JPH0269620U

JPH0269620U -

Info

Publication number: JPH0269620U
Application number: JP14864888U
Authority: JP
Priority date: 1988-11-14
Filing date: 1988-11-14
Publication date: 1990-05-28

Description

[Brief explanation of the drawing]

第１図Ａ，Ｂは本考案の一実施例を示し、図Ａ
は正面図、図Ｂは図ＡをＺ―Ｚ方向から見た上面
図、第２図は第１図ＡのＸ―Ｘ断面図、第３図及
び第４図はそれぞれぞれ本考案の動作を説明する
正面図、第５図は従来のＩＣ分離機構の正面図、
第６図は第５図のＹ―Ｙ断面図、第７図及び第８
図はそれぞれ従来の動作を説明する正面図である
。１……シユーターガイド、２……Ｌ型部、３…
…回転駆動体、４……回転シヤフト、５……ドラ
イブローラ、６……枠、７……ガイドシヤフト、
８……ピン、９……圧縮ばね、１０……プツシユ
ローラ、１１……第１ＩＣ、１２……第２ＩＣ、
１３……シユーターガイド、１４……Ｌ型部、１
５……第１ロツド、１６……第１直進駆動体、１
７……第２ロツド、１８……第２直進駆動体、１
９……第１ＩＣ、２０……第２ＩＣ。 Figures 1A and 1B show an embodiment of the present invention;
is a front view, Figure B is a top view of Figure A seen from the Z-Z direction, Figure 2 is a XX cross-sectional view of Figure 1 A, and Figures 3 and 4 respectively illustrate the operation of the present invention. FIG. 5 is a front view of a conventional IC separation mechanism.
Figure 6 is a Y-Y sectional view of Figure 5, Figures 7 and 8.
Each figure is a front view for explaining the conventional operation. 1...Shooter guide, 2...L-shaped part, 3...
... Rotating drive body, 4... Rotating shaft, 5... Drive roller, 6... Frame, 7... Guide shaft,
8... Pin, 9... Compression spring, 10... Push roller, 11... First IC, 12... Second IC,
13...Shooter guide, 14...L-shaped part, 1
5...First rod, 16...First linear drive body, 1
7...Second rod, 18...Second linear drive body, 1
9...1st IC, 20...2nd IC.

Claims

[Scope of utility model registration request]

I separate and send out a large number of ICs loaded in a line along the slope of the shooter guide one by one.
In the C separation mechanism, a push roller which elastically presses the upper surface of the lower IC of the loaded ICs via a spring and moves up and down; A roller mechanism is provided, which has a drive roller that contacts the bottom surface of the IC, and rotates the drive roller at a certain angle to send out the bottom IC using frictional force, while at the same time pinching the next IC to stop it from sliding down. An IC separation mechanism characterized by being provided with.