JPH0266041U - - Google Patents
Info
- Publication number
- JPH0266041U JPH0266041U JP1988146113U JP14611388U JPH0266041U JP H0266041 U JPH0266041 U JP H0266041U JP 1988146113 U JP1988146113 U JP 1988146113U JP 14611388 U JP14611388 U JP 14611388U JP H0266041 U JPH0266041 U JP H0266041U
- Authority
- JP
- Japan
- Prior art keywords
- amplifier
- transmission
- reception
- transmitting
- drive circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 230000005405 multipole Effects 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 6
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000009413 insulation Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Transceivers (AREA)
Description
第１図はこの考案の一実施例を示す構成図、第
２図は第１図のＡ―Ａ′部分の断面図、第３図は
第２図中の貫通端子の詳細図、第４図は配線板の
詳細図、第５図は従来の送受信装置の構成図、第
６図は第５図のＡ―Ａ′部分の断面図である。
図において、３は移相器、４ａ及び４ｂは送受
切換器、５は送信用増幅器、６は受信用増幅器、
７ａ及び７ｂは配線基板、８は隔壁、９は金線、
１０は駆動回路、１１は筺体、１２は多極コネク
タ、１５は貫通端子、１６は配線板、１９ａ，１
９ｃ及び１９ｂ，１９ｄは上下対をなすリード線
である。なお、各図中同一符号は同一または相当
部分を示す。
Fig. 1 is a configuration diagram showing an embodiment of this invention, Fig. 2 is a sectional view taken along line AA' in Fig. 1, Fig. 3 is a detailed view of the through terminal in Fig. 2, and Fig. 4 5 is a detailed diagram of a wiring board, FIG. 5 is a configuration diagram of a conventional transmitting/receiving device, and FIG. 6 is a sectional view taken along line AA' in FIG. In the figure, 3 is a phase shifter, 4a and 4b are transmitting/receiving switchers, 5 is a transmitting amplifier, 6 is a receiving amplifier,
7a and 7b are wiring boards, 8 is a partition wall, 9 is a gold wire,
10 is a drive circuit, 11 is a housing, 12 is a multi-pole connector, 15 is a through terminal, 16 is a wiring board, 19a, 1
9c, 19b, and 19d are upper and lower pairs of lead wires. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
換器と、上記第１の送受切換器と第２の送受切換
器との間に並列に設けられた送信用増幅器および
受信用増幅器と、上記移相器、送受切換器、送信
用増幅器、受信用増幅器とに接続された駆動回路
が長方形の箱形の筐体内に取り付けられた送受信
装置において、上記移相器、送受切換器、送信用
増幅器および受信用増幅器と駆動回路間に隔壁を
設けて、複数の貫通端子を上記隔壁の穴に装着し
上記移相器、送受切換器、送信用増幅器および受
信用増幅器と上記駆動回路を、任意の角度を設け
た上下対をなす可撓性を有するリード線を両面に
配した上記複数の貫通端子のリード線で直接接続
し、上記駆動回路と多極コネクタ間は可撓性を有
する絶縁板内に金などの導電性のよい金属線を埋
め込んだ配線板にて接続したことを特徴とする送
受信装置。 a phase shifter, a first transmission/reception switching device connected to the phase shifter, a transmission amplifier and a reception amplifier provided in parallel between the first transmission/reception switching device and the second transmission/reception switching device; , a transmitting/receiving device in which a drive circuit connected to the phase shifter, the transmitting/receiving switch, the transmitting amplifier, and the receiving amplifier is installed in a rectangular box-shaped housing; A partition wall is provided between the reliable amplifier, the reception amplifier, and the drive circuit, and a plurality of through terminals are installed in the holes of the partition wall, and the phase shifter, the transmission/reception switch, the transmission amplifier, the reception amplifier, and the drive circuit are connected to each other. Flexible lead wires forming upper and lower pairs arranged at arbitrary angles are directly connected by the lead wires of the plurality of through terminals arranged on both sides, and flexible insulation is provided between the drive circuit and the multi-pole connector. A transmitting/receiving device characterized in that it is connected by a wiring board in which highly conductive metal wires such as gold are embedded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988146113U JPH0266041U (en) | 1988-11-09 | 1988-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988146113U JPH0266041U (en) | 1988-11-09 | 1988-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0266041U true JPH0266041U (en) | 1990-05-18 |
Family
ID=31415300
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988146113U Pending JPH0266041U (en) | 1988-11-09 | 1988-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0266041U (en) |
-
1988
- 1988-11-09 JP JP1988146113U patent/JPH0266041U/ja active Pending
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