JP2001210976A - Transmitter-receiver unit and mounting structure for transmitter-receiver unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transmitter-receiver unit, in which a conductive pattern is arranged with flexibility and which is thin and low-cost and to provide a mounting structure, in which the mounting operation is performed satisfactorily. SOLUTION: In this transmitter-receiver unit, a connector 6 can be used when the transmitter-receiver unit S1 is connected to a motherboard 9 and when the transmitter-receiver unit S1 is mounted on the motherboard 9. Thereby, it is possible to provide the transmitter-receiver unit, in which the number of components and the cost of materials can be reduced, as compared with the conventional cases and which is low-cost and thin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transmitting / receiving unit used for a portable telephone and a mounting structure of the transmitting / receiving unit.

[0002]

2. Description of the Related Art A conventional transmission / reception unit and a mounting structure of the transmission / reception unit will be described with reference to FIG. 6. A frame 21 made of a metal plate has a rectangular shape and side walls 21a provided on four sides. And a mounting leg 21b extending downward from the side wall 21a. A pair of covers 22 and 23 made of a metal plate are attached to the upper and lower portions of the frame 21 so as to close the opening of the frame 21, and the frame 21 and the pair of covers 22 and 23 form a box. A shaped housing 24 is formed.

A circuit board 25 made of a printed board is provided with conductive patterns (not shown) on the upper and lower surfaces, and various electric components 26 such as resistors, capacitors, IC components and the like are connected to the conductive patterns by half-attachment. Have been. The female connector 27 includes an insulator 27a and a terminal 27b attached to the insulator 27a.

In the conductive pattern provided on the upper surface of the circuit board 25, connection conductors (not shown) for connecting to the outside are provided in a central portion of the circuit board 25, The terminal 27b is soldered to the connection conductor with the female connector 27 arranged on the lower surface. The circuit board 25 having such a configuration is attached to the frame 21 by appropriate means in a state housed in the housing 24, and the transmission / reception unit S2 is formed.

[0005] A mother board 28 for mounting the transmission / reception unit S2 is formed of a printed board, and a wiring pattern (not shown) is provided on a lower surface thereof. The male connector 29 includes an insulator 29a and an insulator 29a.
The male connector 29 has a configuration in which the terminal portion 29b is soldered to a wiring pattern in a state where the terminal portion 29b is disposed on the upper surface of the mother board 28.

[0006] To mount the conventional transmitting / receiving unit S2, first, the mounting leg 21b of the frame 21 is inserted into a hole (not shown) of the mother board 28, and the male connector 29 on the mother board 28 is moved downward. The male connector 29 is fitted to the female connector 27 by passing through the hole 23a of the side cover 23, and the terminal portions 27b and 29b of both are electrically connected. Next, the mounting legs 21b of the frame 21 are
When the housing 24 is attached to the mother board 28 by soldering to the wiring pattern of the above, the attachment is completed.

[0007]

In the conventional transmitting / receiving unit, the female connector 27 is connected to the connection conductor provided centrally in the center of the circuit board 25.
There is a problem that the arrangement of the conductive patterns provided in No. 5 is severe and there is no flexibility. In addition, the frame 21 is mounted on the circuit board 2.
5, a part of the side wall 21a and the mounting leg 21b are provided, so that the thickness A from the lower surface of the circuit board 25 to the end of the mounting leg 21b increases as shown in FIG. There is a problem that the unit S2 becomes thick and a thin unit cannot be obtained.

In the lower cover 23 and the frame 21, a part of the side wall 21a and the mounting leg 21b are required below the circuit board 25, so that the number of parts and the material cost are increased. There is a problem that the cost increases. In the mounting structure of the transmitting / receiving unit, the male connector 2 is used.
9 is inserted into the hole 23a of the cover 23, and the male connector 29 is fitted into the female connector 27; the mounting leg 21b is inserted into the hole of the mother board 28; Requires a soldering process, which is troublesome and costly.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a thin and inexpensive transmitting / receiving unit while providing flexibility in the arrangement of conductive patterns, and to provide a mounting structure with a good mounting operation.

[0010]

Means for Solving the Problems As a first means for solving the above problems, a circuit board attached to a housing and having conductive patterns on upper and lower surfaces, and an electric component connected to the conductive pattern are provided. A connector comprising an insulator and a plurality of terminal portions attached to the insulator, wherein the terminal portion includes a connection portion exposed above and below the insulator, and a connection portion above and below the insulator. And the outer peripheral portion of the circuit board is provided with the conductive pattern, and the connection portion located above the terminal portion is soldered to the conductive pattern. .

As a second solution, the insulator of the connector has a rectangular shape or a U shape, and the insulator is arranged near an outer peripheral portion of the circuit board, and The connection portion of the portion was soldered to the conductive pattern. Further, as a third solution, the terminal is embedded in the insulator.

