JPH0263575U - - Google Patents
Info
- Publication number
- JPH0263575U JPH0263575U JP14257188U JP14257188U JPH0263575U JP H0263575 U JPH0263575 U JP H0263575U JP 14257188 U JP14257188 U JP 14257188U JP 14257188 U JP14257188 U JP 14257188U JP H0263575 U JPH0263575 U JP H0263575U
- Authority
- JP
- Japan
- Prior art keywords
- transfer plate
- circuit board
- electrode
- buried
- sectional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 4
- 239000008187 granular material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14257188U JPH0263575U (th) | 1988-10-31 | 1988-10-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14257188U JPH0263575U (th) | 1988-10-31 | 1988-10-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0263575U true JPH0263575U (th) | 1990-05-11 |
Family
ID=31408645
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14257188U Pending JPH0263575U (th) | 1988-10-31 | 1988-10-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0263575U (th) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015207445A (ja) * | 2014-04-21 | 2015-11-19 | コニカミノルタ株式会社 | パターン形成方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62186589A (ja) * | 1986-02-12 | 1987-08-14 | 福田金属箔粉工業株式会社 | 回路基板の製造方法 |
JPS63257293A (ja) * | 1987-04-14 | 1988-10-25 | 大日本印刷株式会社 | 印刷回路を有する成形品の製造方法およびその製造に使用する転写シ−ト |
-
1988
- 1988-10-31 JP JP14257188U patent/JPH0263575U/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62186589A (ja) * | 1986-02-12 | 1987-08-14 | 福田金属箔粉工業株式会社 | 回路基板の製造方法 |
JPS63257293A (ja) * | 1987-04-14 | 1988-10-25 | 大日本印刷株式会社 | 印刷回路を有する成形品の製造方法およびその製造に使用する転写シ−ト |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015207445A (ja) * | 2014-04-21 | 2015-11-19 | コニカミノルタ株式会社 | パターン形成方法 |