JPH0268496A - Heat exchanger - Google Patents
Heat exchangerInfo
- Publication number
- JPH0268496A JPH0268496A JP21776788A JP21776788A JPH0268496A JP H0268496 A JPH0268496 A JP H0268496A JP 21776788 A JP21776788 A JP 21776788A JP 21776788 A JP21776788 A JP 21776788A JP H0268496 A JPH0268496 A JP H0268496A
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- ram air
- cooled
- elements
- compressed air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims abstract description 12
- 239000012809 cooling fluid Substances 0.000 claims abstract description 11
- 238000004378 air conditioning Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
Ａ０発明の目的
（１）産業上の利用分野
本発明は熱交換器に関し、特に、航空機等の空気調和シ
ステムに用いるのに好適な熱交換器に関する。DETAILED DESCRIPTION OF THE INVENTION A0 Object of the Invention (1) Field of Industrial Application The present invention relates to a heat exchanger, and particularly to a heat exchanger suitable for use in an air conditioning system of an aircraft or the like.
（２）従来の技術
一般に、ジェットエンジンを備えた航空機では、ジェッ
トエンジンのコンプレッサで圧縮されたエアの一部を、
機外から採り入れた低温のラムエアにより冷却して、こ
の冷却した圧縮エアを各種機器のクーリングに使用して
いる。(2) Conventional technology In general, in aircraft equipped with a jet engine, a portion of the air compressed by the jet engine compressor is
It is cooled by low-temperature ram air taken from outside the machine, and this cooled compressed air is used to cool various equipment.
前記圧縮エアの冷却は、従来、熱伝導プレートの両側面
上に圧縮エア用流路およびラムエア用流路をそれぞれ備
えた熱交換器を用いて、高温の圧縮エア側から低温のラ
ムエア側に熱伝導プレートを介して熱を直接伝導させる
ことにより行っている。Conventionally, the compressed air is cooled using a heat exchanger that has a compressed air flow path and a ram air flow path on both sides of a heat conduction plate, and heat is transferred from the high temperature compressed air side to the low temperature ram air side. This is done by directly conducting heat through conductive plates.
却流体用流路を形成し、他方の外側に被冷却流体（３）
発明が解決しようとする課題
しかし、前記従来の熱交換器による圧縮エアの冷却方法
では、例えば航空機が低空を飛行していたり地上を走行
していたりするような場合、温度の低いラムエアを多量
に得ることができず、圧縮エアを効率よく冷却すること
ができないという問題点があった。A flow path for cooling fluid is formed, and a fluid to be cooled (3) is formed on the other outside.
Problems to be Solved by the Invention However, with the conventional method of cooling compressed air using a heat exchanger, for example, when an aircraft is flying at a low altitude or traveling on the ground, it is difficult to use a large amount of low-temperature ram air. There was a problem that the compressed air could not be efficiently cooled.
本発明は前述の事情に鑑みてなされたもので、温度の低
いラムエア（冷却流体）が多量に得られない場合でも、
圧縮エア（被冷却流体）を効率よく冷却できるようにす
ることを課題とする。The present invention was made in view of the above-mentioned circumstances, and even when a large amount of low-temperature ram air (cooling fluid) is not available,
The objective is to efficiently cool compressed air (fluid to be cooled).
Ｂ８発明の構成
（１）課題を解決するための手段
前記課題を解決するために本発明は、同じ型のペルチェ
素子によって接続されるとともに間隔を保たれた一対の
導電性プレートの一方の外側に冷用流路を形成したこと
を特徴とする。B8 Structure of the Invention (1) Means for Solving the Problems In order to solve the above problems, the present invention provides a method for solving the problems described above. It is characterized by forming a cooling flow path.
