JPH0267956A - Apparatus for detecting lead-open defect of electronic part - Google Patents
Apparatus for detecting lead-open defect of electronic partInfo
- Publication number
- JPH0267956A JPH0267956A JP63219666A JP21966688A JPH0267956A JP H0267956 A JPH0267956 A JP H0267956A JP 63219666 A JP63219666 A JP 63219666A JP 21966688 A JP21966688 A JP 21966688A JP H0267956 A JPH0267956 A JP H0267956A
- Authority
- JP
- Japan
- Prior art keywords
- reverberation
- lead
- noise
- vibration
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000007547 defect Effects 0.000 title claims description 26
- 238000001228 spectrum Methods 0.000 claims abstract description 21
- 238000001514 detection method Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 12
- 230000002950 deficient Effects 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 238000007689 inspection Methods 0.000 description 5
- 235000014676 Phragmites communis Nutrition 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000011179 visual inspection Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2697—Wafer or (micro)electronic parts
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はプリント基板に実装された電子部品のリード・
オープン不良を検出する電子部品のリード・オープン不
良検出方式に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention is directed to the lead and
The present invention relates to a lead open defect detection method for electronic components that detects open defects.
従来、プリント基板に実装されたＩＣ等の電子部品のリ
ードの半田付は不良を検出する装置としては、カメラを
用いた外観検査装置により検知する方法、或いは特開昭
６２−１３４９９６号公報に開示されているように、フ
ラット・パッケージのＩＣ端子部に対応して検出するプ
リント基板部を加熱し、フラット・パッケージのＩＣ端
子部の温度上昇（又は温度下降）の時間的変化を測定し
、その時間に対する温度勾配の違いから、リードの半田
付けの不良を判定しようとするもの等がある。Conventionally, devices for detecting defects in the soldering of leads of electronic components such as ICs mounted on printed circuit boards include a method of detecting defects using a visual inspection device using a camera, or a method disclosed in Japanese Patent Laid-Open No. 134996/1983. As described above, the printed circuit board section to be detected corresponding to the IC terminal section of the flat package is heated, and the temporal change in temperature rise (or temperature drop) of the IC terminal section of the flat package is measured. There are methods that attempt to determine poor soldering of leads based on differences in temperature gradients over time.
しかしながら、上記従来のカメラを用いた外観検査によ
る方法は、半田ブリッジ、半田ボールなどの外観観察で
できるものは検査できるが、リードの半田付は不良、即
ちリードオーブン不良を検出することができないという
欠点があった。However, although the above-mentioned method of visual inspection using a conventional camera can inspect solder bridges and solder balls that can be observed by visual inspection, it cannot detect defects in lead soldering, that is, lead oven defects. There were drawbacks.
また、特開昭６２−１３４９９６号公報に開示されたも
のは、リード・オープン不良に関する安定した検査が困
難な上、Ｘ線、レーザ光線等を使うため、危険であり、
装置コスト等検査に要する費用が高価となるという問題
があった。Furthermore, the method disclosed in Japanese Patent Application Laid-Open No. 134996/1983 is difficult to perform stable inspections for lead open defects, and is dangerous because it uses X-rays, laser beams, etc.
There has been a problem in that the costs required for testing, such as equipment costs, are expensive.
また、上記従来技術に示されている方法では、その不良
検出精度を確保するため、同時に電子部品のリードの１
部しか検査することができず、検査にかかる時間が長い
という問題もあった。In addition, in the method shown in the above-mentioned prior art, in order to ensure defect detection accuracy, one of the leads of the electronic component is
There was also the problem that it was only possible to inspect parts of the body, and the inspection took a long time.
本発明は上述の点に鑑みてなされたもので、上記従来の
不良の種類による検査不良や、装置のコストの上昇、安
全性の問題を除去し、検査時間の短い電子部品のリード
・オープン不良検出装置を提供することにある。The present invention has been made in view of the above points, and eliminates the conventional inspection defects due to the types of defects, increased equipment costs, and safety problems, and eliminates lead open defects of electronic components with short inspection time. The object of the present invention is to provide a detection device.
上記課題を解決するため本発明は、電子部品のリード・
オープン不良検出装置を、基板上に半田付は実装されて
いる電子部品に音波の形で機械的振動を与える振動付与
手段と、該振動付与手段からの振動により電子部品が発
生する共振特性を残響スペクトルとして測定する手段と
、該測定された残響スペクトル中にリード・オープン不
良を原因とする周波数成分が含まれているか否かを判定
する判定手段とで構成した。In order to solve the above problems, the present invention has been developed to solve the above problems.
