser beam switching device that emits visible light and houses a reflecting mirror that can move forward and backward is installed between the mirror and the condensing head. It is possible to install 1q of laser processing equipment that can perform processing and increase the equipment operating rate.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のレーザ加工装置の一実施例を示す図、
第2図は本発明のレーザ加工装置の他の実施例を示す要
部詳細図、第3図は従来のレーザ加工装置を示す図であ
る。 1・・・レーザ発振器 2・・・レーザ光 3a 、 3b 、 3C=−反QJ鏡5A、5B、5
C・・・加工テーブル
FIG. 1 is a diagram showing an embodiment of the laser processing apparatus of the present invention,
FIG. 2 is a detailed view of main parts showing another embodiment of the laser processing apparatus of the present invention, and FIG. 3 is a diagram showing a conventional laser processing apparatus. 1...Laser oscillator 2...Laser beams 3a, 3b, 3C=-anti-QJ mirrors 5A, 5B, 5
C...Processing table

Claims (1)

【特許請求の範囲】 レーザ発振器から出射されたレーザ光を複数の反射鏡で
折り曲げて集光ヘッドに伝送し、複数の加工テーブル上
のワークに照射してこのワークを加工するレーザ加工装
置において、 前記複数の反射鏡と前記集光ヘッド間に、進退自在に反
射鏡を収納したHe−Neレーザ光切換装置を設けたこ
とを特徴とするレーザ加工装置。
[Scope of Claims] A laser processing device that processes a workpiece by bending a laser beam emitted from a laser oscillator by a plurality of reflecting mirrors and transmitting it to a focusing head, and irradiating the workpiece onto a plurality of processing tables, A laser processing apparatus characterized in that a He-Ne laser beam switching device in which a reflecting mirror is housed so as to be movable back and forth is provided between the plurality of reflecting mirrors and the focusing head.
JP63216275A 1988-09-01 1988-09-01 Laser processing machine Pending JPH0270396A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63216275A JPH0270396A (en) 1988-09-01 1988-09-01 Laser processing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63216275A JPH0270396A (en) 1988-09-01 1988-09-01 Laser processing machine

Publications (1)

Publication Number Publication Date
JPH0270396A true JPH0270396A (en) 1990-03-09

Family

ID=16685987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63216275A Pending JPH0270396A (en) 1988-09-01 1988-09-01 Laser processing machine

Country Status (1)

Country Link
JP (1) JPH0270396A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6008469A (en) * 1997-03-27 1999-12-28 Mitsubishi Denki Kabushiki Kaisha Laser beam branching apparatus
CN109954969A (en) * 2019-03-29 2019-07-02 中国航空制造技术研究院 The flexible switching method of Laser Deep Penetration Welding and laser post-treatment welding

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6008469A (en) * 1997-03-27 1999-12-28 Mitsubishi Denki Kabushiki Kaisha Laser beam branching apparatus
CN109954969A (en) * 2019-03-29 2019-07-02 中国航空制造技术研究院 The flexible switching method of Laser Deep Penetration Welding and laser post-treatment welding
CN109954969B (en) * 2019-03-29 2021-04-13 中国航空制造技术研究院 Flexible switching method for laser deep melting welding and laser modification welding

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