（２）作 用
前記構成によれば、ペルチェ素子の被冷却流体用流路側
の部分で吸熱して、ペルチェ素子の冷却流体用流路側の
部分で放熱するようにペルチェ素子に電流を流すと、ペ
ルチェ素子は被冷却流体から熱を奪って、冷却流体に放
熱する。(2) Effect According to the above configuration, when a current is passed through the Peltier element so that heat is absorbed in the part of the Peltier element on the side of the flow path for the fluid to be cooled, and heat is radiated in the part of the Peltier element on the side of the flow path for the cooling fluid, The Peltier element removes heat from the fluid to be cooled and radiates it to the cooling fluid.
（３）実施例
以下、図面に基づいて本発明による熱交換器を航空機の
空気調和システムに適用した場合の一実施例を説明する
。(3) Example Hereinafter, an example in which the heat exchanger according to the present invention is applied to an air conditioning system of an aircraft will be described based on the drawings.
第１図において、本実施例の熱交換器Ｈは、図示しない
ハウジングの内部に、銅、アルミニウム、ステンレス等
により形成された導電性プレート１゜１ ・・・を複数
枚備えている。これらの導電性プレト］、 ］、・・
・は、互いに所定の間隔をおいて配置されており、これ
らの導電性プレー１−１．１・・・によって画成される
複数段の空隙のうち、上方から（または下方から）偶数
番目に位置する空隙によってペルチェ素子配列部２，２
．・・・が構成されている。このペルチェ素子配列部２
，２．・・・には、上段（第１図中、上から２番目の空
隙）から順に、複数個のＮ型ペルチェ素子３および複数
個のＰ型ペルチェ素子４が交互に配列されている。In FIG. 1, the heat exchanger H of this embodiment includes a plurality of conductive plates 1.1 made of copper, aluminum, stainless steel, etc., inside a housing (not shown). These conductive plates], ],...
・ are arranged at a predetermined interval from each other, and among the multiple stages of gaps defined by these conductive plays 1-1.1... Peltier element arrangement parts 2, 2 depending on the space located
．． ...is configured. This Peltier element array section 2
,2. ..., a plurality of N-type Peltier elements 3 and a plurality of P-type Peltier elements 4 are arranged alternately in order from the upper stage (the second gap from the top in FIG. 1).
そして、これらのペルチェ素子３．４によって各ペルチ
ェ素子配列部２を構成する上、下一対の前記導電性プレ
ート１，１が接続されている。The upper and lower pairs of conductive plates 1, 1 forming each Peltier element array section 2 are connected by these Peltier elements 3.4.
ペルチェ素子配列部２の幅方向（第１図中、Ｘ方向）一
端部は、図示しない航空機の機体に設けられたラムエア
（冷却流体）取入口５に連通し途中に開閉弁６が介装さ
れた第１ラムエア導入路７に接続され、他端部は熱交換
後のラムエアの排気路（図示せず）に接続されている。One end in the width direction (X direction in FIG. 1) of the Peltier element array section 2 communicates with a ram air (cooling fluid) intake port 5 provided in the body of an aircraft (not shown), and an on-off valve 6 is interposed in the middle. The other end is connected to a first ram air introduction path 7, and the other end is connected to an exhaust path (not shown) for ram air after heat exchange.
そして第１うムエア導入路７よりペルチェ素子配列部２
の複数のＮ型ペルチェ素子３．３．・・・またはＰ型ペ
ルチェ素子４，４．・・・間に流入したラムエアは矢印
Ａ方向に排出される。ペルチェ素子配列部２の長手方向
（第１図中、Ｘ方向）両端部には、このペルチェ素子配
列部２の内部に圧縮エア（被冷却流体）が流入するのを
防ぐ閉鎖部材８が設けられている。また前記複数枚の導
電性プレート１．１・・・のうち、最上段および最下段
に位置するプレートは途中にスイッチ９を備えたリード
線等を介して電源１０の＋側および一側にそれぞれ接続
されでいる。Then, from the first air introduction path 7 to the Peltier element arrangement section 2.