The open defect detection device includes a vibration applying means that applies mechanical vibration in the form of sound waves to electronic components soldered and mounted on a board, and a reverberation system that reproduces the resonance characteristics generated by the electronic components due to the vibrations from the vibration applying means. The apparatus includes means for measuring a spectrum, and determining means for determining whether or not the measured reverberation spectrum contains a frequency component caused by a lead open failure.
電子部品のリード・オープン不良検出装置を上記の如く
構成することにより、電子部品が具備する全てのリード
に音波という形で機械的振動を与え、その残響により電
子部品のリードの半田付けの不良を判定しているので、
リードの半田っけの良否をリード単位ではなくて電子部
品単位で判定することになり、リード・オープン不良検
出の高速化が図れる。従って上記従来の課題である検査
不良や、装置のコストの上昇、安全性の問題を除去する
ことができる。By configuring the electronic component lead open defect detection device as described above, mechanical vibration is applied in the form of sound waves to all the leads of the electronic component, and its reverberation can detect defective soldering of the electronic component leads. Since we are judging
The quality of the lead soldering is judged not for each lead but for each electronic component, which speeds up the detection of lead open defects. Therefore, it is possible to eliminate the above-mentioned conventional problems such as defective inspection, increase in device cost, and safety problems.
以下、本発明の一実施例を図面に基づいて説明する。 Hereinafter, one embodiment of the present invention will be described based on the drawings.
第１図は本発明に係る電子部品のリード・オープン不良
検出装置の全体構成を示すブロック図、第２図は電子部
品に与える機械的振動の入カバワースベクトルを示す図
、第３図（ａ）は電子部品がオーブンリードを持つ場合
の残響パワースペクトルを示す図、第３図（ｂ）は電子
部品がオーブンリードを持たない場合の残響パワースペ
クトルを示す図である。Fig. 1 is a block diagram showing the overall configuration of the electronic component lead open defect detection device according to the present invention, Fig. 2 is a diagram showing the input cover-worth vector of mechanical vibration applied to the electronic part, and Fig. 3 (a ) is a diagram showing the reverberation power spectrum when the electronic component has an oven reed, and FIG. 3(b) is a diagram showing the reverberation power spectrum when the electronic component does not have an oven reed.
第１図において、１は音波発生及び停止指令、残響測定
指令、正常晶と不良品のスペクトル比較・判断を行なう
コンピュータ、２は前記フンピユータ１からの指令によ
りホワイトノイズを発生するホワイトノイズ発生器、３
は前記ホワイトノイズ発生器２から発生されたホワイト
ノイズを所望の形に整形する帯域可変型バンドパスフィ
ルター ４は前記帯域可変型バンドパスフィルター３の
出力信号を増幅する増幅器、５は増幅された電気信号を
音波に変換するスピーカー ６は簡易型残響室、７は前
記簡易型残響室６の中の残響を計測する残響針、８は残
響のスペクトル特性を測定するスペクトラムアナライザ
ー８である。９ａは検査対象となるＩＣ等の電子部品で
あり、該電子部品９ａのリード９ｂはプリント基板９Ｃ
の上に半田付けされている。以下、上記構成の電子部品
のリード・オープン不良検出装置の動作を説明する。（
１）先ず、電子部品９ａのリード９ｂの機械的共振周波
数ｒ、を求める。In FIG. 1, numeral 1 is a computer that performs sound wave generation and stop commands, reverberation measurement commands, and spectra comparison and judgment between normal crystals and defective products; 2 is a white noise generator that generates white noise according to commands from the hump computer 1; 3
4 is a variable band band pass filter that shapes the white noise generated from the white noise generator 2 into a desired shape; 4 is an amplifier that amplifies the output signal of the variable band band filter 3; and 5 is an amplified electrical A speaker 6 that converts signals into sound waves is a simple reverberation chamber, 7 is a reverberation needle that measures the reverberation inside the simple reverberation chamber 6, and 8 is a spectrum analyzer 8 that measures the spectral characteristics of the reverberation. 9a is an electronic component such as an IC to be inspected, and the lead 9b of the electronic component 9a is connected to the printed circuit board 9C.
is soldered on top. The operation of the lead open defect detection device for electronic components having the above configuration will be described below. (
1) First, find the mechanical resonance frequency r of the lead 9b of the electronic component 9a.
