JPH0267648U - - Google Patents
Info
- Publication number
- JPH0267648U JPH0267648U JP1988136242U JP13624288U JPH0267648U JP H0267648 U JPH0267648 U JP H0267648U JP 1988136242 U JP1988136242 U JP 1988136242U JP 13624288 U JP13624288 U JP 13624288U JP H0267648 U JPH0267648 U JP H0267648U
- Authority
- JP
- Japan
- Prior art keywords
- cover plate
- electronic component
- package body
- close contact
- bonding material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Casings For Electric Apparatus (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
第１図は第１の実施例を示す図、第２図は第２
の実施例を示す図、第３図は第３の実施例を示す
図、第４図は第４の実施例を示す図、第５図は従
来例を示す図である。 １…蓋板、２…パツケージ本体、８１…間隙部
、８２…密接部。
の実施例を示す図、第３図は第３の実施例を示す
図、第４図は第４の実施例を示す図、第５図は従
来例を示す図である。 １…蓋板、２…パツケージ本体、８１…間隙部
、８２…密接部。
Claims (1)
- パツケージ本体内に電子部品素子を設置し、蓋
板とこのパツケージ本体とを接合材により気密接
合してなる電子部品において、このパツケージ本
体と蓋板との接合部分には、断面でみてパツケー
ジ本体と蓋板とが密接する密接部と、隙間を有し
外側に開口する間隙部を設け、この間隙部に前期
接合材を介在させることにより接合を行なうこと
を特徴とする電子部品の気密構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136242U JPH0267648U (ja) | 1988-10-18 | 1988-10-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988136242U JPH0267648U (ja) | 1988-10-18 | 1988-10-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0267648U true JPH0267648U (ja) | 1990-05-22 |
Family
ID=31396566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988136242U Pending JPH0267648U (ja) | 1988-10-18 | 1988-10-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0267648U (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013120762A (ja) * | 2011-12-06 | 2013-06-17 | Seiko Epson Corp | 蓋体、パッケージ、電子部品及びパッケージの製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57145344A (en) * | 1981-03-04 | 1982-09-08 | Toshiba Corp | Package of semiconductor device |
-
1988
- 1988-10-18 JP JP1988136242U patent/JPH0267648U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57145344A (en) * | 1981-03-04 | 1982-09-08 | Toshiba Corp | Package of semiconductor device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013120762A (ja) * | 2011-12-06 | 2013-06-17 | Seiko Epson Corp | 蓋体、パッケージ、電子部品及びパッケージの製造方法 |