A plurality of N-type Peltier elements 3.3. ...or P-type Peltier element 4, 4. ...The ram air that has flowed in between is discharged in the direction of arrow A. Closing members 8 are provided at both ends in the longitudinal direction (X direction in FIG. 1) of the Peltier element array section 2 to prevent compressed air (fluid to be cooled) from flowing into the Peltier element array section 2. ing. Further, among the plurality of conductive plates 1.1..., the plates located at the top and bottom are connected to the + side and one side of the power supply 10, respectively, via lead wires with a switch 9 in the middle. Connected.
前記複数枚の導電性プレー１−１．１．・・・によって
画成される複数段の空隙のうち、奇数番目に位置する空
隙によってラムエア用流路（冷却流体用流路）１１およ
び圧縮エア用流路（被冷却流体用流路）１２が構成され
ている。前記両流路１１゜１２は、本実施例では上段（
第１図中、最上段の空隙）から下段に向けて、ラムエア
用流路１１と圧縮エア用流路１２とが交互に配置されて
いる。The plurality of conductive plates 1-1.1. The ram air flow path (cooling fluid flow path) 11 and the compressed air flow path (cooled fluid flow path) 12 are formed by the odd-numbered air gaps among the multiple stages of air gaps defined by... It is configured. In this embodiment, both the flow paths 11 and 12 are connected to the upper stage (
In FIG. 1, ram air passages 11 and compressed air passages 12 are alternately arranged from the top gap to the bottom.
ラムエア用流路１１の内部には、導電性を有する１枚の
波形板によって、幅方向（第１図中、Ｘ方向）に沿って
延びる多数のフィン１３が形成されている。このラムエ
ア用流路１１の幅方向一端部は、前記ラムエア取入口５
に連通し途中に開閉弁１４が介装された第２ラムエア導
入路１５に接続され、他端部は熱交換後のラムエアの排
気路（図示せず）に接続されている。そして、第２ラム
エア導入路１５よりラムエア用流路１工に流入したラム
エアは矢印Ｂ方向に排出される。またラムエア用流路１
１の長手方向（第１図中、Ｙ方向）両端部には、このラ
ムエア用流路１１に圧縮エアが流入するのを防く閉鎖部
材１６が設レノられている。Inside the ram air flow path 11, a large number of fins 13 extending along the width direction (X direction in FIG. 1) are formed by a single conductive corrugated plate. One end in the width direction of this ram air passage 11 is connected to the ram air intake port 5.
The second ram air introduction passage 15 is connected to a second ram air introduction passage 15 having an on-off valve 14 interposed therebetween, and the other end is connected to an exhaust passage (not shown) for ram air after heat exchange. The ram air that has flowed into the ram air passage 1 from the second ram air introduction passage 15 is discharged in the direction of arrow B. Also, ram air flow path 1
Closing members 16 for preventing compressed air from flowing into the ram air flow path 11 are provided at both ends of the ram air flow path 11 in the longitudinal direction (Y direction in FIG. 1).
前記圧縮エア用流路１２の内部には、前記ラムエア用流
路１１の場合と同様に、導電性を有する１枚の波形板に
よって、長手方向（第１図中、Ｙ方向）に沿って延びる
多数のフィン１７が形成されている。この圧縮エア用流
路１２の長手方向−端部は、図示しないジェットエンジ
ンのコンプレツサ１８に連通する圧縮エア導入路１９に
接続され、他端部は熱交換後の冷却された圧縮エアを機
内の各種機器に導くクーリング用エア供給路（図示セず
）に接続されている。そして圧縮エア導入路１９より圧
縮エア用流路１２に流入したラムエアは矢印Ｃ方向に送
られる。また、圧縮エア用流路１２の幅方向（第１図中
、Ｘ方向）両端部には、この圧縮エア用流路１２にラム
エアが流入するのを防ぐ閉鎖部材２０が設けられている
。Inside the compressed air flow path 12, as in the case of the ram air flow path 11, a single conductive corrugated plate extends along the longitudinal direction (Y direction in FIG. 1). A large number of fins 17 are formed. The longitudinal end of this compressed air flow path 12 is connected to a compressed air introduction path 19 that communicates with a compressor 18 of a jet engine (not shown), and the other end is connected to a compressed air introduction path 19 that communicates with a compressor 18 of a jet engine (not shown), and the other end of the compressed air flow path 12 is connected to a compressed air introduction path 19 that communicates with a compressor 18 of a jet engine (not shown). It is connected to a cooling air supply path (not shown) that leads to various devices. The ram air flowing into the compressed air flow path 12 from the compressed air introduction path 19 is sent in the direction of arrow C. Further, closing members 20 are provided at both ends of the compressed air flow path 12 in the width direction (X direction in FIG. 1) to prevent ram air from flowing into the compressed air flow path 12.