（２）次に、第２・図に示すように、前記共振周波数ｆ
、を中心として略正規分布する入カバワースベクトルが
得られるように帯域可変型バンドパスフィルター３を調
整する。(2) Next, as shown in the second figure, the resonance frequency f
The variable band bandpass filter 3 is adjusted so as to obtain an input coverworth vector that is approximately normally distributed around .
（３〉コンピュータ１からホワイトノイズ発生器２にノ
イズに発生指令を送る。(3> The computer 1 sends a noise generation command to the white noise generator 2.
（４）ホワイトノイズ発生器２から発生されたホワイト
ノイズは帯域可変型バンドパスフィルター３で第２図に
示すように成形される。なお、第２図において、縦軸は
振動強度、横軸は周波数を示す。(4) The white noise generated by the white noise generator 2 is shaped by the band-variable bandpass filter 3 as shown in FIG. Note that in FIG. 2, the vertical axis represents vibration intensity, and the horizontal axis represents frequency.
（５）成形されたノイズ信号は増幅器４を通ってスピー
カー５にて機械的振動に変換され、電子部品９ａに与え
る。次に、この機械的振動を１０秒間継続して停止する
。(5) The shaped noise signal passes through the amplifier 4, is converted into mechanical vibration by the speaker 5, and is applied to the electronic component 9a. Next, this mechanical vibration is continued for 10 seconds and then stopped.
（６〉機械的振動停止後、１００ｍｓ ｅ ｃにコンピ
ュータ１から残響針７に計測開始信号を送る。(6> After the mechanical vibration stops, the computer 1 sends a measurement start signal to the reverberation needle 7 at 100 msec.
もし電子部品９ａのリード９ｂの内オーブンのリードが
あれば、そのリードの固有振動で残響が前記共振周波数
ｆ１の近傍に第３図（ａ）に示すように残る。これに対
して、リード９ｂの全てがプリント基板９ｃに半田付け
により固定されていると、第３図（ｂ）に示すように残
響は殆ど残らない。なお、第３図（ａ）、（ｂ）におい
て、縦軸は振動強度、横軸は周波数である。If there is an oven lead among the leads 9b of the electronic component 9a, reverberation will remain in the vicinity of the resonance frequency f1 due to the natural vibration of the lead as shown in FIG. 3(a). On the other hand, if all the leads 9b are fixed to the printed circuit board 9c by soldering, almost no reverberation remains as shown in FIG. 3(b). In FIGS. 3(a) and 3(b), the vertical axis represents vibration intensity and the horizontal axis represents frequency.
（７）残響は残響計７で電気信号に変換きれ、スペクト
ラムアナライザー８へ送られる。(7) The reverberation is converted into an electrical signal by the reverberation meter 7 and sent to the spectrum analyzer 8.
＜８）スペクトラムアナライザー８は残響スペクトルを
計箕し、コンピュータ１へ送ル。<8) Spectrum analyzer 8 measures the reverberation spectrum and sends it to computer 1.
（９）コンピュータ１では正常な電子部品９ａの残響ス
ペクトラムか、リード９ｂの半田付は不良、即ちリード
オーブン不良を持つ電子部品９ａの残響スペクトルかを
判定する。(9) The computer 1 determines whether the reverberation spectrum is the normal electronic component 9a or the reverberation spectrum is the reverberation spectrum of the electronic component 9a with defective soldering of the lead 9b, that is, a defective lead oven.
上記（１）乃至（９）の動作及び処理の流れにより、電
子部品９ａがオーブンのリードを持つか否かを判定でき
る。Through the operations and processing flow of (1) to (9) above, it can be determined whether the electronic component 9a has an oven lead.
上記（６）を補足して説明すると、残響時間は残響の程
度を表わす尺度であり、音源を断ってから簡易型残響室
６内の音の強さが６０ｄＢに減衰するのに要する時間で
ある。ここで、簡易型残響室６の体積をＶ（ｍ”）、表
面積Ｓ（ｍ”）、壁の平均吸音率をαとすれば、残響時
間Ｔ（ｓｅｅ）は、５ａｂｉｎｅの式
％式％
で表わされる。従って電子部品９ａがオーブンのノード
９ｂを持つ場合、その共振周波数ｆＩに対する減衰率α
は小さくなる。即ち、残響時間Ｔが大きくなり、残響ス
ペクトル中に共振周波数ｆ。To supplement (6) above, reverberation time is a measure of the degree of reverberation, and is the time required for the intensity of sound inside the simple reverberation chamber 6 to attenuate to 60 dB after cutting off the sound source. . Here, if the volume of the simple reverberation room 6 is V (m"), the surface area S (m"), and the average sound absorption coefficient of the wall is α, then the reverberation time T (see) is calculated using the formula % of 5abine. expressed. Therefore, if the electronic component 9a has an oven node 9b, the attenuation rate α for its resonance frequency fI
becomes smaller. That is, the reverberation time T increases, and the resonant frequency f appears in the reverberation spectrum.
