JPH0268474U - - Google Patents
Info
- Publication number
- JPH0268474U JPH0268474U JP14916988U JP14916988U JPH0268474U JP H0268474 U JPH0268474 U JP H0268474U JP 14916988 U JP14916988 U JP 14916988U JP 14916988 U JP14916988 U JP 14916988U JP H0268474 U JPH0268474 U JP H0268474U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- wiring board
- printed wiring
- solder resist
- outer peripheral
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14916988U JPH0268474U (fr) | 1988-11-15 | 1988-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14916988U JPH0268474U (fr) | 1988-11-15 | 1988-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0268474U true JPH0268474U (fr) | 1990-05-24 |
Family
ID=31421155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14916988U Pending JPH0268474U (fr) | 1988-11-15 | 1988-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0268474U (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007036106A (ja) * | 2005-07-29 | 2007-02-08 | Shinano Kenshi Co Ltd | プリント基板及びその製造方法 |
| JPWO2010052942A1 (ja) * | 2008-11-06 | 2012-04-05 | イビデン株式会社 | 電子部品内蔵配線板及びその製造方法 |
| JP2021086983A (ja) * | 2019-11-29 | 2021-06-03 | 大日本印刷株式会社 | 配線基板 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255375B2 (fr) * | 1980-04-01 | 1987-11-19 | Nishimu Denshi Kogyo Kk |
-
1988
- 1988-11-15 JP JP14916988U patent/JPH0268474U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6255375B2 (fr) * | 1980-04-01 | 1987-11-19 | Nishimu Denshi Kogyo Kk |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007036106A (ja) * | 2005-07-29 | 2007-02-08 | Shinano Kenshi Co Ltd | プリント基板及びその製造方法 |
| JPWO2010052942A1 (ja) * | 2008-11-06 | 2012-04-05 | イビデン株式会社 | 電子部品内蔵配線板及びその製造方法 |
| JP2021086983A (ja) * | 2019-11-29 | 2021-06-03 | 大日本印刷株式会社 | 配線基板 |