JPH0268442U - - Google Patents

Info

Publication number
JPH0268442U
JPH0268442U JP1988147185U JP14718588U JPH0268442U JP H0268442 U JPH0268442 U JP H0268442U JP 1988147185 U JP1988147185 U JP 1988147185U JP 14718588 U JP14718588 U JP 14718588U JP H0268442 U JPH0268442 U JP H0268442U
Authority
JP
Japan
Prior art keywords
capillary
point
bonding
wire
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988147185U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0521883Y2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988147185U priority Critical patent/JPH0521883Y2/ja
Publication of JPH0268442U publication Critical patent/JPH0268442U/ja
Application granted granted Critical
Publication of JPH0521883Y2 publication Critical patent/JPH0521883Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07168—Means for storing or moving the material for the connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP1988147185U 1988-11-11 1988-11-11 Expired - Lifetime JPH0521883Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988147185U JPH0521883Y2 (cg-RX-API-DMAC7.html) 1988-11-11 1988-11-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988147185U JPH0521883Y2 (cg-RX-API-DMAC7.html) 1988-11-11 1988-11-11

Publications (2)

Publication Number Publication Date
JPH0268442U true JPH0268442U (cg-RX-API-DMAC7.html) 1990-05-24
JPH0521883Y2 JPH0521883Y2 (cg-RX-API-DMAC7.html) 1993-06-04

Family

ID=31417358

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988147185U Expired - Lifetime JPH0521883Y2 (cg-RX-API-DMAC7.html) 1988-11-11 1988-11-11

Country Status (1)

Country Link
JP (1) JPH0521883Y2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7717648B2 (ja) 2022-03-15 2025-08-04 株式会社東芝 半導体装置及び半導体装置の製造方法

Also Published As

Publication number Publication date
JPH0521883Y2 (cg-RX-API-DMAC7.html) 1993-06-04

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