の成分を多く含むことになる。It contains a lot of ingredients.
電子部品のリード・オープン不良検出装置を上記の如く
構成することにより、電子部品９ａが具備する全てのり
一ド９ｂに音波という形で機械的振動を与え、その残響
により電子部品９ａのり一ド９ｂの半田付けの不良を判
定しているので、リード９ｂの半田っけの良否をリード
単位ではなくて電子部品単位で判定することになり、リ
ード・オープン不良検出の高速化が図れる。また、帯域
可変型バンドパスフィルター３を使用するので、電子部
品９ａのリード９ｂの形状、長きに合わせて容易に条件
設定ができ、広い範囲の電子部品のリード・オープン不
良検出が可能となる。By configuring the lead open defect detection device for electronic components as described above, mechanical vibrations are applied in the form of sound waves to all the adhesives 9b included in the electronic component 9a, and the reverberation causes the electronic components 9a and adhesives 9b to Since the defective soldering of the lead 9b is determined, the quality of the soldering of the lead 9b is judged not on a lead-by-lead basis but on an electronic component-by-electronic component basis, thereby increasing the speed of lead open defect detection. Further, since the variable band bandpass filter 3 is used, conditions can be easily set according to the shape and length of the lead 9b of the electronic component 9a, making it possible to detect open lead defects in a wide range of electronic components.
なお、上記実施例では、電子部品のリードを半田付けし
て接続する例を示したが、本発明に係る電子部品のリー
ド・オープン不良検出装置は、半田つけによる接続に限
定されるものではなく、例えば導電性接着剤、又は異方
性導電性接着剤等でノードを接続する場合にも利用でき
る。In addition, in the above embodiment, an example was shown in which the leads of electronic components are connected by soldering, but the electronic component lead/open defect detection device according to the present invention is not limited to connection by soldering. It can also be used, for example, when connecting nodes with a conductive adhesive or an anisotropic conductive adhesive.
以上説明したように本発明によれば、電子部品に機械的
振動を与え、電子部品が発生する残響スペクトルにリー
ド・オープン不良を原因とする周波数成分が含まれてい
るか否かを判定するので、電子部品が具備する全てのリ
ードのリード・オープン不良の検出が可能となり、リー
ド・オープン不良の検出の高速化が図れるという優れた
効果が得られる。As explained above, according to the present invention, mechanical vibration is applied to the electronic component and it is determined whether or not the reverberation spectrum generated by the electronic component includes a frequency component caused by a lead open failure. It is possible to detect lead open defects of all the leads included in an electronic component, and the excellent effect of speeding up the detection of lead open defects can be obtained.
第１図は本発明に係る電子部品のリード・オープン不良
検出装置の全体構成を示すブロック図、第２図は電子部
品に与える機械的振動の入カバワースベクトルを示す図
、第３図（ａ）は電子部品がオーブンリードを持つ場合
の残響パワースペクトルを示す図、第３図（ｂ）は電子
部品がオーブンリードを持たない場合の残響パワースペ
クトルを示す図である。
図中、１・・・・コンピュータ、２・・・・ホワイトノ
イズ発生器、３・・・・帯域可変型バンドパスフィルタ
ー ４・・・・増幅器、５・・・・スピーカー ６・・
・・簡易型残響室、７・・・・残響計、８・・・・スペ
クトラムアナライザー ９ａ・・・・電子部品、９ｂ・
・・・リード、９ｃ・・・・プリント基板。Fig. 1 is a block diagram showing the overall configuration of the electronic component lead open defect detection device according to the present invention, Fig. 2 is a diagram showing the input cover-worth vector of mechanical vibration applied to the electronic part, and Fig. 3 (a ) is a diagram showing the reverberation power spectrum when the electronic component has an oven reed, and FIG. 3(b) is a diagram showing the reverberation power spectrum when the electronic component does not have an oven reed. In the figure, 1...computer, 2...white noise generator, 3...variable bandpass filter 4...amplifier, 5...speaker 6...