次に、前述の構成を備えた本実施例の作用を説明する。Next, the operation of this embodiment having the above-described configuration will be explained.
電源１０のスイッチ９を入れて導電性プレート１、フィ
ン１３．１７および両ペルチェ素子３゜４に直流電流を
流すと、Ｎ型ペルチェ素子３は＋側で放熱、−例で吸熱
し、またＰ型ペルチェ素子４は＋側で吸熱、−側で放熱
する。本実施例では、第１図に示すように両ペルチェ素
子３．４の上方が＋側、下方が一例となるように両ペル
チェ素子３．４が電源１０に接続されているので、第１
２図において、Ｎ型およびＰ型の各ペルチェ素子３．４
は圧縮エア用流路１２側で吸熱し、ラムエア用流路１１
側で放熱する。そこで、航空機の飛行中に第１．第２ラ
ムエア導入路７．１５に介装された開閉弁６．１４を開
弁状態にして、ラムエア取入口５からラムエアをペルチ
ェ素子配列部２およびラムエア用流路１１に導くと、前
記両ペルチェ素子３，４は圧縮エア用流路１２を流れる
高温の圧縮エアから熱を奪いそれをラムエア用流路１１
を流れる低温のラムエアに放熱する。したがって圧縮エ
アは、各ペルチェ素子配列部２に配列されたＮ型ペルチ
ェ素子３またはＰ型ペルチェ素子４間を流れるラムエア
によって冷却されると同時に、前記両ペルチェ素子３．
４の作用によっても冷却されるので、例えば航空機が低
空を飛行中であって温度の低いラムエアを多量に得られ
ないような場合でも圧縮エアを効率よく冷却することが
できる。When the switch 9 of the power supply 10 is turned on and a direct current flows through the conductive plate 1, the fins 13.17, and both Peltier elements 3.4, the N-type Peltier element 3 radiates heat on the + side, absorbs heat on the - side, and The type Peltier element 4 absorbs heat on the + side and radiates heat on the - side. In this embodiment, as shown in FIG. 1, both Peltier elements 3.4 are connected to the power supply 10 so that the upper side of both Peltier elements 3.4 is the + side, and the lower side is connected to the power supply 10.
In Figure 2, each N-type and P-type Peltier element 3.4
absorbs heat on the compressed air flow path 12 side, and the ram air flow path 11
Dissipate heat on the side. Therefore, during the flight of the aircraft, the first When the on-off valve 6.14 installed in the second ram air introduction path 7.15 is opened and ram air is introduced from the ram air intake port 5 to the Peltier element array section 2 and the ram air flow path 11, both the Peltier The elements 3 and 4 take heat from the high temperature compressed air flowing through the compressed air flow path 12 and transfer it to the ram air flow path 11.
The heat is radiated to the low-temperature ram air flowing through. Therefore, the compressed air is cooled by the ram air flowing between the N-type Peltier elements 3 or the P-type Peltier elements 4 arranged in each Peltier element array section 2, and at the same time, the compressed air is cooled by the ram air flowing between the N-type Peltier elements 3 or the P-type Peltier elements 4 arranged in each Peltier element arrangement section 2.
