JPH0265968A - Grinding device - Google Patents
Grinding deviceInfo
- Publication number
- JPH0265968A JPH0265968A JP63216395A JP21639588A JPH0265968A JP H0265968 A JPH0265968 A JP H0265968A JP 63216395 A JP63216395 A JP 63216395A JP 21639588 A JP21639588 A JP 21639588A JP H0265968 A JPH0265968 A JP H0265968A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- tool
- work
- base
- bimorph
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 abstract description 10
- 239000000919 ceramic Substances 0.000 abstract description 7
- 238000005498 polishing Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、金型表面等を精密に研削する研削装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a grinding device for precisely grinding the surface of a mold or the like.
加工物を精密に研削する装置としては、超音波加工機が
知られている。Ultrasonic processing machines are known as devices for precisely grinding workpieces.
この超音波加工機は、超音波発振器からの高周波電力を
振動子で機械的振動に変換し、この振動子の一端にホー
ンを取付けると共に、ホーンの先端に工具を取付け、こ
の工具を加工物に軽い力で接触させ、その両者間に研磨
材を加工液に混合した研磨液を介在させて工具の超音波
振動によって加工物を研削する加工機である。This ultrasonic processing machine converts high-frequency power from an ultrasonic oscillator into mechanical vibration using a vibrator, attaches a horn to one end of the vibrator, and attaches a tool to the tip of the horn, and then attaches this tool to the workpiece. This is a processing machine that grinds a workpiece by ultrasonic vibration of the tool by bringing the tool into contact with a light force and interposing a polishing liquid containing an abrasive and a machining liquid between the two.
かかる超音波加工機においては、工具が縦振動しか発生
できず金型表面等の複雑形状の加工物表面を均一な光沢
を有する状態に研削できない。In such an ultrasonic processing machine, the tool can only generate longitudinal vibration, and it is not possible to grind the surface of a workpiece having a complex shape, such as the surface of a mold, to a state with uniform gloss.
また、超音波発振器と振動子とホーンを必要とするから
加工機全体が非常に高価となる。Furthermore, since an ultrasonic oscillator, a vibrator, and a horn are required, the entire processing machine becomes very expensive.
なお、前述の振動子のホーンと工具を作業者が手で持っ
て加工物表面に軽く圧接しながら移動して加工物表面を
研削することが行なわれているが、この場合には工具を
加工物表面に、直交する上方、側方より軽く当てて目視
しながら作業するので、その作業が大変面倒となってし
まうと共に、熟練を要する。Note that the workpiece surface is ground by the operator holding the vibrator horn and the tool in their hands and moving them while lightly pressing the tool against the workpiece surface. The work is done while visually checking the work by applying it lightly to the surface of the object from perpendicularly above and from the sides, which makes the work very tedious and requires skill.
そこで、本発明は、加工物表面を簡単な作業によって均
一な光沢を有する状態に研削できると共に、安価である
研削装置を提供することを目的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an inexpensive grinding device that can grind the surface of a workpiece to a uniform gloss with simple operations.
〔課題を解決するための手段及び作用〕■、基台１に複
数の脚台２を取付けると共に、この各脚台２に連結部材
４の一端側をそれぞれ連結し、その各連結部材４の他端
側に亘って振動台５を取付け、この振動台５上に加工品
収納用容器１２を取付けると共に、この加工品収納用容
器１２内に工具１７を、加工物１４と対向して臨ませ、
前記連結部材４に、低振幅の振動を励起するバイモルフ
を取付けた研削装置。[Means and effects for solving the problem] (1) A plurality of leg stands 2 are attached to the base 1, one end side of the connecting member 4 is connected to each of the leg stands 2, and the other end of each of the connecting members 4 is connected to the base 1. A vibration table 5 is installed across the end side, a workpiece storage container 12 is installed on the vibration table 5, and a tool 17 is placed in the workpiece storage container 12 facing the workpiece 14,
A grinding device in which a bimorph that excites low-amplitude vibrations is attached to the connecting member 4.
これにより、バイモルフに通電することで振動台５が三
次元方向に振動するから、加工物収納用容器１２内の加
工物１４が工具１７に対して三次元方向に振動し、加工
物１４と工具１７との間に研磨液を供給することで加工
物１４の表面を均一な光沢を有する状態に研削できる。As a result, the vibration table 5 vibrates in a three-dimensional direction by energizing the bimorph, so the workpiece 14 in the workpiece storage container 12 vibrates in the three-dimensional direction with respect to the tool 17, and the workpiece 14 and the tool By supplying a polishing liquid between the workpiece 17 and the workpiece 17, the surface of the workpiece 14 can be ground to have a uniform gloss.