...Simple reverberation chamber, 7..Reverberation meter, 8..Spectrum analyzer 9a..Electronic components, 9b.
...Lead, 9c...Printed circuit board.
Claims (1)
振動付与手段と、該振動付与手段からの振動により電子
部品が発生する共振特性を残響スペクトルとして測定す
る手段と、該測定された残響スペクトル中にリード・オ
ープン不良を原因とする周波数成分が含まれているか否
かを判定する判定手段を具備することを特徴とする電子
部品のリード・オープン不良検出装置。A vibration applying means for applying mechanical vibration to an electronic component mounted on a substrate, a means for measuring resonance characteristics generated in the electronic component by vibration from the vibration applying means as a reverberation spectrum, and the measured reverberation spectrum. 1. A lead open defect detection device for an electronic component, comprising a determining means for determining whether or not a frequency component caused by a lead open defect is included.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63219666A JPH0267956A (en) | 1988-09-02 | 1988-09-02 | Apparatus for detecting lead-open defect of electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63219666A JPH0267956A (en) | 1988-09-02 | 1988-09-02 | Apparatus for detecting lead-open defect of electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267956A true JPH0267956A (en) | 1990-03-07 |
Family
ID=16739077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63219666A Pending JPH0267956A (en) | 1988-09-02 | 1988-09-02 | Apparatus for detecting lead-open defect of electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267956A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006093232A1 (en) | 2005-03-03 | 2006-09-08 | Tokyo Electron Limited | Minute structure inspection device, minute structure inspection method, and minute structure inspection program |
| WO2007018186A1 (en) * | 2005-08-11 | 2007-02-15 | Tokyo Electron Limited | Apparatus and method for inspecting fine structure and inspection program |
| US7348788B2 (en) | 2005-03-31 | 2008-03-25 | Tokyo Electron Limited | Probing card and inspection apparatus for microstructure |
| US7383732B2 (en) | 2004-06-11 | 2008-06-10 | Octec Inc. | Device for inspecting micro structure, method for inspecting micro structure and program for inspecting micro structure |
| JP2017524942A (en) * | 2014-08-08 | 2017-08-31 | サノフィ−アベンティス・ドイチュラント・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | Method, configuration, and drug delivery device for testing the mechanical integrity of a cartridge disposed within a device |
-
1988
- 1988-09-02 JP JP63219666A patent/JPH0267956A/en active Pending
Cited By (9)
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|---|---|---|---|---|
| US7383732B2 (en) | 2004-06-11 | 2008-06-10 | Octec Inc. | Device for inspecting micro structure, method for inspecting micro structure and program for inspecting micro structure |
| WO2006093232A1 (en) | 2005-03-03 | 2006-09-08 | Tokyo Electron Limited | Minute structure inspection device, minute structure inspection method, and minute structure inspection program |
| JPWO2006093232A1 (en) * | 2005-03-03 | 2008-08-07 | 東京エレクトロン株式会社 | Microstructure inspection apparatus, microstructure inspection method, and microstructure inspection program |
| US7726190B2 (en) | 2005-03-03 | 2010-06-01 | Tokyo Electron Limited | Device, method and program for inspecting microstructure |
| JP4628419B2 (en) * | 2005-03-03 | 2011-02-09 | 東京エレクトロン株式会社 | Microstructure inspection apparatus, microstructure inspection method, and microstructure inspection program |
| US7348788B2 (en) | 2005-03-31 | 2008-03-25 | Tokyo Electron Limited | Probing card and inspection apparatus for microstructure |
| WO2007018186A1 (en) * | 2005-08-11 | 2007-02-15 | Tokyo Electron Limited | Apparatus and method for inspecting fine structure and inspection program |
| JP2017524942A (en) * | 2014-08-08 | 2017-08-31 | サノフィ−アベンティス・ドイチュラント・ゲゼルシャフト・ミット・ベシュレンクテル・ハフツング | Method, configuration, and drug delivery device for testing the mechanical integrity of a cartridge disposed within a device |
| US10564129B2 (en) | 2014-08-08 | 2020-02-18 | Sanofi-Aventis Deutschland Gmbh | Method and arrangement for acoustically testing the mechanical integrity of a cartridge |
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