Further, as a fourth solution, the insulator has a carbon content of about 20% by weight.
Further, as a fifth solving means, the electric component mounted on the lower surface of the circuit board is arranged in a portion surrounded by the insulator.

According to a sixth aspect of the present invention, there is provided a transmitting / receiving unit according to any one of claims 1 to 5, and a mother board having a wiring pattern, wherein the connection portion located below the terminal portion is connected to the wiring pattern. Soldered to electrically connect the transmitting / receiving unit to the motherboard,
The transmission / reception unit was attached to the mother board.

[0014]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing a transmitting / receiving unit of the present invention and its mounting structure. FIG. 2 is a sectional view showing the transmitting / receiving unit of the present invention and its mounting structure. FIG. 3 is a perspective view showing a connector according to a first embodiment of the present invention.
FIG. 4 is a perspective view showing a second embodiment of the connector, FIG. 4 is a cross-sectional view showing a third embodiment of the connector relating to the transmitting / receiving unit of the present invention, and FIG. 5 is a fourth embodiment of the connector relating to the transmitting / receiving unit of the present invention. FIG.

Next, the configuration of the transmitting / receiving unit of the present invention and the mounting structure thereof will be described with reference to FIGS.
A frame 1 made of a metal plate has a rectangular shape, and has side walls 1 a provided on four sides. A cover 2 made of a metal plate is provided on an upper portion of the frame 1 so as to cover an opening of the frame 1. The frame 1 and the cover 2 form a box-shaped housing 3.

The circuit board 4 composed of a printed board is provided with conductive patterns (not shown) on the upper and lower surfaces, and various electric components 5 such as resistors, capacitors, IC components and the like are connected to the conductive patterns by half-attachment. Have been. As shown in FIG. 2, the connector 6 in the first embodiment includes a square-shaped insulator 7 and a plurality of U-shaped terminal portions 8 attached around the insulator 7. I have.

The insulator 7 is made of a synthetic resin material having a carbon content of about 20% by weight.
As shown in FIG. 3, the terminal portion 8 is formed by connecting portions 8a and 8b exposed at the upper and lower portions of the insulator 7 and a conductor 8c connecting the upper and lower connecting portions 8a and 8b. 8 is
It is attached to the insulator 7 by being buried in the insulator 7 or the like.

In the conductive pattern provided on the lower surface of the circuit board 4, connection conductors (not shown) for connecting to the outside are provided on the outer periphery of the circuit board 4 in a dispersed manner. In a state where the connector 6 is arranged near the outer peripheral portion on the lower surface, the connection portion 8a located above the terminal portion 8 is soldered to the connection conductor. At this time, the electric component 5 attached to the lower surface of the circuit board 4 is disposed in a portion surrounded by the insulator 7, and the electric component 5 is electrically shielded by the insulator 7 mixed with carbon. The configuration is as follows.

The circuit board 4 having such a configuration is
A transmission / reception unit S1 is formed so as to be appropriately attached to a lower portion of the frame 1 so as to close an opening at a lower portion of the frame 1. When the circuit board 4 is mounted on the housing 3, the electric components 5 mounted on the upper surface of the circuit board 4 are housed in the housing 3 and the electric components 5 mounted on the lower surface of the circuit board 4. Part 5,
The connector 6 is exposed outside the housing 3.

The mother board 9 for mounting the transmission / reception unit S1 is formed of a printed board, and has a wiring pattern (not shown) provided on an upper surface thereof. The transmitting and receiving unit S1 of the present invention is mounted by first applying cream solder (not shown) on the wiring pattern of the mother board 9.
The connector 6 is placed on the cream solder, and is conveyed to a heating furnace (not shown) to solder the connector 6 in a wavy pattern. Then, the connection portion 8b located below the terminal portion 8 is soldered to the wiring pattern, the transmission / reception unit S1 is electrically connected to the motherboard 9, and the transmission / reception unit S1 is attached to the motherboard 9, The installation is completed.

FIG. 3 shows a second embodiment of the connector 6 in the transmission / reception unit of the present invention. In the second embodiment, the connector 6 is formed in a U-shape. Since this is the same as in the first embodiment, the same components are denoted by the same reference numerals, and description thereof is omitted here.

Although the connector 6 has a rectangular shape in the first embodiment and a U-shape in the second embodiment, the connector 6 may be separated at each side or with the two sides joined. Alternatively, the separated insulator 7 may be located near the outer peripheral portion of the circuit board 4.

FIG. 4 shows a third embodiment of the connector 6 in the transmission / reception unit of the present invention. In the third embodiment, the conductor 8c of the U-shaped terminal portion 8 is embedded in the insulator 7. Since other configurations are the same as those of the first embodiment, the same components are denoted by the same reference numerals, and description thereof is omitted here.

FIG. 5 shows a fourth embodiment of the connector 6 in the transmission / reception unit of the present invention. In the fourth embodiment, the conductor 8c of the U-shaped terminal portion 8 is embedded in the insulator 7. In addition, the connection portions 8a and 8b located at the upper and lower portions are projected in different directions from each other.
Since the third embodiment is the same as the third embodiment, the same parts are denoted by the same reference numerals and description thereof will be omitted.