２、基台１に加工品収納用容器１２を取付けると共に、
該加工品収納用容器１２内の加工物１４と対向する工具
１７を、前記基台１に上下動自在でかつ任意方向に変位
できるように取付け、この工具１７に低振幅の振動を励
起するバイモルフを取付けた研削装置。2. Attach the processed product storage container 12 to the base 1, and
A tool 17 facing the workpiece 14 in the workpiece storage container 12 is mounted on the base 1 so as to be movable up and down and displaceable in any direction. Grinding device with attached.
これにより、バイモルフに通電することで工具１７が加
工物１４に対して三次元方向に振動し、加工物１４と工
具１７との間に研磨液を供給することで加工物１４の表
面を均一な光沢を有する状態に研削できる。As a result, by energizing the bimorph, the tool 17 vibrates in three-dimensional directions relative to the workpiece 14, and by supplying polishing liquid between the workpiece 14 and the tool 17, the surface of the workpiece 14 is uniformly polished. Can be ground to a glossy state.
第１図、第２図に示すように、方形板状の基台１上にお
ける各端縁には縦板状の脚台２がそれぞれ設けられ、各
脚台２の上面に亘って方形枠状の取付枠３が設けてあり
、この取付枠３に複数の連結部材４を介して方形板状と
なった振動台５が基台１の中央に位置するように取付け
である。As shown in FIGS. 1 and 2, a vertical plate-shaped leg stand 2 is provided at each edge of a rectangular plate-shaped base 1, and a rectangular frame-shaped frame is provided over the upper surface of each leg stand 2. A mounting frame 3 is provided, and a rectangular plate-shaped vibration table 5 is mounted to this mounting frame 3 via a plurality of connecting members 4 so as to be located at the center of the base 1.
前記連結部材４は一側縦板６と他側縦板７を横板８で連
結した上向コ字状となり、その−側縦阪６の上部がブラ
ケット９を介して取付枠３に連結され、他側績！２７の
上部がブラケット１０を介して振動台５の各端縁に連結
しである。The connecting member 4 has an upward U-shape in which a vertical plate 6 on one side and a vertical plate 7 on the other side are connected by a horizontal plate 8, and the upper part of the vertical plate 6 on the negative side is connected to the mounting frame 3 via a bracket 9. , Other side results! The upper part of 27 is connected to each edge of the vibration table 5 via the bracket 10.
なお、振動台５の各端縁には切欠凹部１１が形成され、
この切欠凹部１１内にブラケット１０が嵌まり込んで振
動台５の上面５ａは連結部材４の上部より上方に突出し
ている。Note that a notch recess 11 is formed at each edge of the vibration table 5,
The bracket 10 is fitted into the cutout recess 11, and the top surface 5a of the vibration table 5 projects upwardly from the top of the connecting member 4.
前記振動台５の上面５ａには加工物収納用容器１２の底
面１２ａが当接し、ボルト１３で連結されていると共に
、加工物収納用容器１２は上部が開口した箱状となり、
加工物１４が着脱可能にセットされ、かつ砥粒と水を混
合した研磨液１５が注入しである。The bottom surface 12a of the workpiece storage container 12 is in contact with the top surface 5a of the vibration table 5, and is connected with bolts 13, and the workpiece storage container 12 has a box shape with an open top.
A workpiece 14 is set in a removable manner, and a polishing liquid 15 containing abrasive grains and water is injected therein.
前記各連結部材４の一側縦板６、他側縦板７には、低振
幅の振動を励起するバイモルフ、例えばセラミック製圧
電素子１６がそれぞれ接着剤、例えばカーボンを混入し
たエポキシ樹脂で接着して取付けてあり、各セラミック
製圧電素子１６に電流を流して、低振幅の振動を励起す
ると各連結部材４が振動し、それによって振動台５が三
次元方向に振動するように構成しである。A bimorph, for example, a piezoelectric element 16 made of ceramic, which excites low-amplitude vibrations, is adhered to the vertical plate 6 on one side and the vertical plate 7 on the other side of each of the connecting members 4 with an adhesive, for example, an epoxy resin mixed with carbon. When a current is applied to each ceramic piezoelectric element 16 to excite low-amplitude vibration, each connecting member 4 vibrates, thereby causing the vibration table 5 to vibrate in three-dimensional directions. .
