JPH0267638U - - Google Patents

Info

Publication number
JPH0267638U
JPH0267638U JP14669288U JP14669288U JPH0267638U JP H0267638 U JPH0267638 U JP H0267638U JP 14669288 U JP14669288 U JP 14669288U JP 14669288 U JP14669288 U JP 14669288U JP H0267638 U JPH0267638 U JP H0267638U
Authority
JP
Japan
Prior art keywords
chip
semiconductor device
resin
island
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14669288U
Other languages
English (en)
Japanese (ja)
Other versions
JPH064578Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14669288U priority Critical patent/JPH064578Y2/ja
Publication of JPH0267638U publication Critical patent/JPH0267638U/ja
Application granted granted Critical
Publication of JPH064578Y2 publication Critical patent/JPH064578Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP14669288U 1988-11-10 1988-11-10 樹脂封止形半導体装置 Expired - Lifetime JPH064578Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14669288U JPH064578Y2 (ja) 1988-11-10 1988-11-10 樹脂封止形半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14669288U JPH064578Y2 (ja) 1988-11-10 1988-11-10 樹脂封止形半導体装置

Publications (2)

Publication Number Publication Date
JPH0267638U true JPH0267638U (da) 1990-05-22
JPH064578Y2 JPH064578Y2 (ja) 1994-02-02

Family

ID=31416420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14669288U Expired - Lifetime JPH064578Y2 (ja) 1988-11-10 1988-11-10 樹脂封止形半導体装置

Country Status (1)

Country Link
JP (1) JPH064578Y2 (da)

Also Published As

Publication number Publication date
JPH064578Y2 (ja) 1994-02-02

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