[0025]

According to the present invention, the transmitting / receiving unit includes the insulator 7
And a connector 6 comprising a plurality of terminal portions 8 attached to the insulator 7. The terminal portions 8 are connected to connection portions 8 a and 8 b which are exposed above and below the insulator 7, and are connected to the upper and lower portions. Part 8
a and 8b, and a conductive pattern is provided on the outer peripheral portion of the circuit board 4, and the connecting portion 8a located above the terminal portion 8 is soldered to the conductive pattern. Since the conductive patterns connected to the terminal portions 8 can be dispersedly arranged on the outer peripheral portion of the circuit board 4, there is an effect that the arrangement of the conductive patterns can be made flexible.

The connector 6 of the present invention is used to connect the transmission / reception unit S1 to the mother board 9 and
Since it can also be attached to one mother board 9, the number of parts and material cost can be reduced, and an inexpensive and thin transmission / reception unit can be provided as compared with the related art.

The insulator 7 of the connector 6 has a square shape.
Alternatively, since the insulator 7 is arranged in the vicinity of the outer peripheral portion of the circuit board 4 and the connection portion 8a of the terminal portion 8 is soldered to the conductive pattern, the configuration is simple, and the transmission and reception are thin. Units can be provided. Also, the insulator 7 has
Since the terminal portion 8 is embedded, the connector 6 can be manufactured easily and inexpensively.

The insulator 7 has a carbon content of 2%.
Since it is composed of about 0% by weight, the electric component 5 located in the portion surrounded by the insulator 7 can be electrically shielded, and a connector having a shielding effect can be obtained. Further, since the electric component 5 attached to the lower surface of the circuit board 4 is provided in a portion surrounded by the insulator 7, a small space component having a good space factor can be provided.

The transmitting / receiving unit mounting structure according to the present invention includes a connecting portion 8 b located below the terminal portion 8 of the connector 6.
Is soldered to the wiring pattern of the motherboard 9 to electrically connect the transmitting / receiving unit S1 to the motherboard 9 and to attach the transmitting / receiving unit S1 to the motherboard 9, so that the connector 6 is mounted on the cream solder. By doing so, the installation can be performed, the installation work is easy,
Good productivity can be obtained.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a transmitting / receiving unit of the present invention and a mounting structure thereof.

FIG. 2 is a perspective view showing a first embodiment of a connector according to the transmitting / receiving unit of the present invention.

FIG. 3 is a perspective view showing a second embodiment of the connector according to the transmitting / receiving unit of the present invention.

FIG. 4 is a cross-sectional view showing a third embodiment of the connector according to the transmitting / receiving unit of the present invention.

FIG. 5 is a sectional view showing a fourth embodiment of the connector according to the transmitting / receiving unit of the present invention.

FIG. 6 is a cross-sectional view showing a conventional transmitting / receiving unit and its mounting structure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Frame 1a Side wall 2 Cover 3 Housing 4 Circuit board 5 Electrical component 6 Connector 7 Insulator 8 Terminal part 8a Connection part 8b Connection part 8c Conductor 9 Mother board S1 Transmission / reception unit

Claims (6)

[Claims] 1. An insulator comprising: a circuit board mounted on a housing and having conductive patterns on upper and lower surfaces; and an electric component connected to the conductive pattern; an insulator; and a plurality of terminals attached to the insulator. And a connector consisting of
The terminal portion, a connection portion exposed above and below the insulator,
The circuit is constituted by conductors connecting the upper and lower connection portions, and the conductive pattern is disposed on the outer peripheral portion of the circuit board. The connection portion located above the terminal portion is soldered to the conductive pattern. A transmission / reception unit characterized by being performed. 2. The insulator of the connector, wherein the insulator is square-shaped.
2. The circuit according to claim 1, wherein the insulator has a U shape, the insulator is disposed near an outer peripheral portion of the circuit board, and the connection portion of the terminal portion is soldered to the conductive pattern. 3. Transmission / reception unit. 3. The transmitting / receiving unit according to claim 1, wherein the terminal portion is embedded in the insulator. 4. The insulator has a carbon content of 20%.
The transmission / reception unit according to any one of claims 1 to 3, wherein the transmission / reception unit is constituted by about weight%. 5. The transmission / reception unit according to claim 1, wherein said electric component mounted on a lower surface of said circuit board is disposed in a portion surrounded by said insulator. 6. The transmission / reception unit according to claim 1, further comprising: a transmission / reception unit according to claim 1; and a mother board having a wiring pattern, wherein the connection part located below the terminal part is soldered to the wiring pattern. A transmitting / receiving unit mounting structure, wherein a unit is electrically connected to the motherboard and the transmitting / receiving unit is mounted on the motherboard.