前記加工物１４の被加工部１４ａと対向して工具１７が
配設され、この工具１７の加工部１７ａは加工物１４の
被加工部１４ａと同一形状となっていると共に、軸心に
穿孔した中心孔１８が複数の小孔１９で加工物１７ａの
表面に開口し、この中心孔１８内には研磨液１５が図示
しないポンプによって順次供給されるようになっている
と共に、前記工具１７は第２図のようにホルダー２０に
着脱自在に連結され、このホルダー２０は、基台１に立
設した縦ガイド杆２１に沿って上下摺動可能な可動体２
２に連結してあり、縦ガイド杆２１に設けたラック２３
と噛合するピニオン２５を可動体２２に設け、摘み２５
でピニオン２５を回転することで可動体２２を縦ガイド
杆２１に沿って上下に摺動でき、それによって工具１７
を上下に移動して加工部１７ａと被加工部１４ａとの間
隙を調整できるようにしである。A tool 17 is disposed opposite to the workpiece 14a of the workpiece 14, and the workpiece 17a of the tool 17 has the same shape as the workpiece 14a of the workpiece 14, and has a hole drilled in its axis. The center hole 18 opens on the surface of the workpiece 17a with a plurality of small holes 19, and the polishing liquid 15 is sequentially supplied into the center hole 18 by a pump (not shown). As shown in Figure 2, the holder 20 is detachably connected to a holder 20, and the holder 20 has a movable body 2 that can slide up and down along a vertical guide rod 21 installed upright on the base 1.
Rack 23 connected to 2 and provided on the vertical guide rod 21
The movable body 22 is provided with a pinion 25 that meshes with the knob 25.
By rotating the pinion 25, the movable body 22 can be slid up and down along the vertical guide rod 21, whereby the tool 17
can be moved up and down to adjust the gap between the processed part 17a and the processed part 14a.
しかして、加工物１４をセットすると共に、工具１７を
上下動して加工部１７ａと被加工部１４ａとの間隙を所
定の値とし、中心孔１８に研磨液１５を供給して加工部
１７ａと被加工部１４ａとの間に供給しながらセラミッ
ク製圧電索子１６に通電すると、各連結部材４が振動し
て振動台５が三次元方向に振動する。この時加工品の重
量によって振動周波数が異なるので、加工品の重量によ
って振動周波数を合わせて振幅が一定となるように制御
する。Then, while setting the workpiece 14, the tool 17 is moved up and down to set the gap between the processing part 17a and the processed part 14a to a predetermined value, and the polishing liquid 15 is supplied to the center hole 18, and the processing part 17a is fixed. When the ceramic piezoelectric cord 16 is energized while being supplied between it and the processed part 14a, each connecting member 4 vibrates and the vibration table 5 vibrates in three-dimensional directions. At this time, since the vibration frequency varies depending on the weight of the workpiece, the vibration frequency is adjusted according to the weight of the workpiece to control the amplitude to be constant.
これによって、加工物１４が工具１７に対して三次元方
向に振動して被加工部１４ａの表面を均一な光沢を有す
る状態に研削できる。As a result, the workpiece 14 vibrates in three-dimensional directions relative to the tool 17, and the surface of the workpiece 14a can be ground to a state with uniform gloss.
なお、−度に研削せずに工具１７を順次下方に移動して
複数回繰り返すことで研削しても良い。Note that the grinding may be performed by sequentially moving the tool 17 downward and repeating the grinding several times instead of grinding every time.
第３図は第２実施例を示し、加工物収納容器１２を基台
１上に設けると共に、工具１７をホルダー２０に緩衝材
２６を介して変位可能に取付け、その工具１７にセラミ
ック製圧電素子１６を取付けである。FIG. 3 shows a second embodiment, in which a workpiece storage container 12 is provided on a base 1, a tool 17 is displaceably attached to a holder 20 via a cushioning material 26, and a ceramic piezoelectric element is attached to the tool 17. 16 is the installation.
この様に構成すれば、セラミック製圧電素子１６に通電
することで工具１７が三次元方向に振動するので、前述
と同様に加工物１４の被加工部１４ａを均一な光沢を有
する状態に研削できる。With this configuration, the tool 17 vibrates in three-dimensional directions by energizing the ceramic piezoelectric element 16, so that the workpiece 14 can be ground to a state with uniform gloss in the same manner as described above. .
なお、第４図に示すように工具１７を、加工部１７ａに
複数の軸杆部１７ｂを一体形成した形状とし、その各軸
杆部１７ｂにセラミック製圧電素子１６をそれぞれ取付
けるようにしても良い。Incidentally, as shown in FIG. 4, the tool 17 may have a shape in which a plurality of shaft rod portions 17b are integrally formed on the processing portion 17a, and a ceramic piezoelectric element 16 may be attached to each of the shaft rod portions 17b. .
■、バイモルフに通電することで振動台５が三次元方向
に振動するから、加工物収納用容器１２内の加工物１４
が工具１７に対して三次元方向に振動し、加工物１４と
工具１７との間に研磨液を供給することで加工物１４の
表面を均一な光σくを有する状態に研削できる。(2) The vibration table 5 vibrates in three dimensions by energizing the bimorph, so the workpiece 14 in the workpiece storage container 12
vibrates in three-dimensional directions with respect to the tool 17, and by supplying polishing liquid between the workpiece 14 and the tool 17, the surface of the workpiece 14 can be ground to a state having a uniform light σ.