Since the compressed air is also cooled by the action of 4, the compressed air can be efficiently cooled even when, for example, the aircraft is flying at a low altitude and a large amount of low-temperature ram air cannot be obtained.
また航空機が、温度の低いラムエアを多量に得ることの
できる高空を飛行中である場合には、ペルチェ素子３，
４に通電せずに、ペルチェ素子配列部２およびラムエア
用流路１１に流入するラムエアのみで圧縮エアを冷却す
ることもできる。この場合、第２ラムエア導入路１５例
の開閉弁】４を閉弁状態、第１ラムエア導入路７側の開
閉弁６を開弁状態として、ペルチェ素子配列部２にのみ
ラムエアを導入するようにしてもよい。Furthermore, when the aircraft is flying at a high altitude where a large amount of low-temperature ram air can be obtained, the Peltier element 3,
It is also possible to cool the compressed air only by the ram air flowing into the Peltier element array section 2 and the ram air flow path 11 without energizing the Peltier element array section 4 . In this case, the on-off valve 4 of the second ram air introduction path 15 is closed, and the on-off valve 6 on the first ram air introduction path 7 side is opened, so that ram air is introduced only into the Peltier element arrangement section 2. It's okay.
さらにペルチェ素子３．４に通電し、第１ラムエア導入
路７側の開閉弁６を閉弁状態、第２ラムエア導入路１５
側の開閉弁１４を開弁状態として、ラムエア用流路１１
にのみラムエアを流入させ、このラムエアとペルチェ素
子３．４とにより圧縮エアを冷却するようにしてもよい
。Further, the Peltier element 3.4 is energized, the on-off valve 6 on the first ram air introduction path 7 side is closed, and the second ram air introduction path 15 is closed.
With the on-off valve 14 on the side open, the ram air flow path 11
It is also possible to allow ram air to flow only into the ram air and cool the compressed air using the ram air and the Peltier element 3.4.
以上、本発明による熱交換器の一実施例を詳述したが、
本発明は、前記実施例に限定されるものではなく、特許
請求の範囲に記載された本発明を逸脱することなく、種
々の小設計変更を行うことが可能である。Above, one embodiment of the heat exchanger according to the present invention has been described in detail.
The present invention is not limited to the embodiments described above, and various minor design changes can be made without departing from the scope of the invention as set forth in the claims.
たとえば、本実施例では、ペルチェ素子配列部２および
両流路１１，１２をそれぞれ複数段に積層して熱交換器
を構成した例を示したが、−層のペルチェ素子配列部２
の両側に、ラムエア用流路１１および圧縮エア用流路１
２をそれぞれ一層だけ形成して熱交換器を構成すること
も可能である。For example, in this embodiment, an example is shown in which the heat exchanger is constructed by laminating the Peltier element arrangement section 2 and both flow channels 11 and 12 in multiple stages, but the Peltier element arrangement section 2 in the - layer
A ram air passage 11 and a compressed air passage 1 are provided on both sides of the
It is also possible to form a heat exchanger by forming only one layer of each of 2.
また、第１．第２ラムエア導入路７，１５に開閉弁６．
１４を設けずに、常にペルチェ素子配列部２およびラム
エア用流路１１の両方にラムエアを導入するように構成
することも可能である。Also, 1st. An on-off valve 6.
It is also possible to configure so that ram air is always introduced into both the Peltier element arrangement section 2 and the ram air flow path 11 without providing the ram air flow path 14.
さらに、本実施例では、航空機の空気調和システムに用
いる例を示したが、これに限られることはなく、被冷却
流体を冷却流体で冷却する形式であればどの様な熱交換
器にも適用することが可能である。Furthermore, although this example shows an example of use in an aircraft air conditioning system, the application is not limited to this, and can be applied to any type of heat exchanger that cools the fluid to be cooled with a cooling fluid. It is possible to do so.