また、バイモルフを設けると共に、バイモルフに通電す
れば良いから操作が簡単で熟練を要せずに容易に研削作
業でき、しかもコストを安くできる。Further, since it is only necessary to provide a bimorph and energize the bimorph, the operation is simple and the grinding work can be easily performed without requiring any skill, and the cost can be reduced.
また、作業者の手作業によらず自動的に研削できるので
、熟練を要せずに簡単に研削できる。In addition, since grinding can be performed automatically without manual work by the operator, grinding can be easily performed without requiring any skill.
２、バイモルフに通電することで工具１７が加工物１４
に対して三次元方向に振動し、加工物１４と工具１７と
の間に研磨液を供給することで加工物１４の表面を均一
な光沢を有する状態に研削できる。2. By energizing the bimorph, the tool 17 moves to the workpiece 14
The surface of the workpiece 14 can be ground to a uniform gloss by vibrating in three-dimensional directions relative to the workpiece 14 and supplying polishing liquid between the workpiece 14 and the tool 17.
また、バイモルフを設けると共に、バイモルフに通電す
れば良いから操作が簡単で熟練を要しないから容易に研
削作業でき、しかも゛コストを安くできる。In addition, since the bimorph is provided and the bimorph is energized, the operation is simple and does not require any skill, so the grinding work can be carried out easily and the cost can be reduced.
図面は本発明の実施例を示し、第１図は第１実施例の断
面図、第２図はその斜視図、第３図は第２実施例の斜視
図、第４図は工具の変形例を示す断面図である。
１は基台、２は脚台、４は連結部材、５は振動台、１２
は加工品収納用容器、１４は加工品、１７は工具。The drawings show embodiments of the present invention; FIG. 1 is a sectional view of the first embodiment, FIG. 2 is a perspective view thereof, FIG. 3 is a perspective view of the second embodiment, and FIG. 4 is a modification of the tool. FIG. 1 is a base, 2 is a footrest, 4 is a connecting member, 5 is a vibration table, 12
14 is a processed product storage container, 17 is a tool.
Claims (1)
台２に連結部材４の一端側をそれぞれ連結し、その各連
結部材４の他端側に亘って振動台５を取付け、この振動
台５上に加工品収納用容器１２を取付けると共に、この
加工品収納用容器１２内に工具１７を、加工物１４と対
向して臨ませ、前記連結部材４に、低振幅の振動を励起
するバイモルフを取付けた研削装置。 ２、基台１に加工品収納用容器１２を取付けると共に、
該加工品収納用容器１２内の加工物１４と対向する工具
１７を、前記基台１に上下動自在でかつ任意方向に変位
できるように取付け、この工具１７に低振幅の振動を励
起するバイモルフを取付けた研削装置。[Claims] 1. A plurality of leg stands 2 are attached to the base 1, and one end side of a connecting member 4 is connected to each leg stand 2, and the other end side of each connecting member 4 is connected. A vibration table 5 is attached, a container 12 for storing a workpiece is installed on the vibration table 5, a tool 17 is placed in the container 12 for storing a workpiece, and the tool 17 is placed facing the workpiece 14, and the tool 17 is placed in the container 12 for storing a workpiece. , a grinding device equipped with a bimorph that excites low-amplitude vibrations. 2. Attach the processed product storage container 12 to the base 1, and
A tool 17 facing the workpiece 14 in the workpiece storage container 12 is mounted on the base 1 so as to be movable up and down and displaceable in any direction. Grinding device with attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63216395A JPH0265968A (en) | 1988-09-01 | 1988-09-01 | Grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63216395A JPH0265968A (en) | 1988-09-01 | 1988-09-01 | Grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0265968A true JPH0265968A (en) | 1990-03-06 |
Family
ID=16687892
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63216395A Pending JPH0265968A (en) | 1988-09-01 | 1988-09-01 | Grinding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0265968A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04336954A (en) * | 1991-05-09 | 1992-11-25 | Matsushita Electric Ind Co Ltd | Minute grinding method and minute grinding tool |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62292360A (en) * | 1986-06-10 | 1987-12-19 | Sanyo Electric Co Ltd | Polishing device |
-
1988
- 1988-09-01 JP JP63216395A patent/JPH0265968A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62292360A (en) * | 1986-06-10 | 1987-12-19 | Sanyo Electric Co Ltd | Polishing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04336954A (en) * | 1991-05-09 | 1992-11-25 | Matsushita Electric Ind Co Ltd | Minute grinding method and minute grinding tool |
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