Ｃ３発明の効果
前述の本発明の熱交換器によれば、温度の低い冷却流体
が多量に得られない場合でも、被冷却流体を効率よく冷
却することができる。C3 Effects of the Invention According to the heat exchanger of the present invention described above, even when a large amount of low-temperature cooling fluid is not available, the fluid to be cooled can be efficiently cooled.
第１図は本発明の一実施例の一部省略全体斜視図、第２
Ｍは同実施例の要部の部分拡大断面図である。
１・・・導電性プレート、３・・・Ｎ型ペルチェ素子、
４・・・Ｐ型ペルチェ素子、１１・・・ラムエア用流路
（冷却流体用流路）、１２・・・圧縮エア用流路（被冷
却流体用流路）、Ｈ・・・熱交換器FIG. 1 is a partially omitted overall perspective view of one embodiment of the present invention, and FIG.
M is a partial enlarged sectional view of the main part of the same embodiment. 1... Conductive plate, 3... N-type Peltier element,
4... P-type Peltier element, 11... Ram air flow path (cooling fluid flow path), 12... Compressed air flow path (cooled fluid flow path), H... Heat exchanger
Claims (1)
を保たれた一対の導電性プレートの一方の外側に冷却流
体用流路を形成し、他方の外側に被冷却流体用流路を形
成した熱交換器。A heat exchanger in which a cooling fluid flow path is formed on the outside of one of a pair of conductive plates that are connected by the same type of Peltier element and are spaced apart, and a flow path for the cooled fluid is formed on the outside of the other. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63217767A JP2676811B2 (en) | 1988-08-31 | 1988-08-31 | Heat exchanger |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63217767A JP2676811B2 (en) | 1988-08-31 | 1988-08-31 | Heat exchanger |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0268496A true JPH0268496A (en) | 1990-03-07 |
| JP2676811B2 JP2676811B2 (en) | 1997-11-17 |
Family
ID=16709414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63217767A Expired - Fee Related JP2676811B2 (en) | 1988-08-31 | 1988-08-31 | Heat exchanger |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2676811B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5302801A (en) * | 1990-11-16 | 1994-04-12 | Mitsubishi Denki Kabushiki Kaisha | Laser bonding apparatus |
| US6334311B1 (en) * | 1999-03-05 | 2002-01-01 | Samsung Electronics Co., Ltd. | Thermoelectric-cooling temperature control apparatus for semiconductor device fabrication facility |
| JP2009059000A (en) * | 2007-08-29 | 2009-03-19 | Internatl Business Mach Corp <Ibm> | Technology for cooling device |
| DE102018116155A1 (en) * | 2018-07-04 | 2020-01-09 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | aircraft |
| CN115235682A (en) * | 2022-09-21 | 2022-10-25 | 无锡芯感智半导体有限公司 | Packaging structure and method of MEMS pressure sensor |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63133556A (en) * | 1986-11-26 | 1988-06-06 | Japan Steel Works Ltd:The | Equipment-cooling device using thermoelectric cooling element |
-
1988
- 1988-08-31 JP JP63217767A patent/JP2676811B2/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63133556A (en) * | 1986-11-26 | 1988-06-06 | Japan Steel Works Ltd:The | Equipment-cooling device using thermoelectric cooling element |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5302801A (en) * | 1990-11-16 | 1994-04-12 | Mitsubishi Denki Kabushiki Kaisha | Laser bonding apparatus |
| US6334311B1 (en) * | 1999-03-05 | 2002-01-01 | Samsung Electronics Co., Ltd. | Thermoelectric-cooling temperature control apparatus for semiconductor device fabrication facility |
| JP2009059000A (en) * | 2007-08-29 | 2009-03-19 | Internatl Business Mach Corp <Ibm> | Technology for cooling device |
| DE102018116155A1 (en) * | 2018-07-04 | 2020-01-09 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | aircraft |
| CN115235682A (en) * | 2022-09-21 | 2022-10-25 | 无锡芯感智半导体有限公司 | Packaging structure and method of MEMS pressure sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2676811B2 (en) | 1997-11-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |