JPH0263572A - Method and device for coating of thin film - Google Patents

Method and device for coating of thin film

Info

Publication number
JPH0263572A
JPH0263572A JP63214068A JP21406888A JPH0263572A JP H0263572 A JPH0263572 A JP H0263572A JP 63214068 A JP63214068 A JP 63214068A JP 21406888 A JP21406888 A JP 21406888A JP H0263572 A JPH0263572 A JP H0263572A
Authority
JP
Japan
Prior art keywords
substrate
coating
tank
processing tank
coating liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63214068A
Other languages
Japanese (ja)
Other versions
JPH0649168B2 (en
Inventor
Naohiko Matsuda
直彦 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Central Glass Co Ltd
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Priority to JP63214068A priority Critical patent/JPH0649168B2/en
Priority to IT8921542A priority patent/IT1231384B/en
Priority to DE3927849A priority patent/DE3927849A1/en
Priority to US07/397,672 priority patent/US5009933A/en
Priority to KR1019890012135A priority patent/KR930001507B1/en
Publication of JPH0263572A publication Critical patent/JPH0263572A/en
Publication of JPH0649168B2 publication Critical patent/JPH0649168B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

PURPOSE:To execute partial coating of sheet glass, etc., without masking by introducing a coating liquid into a treating tank in the state of bringing the lateral open surface attached with a flow regulating part in the lower part into tight contact with a substrate to be coated, then removing the coating liquid. CONSTITUTION:A holder 2 for the substrate 1 and the flow regulating part 4 having a downwardly converged shape are provided to the treating tank 5 having the construction consisting in opening one side surface to the shape complying with the shape of the substrate 1 and closing the other side surface and the base. Further, a coating liquid supplying tank 8 provided freely liftably by a lifting device 7 and the flow regulating part 4 of the treating tank 5 are connected by a tube 9. The open side surface of the treating tank 5 is brought into tight contact with the substrate 1 in this constitution and the coating liquid is introduced in this state into the tank up to a prescribed level. The soln. is removed at a prescribed rate after the liquid level comes to a standstill. The action corresponding to the dipping and pulling up of a dipping method is executed in this way, by which the partial coating is enabled.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は溶液を用いる湿式コーティング、特に金属アル
コキシドを出発原料とするゾル・ゲル法によりコーティ
ングする場合等において、基板に部分的に薄膜を形成す
るに好適なコーティング方法および装置に関する。
Detailed Description of the Invention [Industrial Application Field] The present invention is applicable to wet coating using a solution, particularly when coating by a sol-gel method using a metal alkoxide as a starting material, to partially form a thin film on a substrate. The present invention relates to a coating method and apparatus suitable for coating.

〔従来の技術〕[Conventional technology]

従来、溶液を用いて基板に塗膜する湿式コーティングに
おいては、基板を溶液中に浸漬して一定速度で引き上げ
ることにより行うディッピング法、基板の上部から溶液
を流し、拡散させるフローコート法、上、下2つのロー
ルによって基板を搬送し、どちらか一方あるいは両方の
ロールに接した溶液により塗膜するローラーコート法な
ど種々の方法が知られている。
Conventionally, wet coating methods in which a solution is applied to a substrate include a dipping method, in which the substrate is immersed in a solution and pulled up at a constant speed; a flow coating method, in which the solution is poured from above the substrate and diffused; Various methods are known, such as a roller coating method in which the substrate is conveyed by two lower rolls and coated with a solution that is in contact with one or both rolls.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかしながら、基板に部分的にコーティングする場合、
70−コート法、ローラーコート法にあっては不要箇所
をマスキングテープ等でマスキングする方法は実用上不
可能であるので、まず全面にコーティングしてその後不
要箇所を多量にエツチングなどの方法により除去せざる
を得ず、その上サブミクロンオーダーで微妙に制御され
た膜厚を得ることは極めて困難であった。
However, when partially coating the substrate,
70- In the coating method and roller coating method, it is practically impossible to mask unnecessary areas with masking tape, etc., so first coat the entire surface and then remove a large amount of unnecessary areas by etching or other methods. Moreover, it has been extremely difficult to obtain a film thickness that is delicately controlled on the order of submicrons.

サブミクロンオーダーの膜厚を得るにはディッピング法
が最もを効であるとされているが、この方法は大型の基
板をコーティング溶液に浸漬させて、引き上げるので、
駆動する設備が大型かつ複雑となりハンドリングが困難
、コスト高となるばかりか、基板を引き上げるときに、
基板自身の振動に起因する液面の揺動がさけられないの
で、横縞が発生し易く、均一厚さの薄膜を形成すること
は困難であった。その上、部分的にコーティングする場
合には、基板の被コーティング面の不要箇所だけでなく
裏面全面にマスキングするか、基板表裏の両面全面に一
部コーティングした後、裏面全部と表面の不要箇所の塗
膜をエツチングなどの方法により除去する必要があり、
多大の手間を要するものであった。
The dipping method is said to be the most effective way to obtain a film thickness on the order of submicrons, but this method involves immersing a large substrate in the coating solution and pulling it out.
The driving equipment is large and complicated, making it difficult to handle and increasing costs.
Since fluctuations in the liquid level caused by vibrations of the substrate itself cannot be avoided, horizontal stripes are likely to occur, making it difficult to form a thin film with a uniform thickness. In addition, when partially coating the substrate, mask not only the unnecessary parts on the surface to be coated but also the entire back side, or mask the entire back side and the unnecessary parts on the front side after partially coating both the front and back sides of the board. It is necessary to remove the paint film using methods such as etching.
This required a great deal of effort.

本出願人はこのような点に鑑みて特願昭6219523
9号を出願したが、本発明はさらにこれを改良するもの
で、所望の薄膜を有する均質な薄膜をコーティング可能
とし、特に基板の一部にコーティングするに好適な方法
および装置を提供することを目的とする。
In view of these points, the present applicant filed Japanese Patent Application No. 6219523.
No. 9 was filed, but the present invention further improves this and aims to provide a method and apparatus that can coat a homogeneous thin film having a desired thickness, and that is particularly suitable for coating a part of a substrate. purpose.

〔発明の構成〕[Structure of the invention]

本発明の方法は、板ガラス、プラスチックなどの基板に
コーティング溶液を接触させて塗膜するIIQのコーテ
ィング方法において、一側面を開口した構造にするとと
もに、整流部をその下方に付属せしめた処理槽の該開口
面を基板に密着させた状態で、該処理槽にコーティング
溶液を所定レベルまで入れ、その後コーティング溶液を
所定速度で抜きとることを特徴とし、この方法を実施す
るための装置とし寸は、基板を保持する保持装置と、一
側面を該基板に合致する形状に開口した構造にするとと
もに、整流部を下方に付属せしめた処理槽と、昇降自在
に設けたコーティング液供給槽を具備するとともに、前
記整流部とコーティング液供給槽の底面をチューブによ
り連通させる構成とするもの、あるいは基板を保持する
保持装置と、一側面を該基板に合致する形状に開口した
構造にするとともに、整流部を下方に付属せしめた処理
槽を具備するとともに、前記処理槽にコーティング溶液
を供給する供給槽と、前記整流部底面からコーティング
溶液を抜き取る回収槽をそれぞれ処理槽の上方と下方に
設け、該処理槽と、それぞれバルブを介してチューブに
より連結させる構成としたものである。
The method of the present invention is an IIQ coating method in which a coating solution is brought into contact with a substrate such as plate glass or plastic to form a film. The coating solution is poured into the processing tank to a predetermined level with the opening surface in close contact with the substrate, and the coating solution is then withdrawn at a predetermined speed, and the dimensions of the apparatus for carrying out this method are as follows: It is equipped with a holding device for holding a substrate, a processing tank having a structure in which one side is opened in a shape that matches the substrate, a rectifying section attached below, and a coating liquid supply tank that is movable up and down. , the rectifier is configured to communicate with the bottom of the coating liquid supply tank through a tube, or the rectifier is configured to have a structure in which a holding device for holding the substrate and one side is opened in a shape that matches the substrate; A processing tank is provided below, and a supply tank for supplying the coating solution to the processing tank and a recovery tank for extracting the coating solution from the bottom of the rectifying section are provided above and below the processing tank, respectively. and are connected by tubes via valves.

〔作 用〕[For production]

基板を静止させた状態で、基板の被コーティング面より
やや大きめの面積を有し、基板に合致する形状に一側面
を開口した処理槽を基板の被コーティング面に密着させ
、その状態でコーティング溶液を被コーティング面の最
上部と同一あるいはやや高めのレベルまで入れ、ディッ
ピング法における基板の浸漬に相当する作用を行なわせ
、液面が静止した後、溶液を所定速度で抜き出すことに
よりディッピング法における基板の引き上げに相当する
作用を行わせて、部分的にコーティングすることを可能
にしたものであり、基板を静止させてコーティング溶液
のレベルを制御するので、膜厚のコントロールが容易で
均一厚さの薄膜を得ることができる。
With the substrate stationary, a treatment tank with an area slightly larger than the surface to be coated and an opening on one side shaped to match the substrate is placed in close contact with the surface to be coated of the substrate, and the coating solution is applied in this state. The solution is added to the same or slightly higher level than the top of the surface to be coated to perform an action equivalent to immersing the substrate in the dipping method, and after the liquid level has stopped, the solution is withdrawn at a predetermined speed to remove the substrate in the dipping method. It is possible to perform partial coating by performing an action equivalent to lifting the substrate, and because the level of the coating solution is controlled by keeping the substrate stationary, it is easy to control the film thickness and achieve a uniform thickness. A thin film can be obtained.

特願昭62−19523号において提案した発明はこれ
らの作用を行わせ、特に部分コーティングに好適である
が第4図示すように隅部に渦を巻(ような流れを生じコ
ーティング膜に厚さむらを生ずる恐れがあった。
The invention proposed in Japanese Patent Application No. 62-19523 achieves these effects and is particularly suitable for partial coating, but as shown in Fig. There was a fear that unevenness would occur.

本発明は被コーティング面の最下面の高さまでは溶液降
下時の流れは乱すことなく層流になるように整流部を処
理槽に付属させるもので、後述するように、これらを連
結する開口部を、あまり小さくならないようにして、整
流部は処理槽下部より低い位置から徐々に絞り込む構造
(第1図)にするか、絞らなくても整流部の長さを充分
長くして、その底面あるいは側面下部にチューブを連通
させることにより、処理槽隅部における乱流を除去し、
コーティング膜むらの発生を極力少なくすることができ
る。
In the present invention, a rectifier is attached to the processing tank so that the flow of the solution becomes laminar without being disturbed up to the height of the lowest surface of the surface to be coated, and as described later, an opening connecting these parts is provided. To prevent the flow from becoming too small, the flow straightening section should be constructed so that it gradually narrows down from a position lower than the bottom of the processing tank (Fig. 1), or the length of the flow straightening section should be sufficiently long without narrowing down, and the length of the flow straightening section should be made sufficiently long so that By connecting the tube to the bottom of the side, turbulent flow at the corner of the processing tank is removed.
The occurrence of coating film unevenness can be minimized.

〔実施例〕〔Example〕

以下、図面を参照しながら本発明の詳細な説明する。 Hereinafter, the present invention will be described in detail with reference to the drawings.

第1図、第2図はそれぞれ本発明の実施例1、実施例2
を示すコーティング装置の概略斜視図、第3図は本発明
における処理槽を示す斜視図、第4図は先行発明の処理
槽における溶液抜きとり時の流れを示す図、第5図は本
発明の別の実施様態を示す処理槽正面図(受槽略)であ
る。
FIG. 1 and FIG. 2 are Embodiment 1 and Embodiment 2 of the present invention, respectively.
FIG. 3 is a perspective view showing the processing tank of the present invention, FIG. 4 is a diagram showing the flow when removing a solution from the processing tank of the prior invention, and FIG. It is a front view of a processing tank (receiving tank omitted) showing another embodiment.

ス1 本装置は第1図、第3図に示すように板ガラスなどの基
板lを保持する保持装置2と、一側面を基板1に合致す
る形状に開口し、他の側面と底面を閉じ、開口していな
い側面の上部を鋸歯状に切欠いて小開口部3を形成する
とともに、下方に絞った構造の整流部4を付属せしめた
処理槽5と、小開口部3を含む面を一側面として構成す
る受槽6と、昇降装置7により昇降自在に設けたコーテ
ィング液供給槽8と処理槽5とコーティング液供給槽8
を連結するチューブ9とから構成するものである。処理
槽5と整流部4は開口部10を介して連通される。保持
装置2は吸着パット11とストッパー12を有する2本
のアーム13.13から構成される装置 回動される。処理槽5は左右両側及び底辺を中空二重構
造として独立させチューブ15により真空引き出来るよ
うにし、さらに基板との密着部分には弾性体l6を設け
るとともに、エアシリンダー17に連結したロンド18
の伸縮により前後に往復動される。
1 As shown in FIGS. 1 and 3, this device includes a holding device 2 that holds a substrate 1 such as a plate glass, one side is opened in a shape that matches the substrate 1, and the other side and bottom are closed. A processing tank 5 has a small opening 3 formed by cutting out the upper part of the unopened side surface in a sawtooth shape, and is attached with a rectifying section 4 having a downwardly narrowed structure, and the surface containing the small opening 3 is formed on one side. A receiving tank 6, a coating liquid supply tank 8, a processing tank 5, and a coating liquid supply tank 8, which can be raised and lowered by a lifting device 7.
It consists of a tube 9 that connects the two. The processing tank 5 and the rectifier 4 are communicated through an opening 10. The holding device 2 consists of two arms 13.13 having a suction pad 11 and a stopper 12 and is rotated. The processing tank 5 has an independent hollow double structure on both left and right sides and the bottom so that it can be evacuated by a tube 15. Furthermore, an elastic body 16 is provided at the part in close contact with the substrate, and a rond 18 connected to an air cylinder 17 is provided.
It reciprocates back and forth by expanding and contracting.

次に薄膜のコーティング手順を説明する。Next, the thin film coating procedure will be explained.

コーティング溶液19として、主成分のチタンアルコキ
シドにイソプロビルアルコールなどの溶媒等を加えて調
整したアルコキシド溶液(ゾル溶液)を入れたコーティ
ング液供給槽8を、その液面が処理槽5の底面より低く
なるように降下させた状態で、■基板1がベルトコンベ
ア20で搬送され所定位置に来たときにベルトコンベア
20を停止する。■静止した基板1をアーム13、13
に載置しながら第1図の位置まで回動させる。
A coating liquid supply tank 8 containing an alkoxide solution (sol solution) prepared by adding a solvent such as isopropyl alcohol to titanium alkoxide as a main component as a coating solution 19 is placed in a coating liquid supply tank 8 whose liquid level is lower than the bottom surface of the processing tank 5. (2) The substrate 1 is conveyed by the belt conveyor 20 in a state where it is lowered so that the belt conveyor 20 is stopped when it reaches a predetermined position. ■ Arms 13, 13 hold stationary board 1.
Rotate it to the position shown in Figure 1 while placing it on the screen.

このとき回動途中で吸着パッド11により基板1を吸着
することによりストッパー12の作用と相俟って所定位
置に基板1は安全に保持される。
At this time, the substrate 1 is suctioned by the suction pad 11 during rotation, and in combination with the action of the stopper 12, the substrate 1 is safely held at a predetermined position.

■処理槽5をエアシリンダー17の作動により前進させ
、基板1に当接させる。当接後チューブ15を介して図
示しない真空ポンプなどにより真空引きし、密着度を高
める。■コーティング液供給槽8を、その液面が被コー
ティング面の最上部より若干上まわる高さまで昇降装置
7の作動により上昇させる。このとき、処理槽5の液面
はOの状態から所定レベルまで上昇し、一部をオーバー
フローさせる。■処理槽5の液面が静止した後、昇降装
置7によりコーティング液供給8を、その液面が処理槽
5の底面より低い位置まで一定速度で降下させる。この
とき処理槽5の液面は一定速度で降下し、コーティング
溶液は抜きとられる。■チューブ15により真空状態を
解き、その後エアシリンダー17の逆作動により処理槽
5を後退させ、基板1から離脱せしめる。■駆動装置1
4により保持装置2のアーム13を水平位置まで回動さ
せ、その後、吸着バンドの吸着を解除してベルトアンペ
ア20に基板1を載置する。■ベルトコンベア20の逆
作動4mより基板1を搬送する。
(2) The processing tank 5 is moved forward by the operation of the air cylinder 17 and brought into contact with the substrate 1. After contact, the tube 15 is evacuated by a vacuum pump (not shown) to increase the degree of adhesion. (2) Raise the coating liquid supply tank 8 by operating the lifting device 7 until the liquid level is slightly higher than the top of the surface to be coated. At this time, the liquid level in the processing tank 5 rises from the O state to a predetermined level, causing a portion to overflow. (2) After the liquid level in the processing tank 5 has come to rest, the coating liquid supply 8 is lowered at a constant speed by the lifting device 7 to a position where the liquid level is lower than the bottom surface of the processing tank 5. At this time, the liquid level in the treatment tank 5 falls at a constant rate, and the coating solution is drawn out. (2) The vacuum state is released through the tube 15, and then the processing tank 5 is moved backward by reverse operation of the air cylinder 17, and is separated from the substrate 1. ■Drive device 1
4, the arm 13 of the holding device 2 is rotated to a horizontal position, and then the suction of the suction band is released and the substrate 1 is placed on the belt ampere 20. ■Reverse operation of belt conveyor 20 4m to convey substrate 1.

この後、電気炉等により熱処理をして膜厚の均一なTi
O□膜を得る。
After this, heat treatment is performed using an electric furnace or the like to make the Ti film uniform in thickness.
Obtain an O□ film.

なお処理槽5からオーバーフローしたコーティング溶液
は受槽6から図示しない清浄化手段を経て回収される。
The coating solution overflowing from the processing tank 5 is recovered from the receiving tank 6 via a cleaning means (not shown).

実施例2 本装置は第2図、第3図に示すように板ガラスなどの基
板1を保持する保持装置2と、一側面を基板1に合致す
る形状に開口し、他の側面と底面を閉じ、開口していな
い側面の上部を鋸歯状に切欠いて小開口部3を形成する
とともに、下方に絞った構造の整流部4を付属する処理
槽5と、小開口部3を含む面を一側面として構成する受
槽6と、処理槽5の上方に設けられ、実施例1と同じコ
ーティング溶液を供給する供給槽8と、処理槽5の下方
に設けられ、コーティング溶液を抜きとる回収槽21と
供給槽8の底面に連結され、バルブ22を介して処理槽
5に導入されるチューブ23と、処理槽5の底面に連結
され、バルブ24を介して回収槽21に導入されるチュ
ーブ25とから構成される。
Embodiment 2 As shown in FIGS. 2 and 3, this device has a holding device 2 that holds a substrate 1 such as a plate glass, one side is opened in a shape that matches the substrate 1, and the other side and bottom are closed. , a processing tank 5 with a small opening 3 formed by notching the upper part of the unopened side surface in a sawtooth shape, and a rectifying section 4 having a downwardly narrowed structure; a supply tank 8 which is provided above the processing tank 5 and supplies the same coating solution as in Example 1, and a recovery tank 21 which is provided below the processing tank 5 and which extracts the coating solution. Consists of a tube 23 connected to the bottom of the tank 8 and introduced into the processing tank 5 via a valve 22, and a tube 25 connected to the bottom of the processing tank 5 and introduced into the recovery tank 21 via a valve 24. be done.

なお、第2図には図示しないがこの場合にも処理槽5の
周囲を2重構造にして真空引きできるようにした方がよ
い。
Although not shown in FIG. 2, in this case as well, it is preferable to form a double structure around the processing tank 5 so that it can be evacuated.

次に、薄膜のコーティング手順を説明する。Next, the thin film coating procedure will be explained.

まず、板ガラス等の基板1を保持装置2に載置し、基板
1と処理槽5を密着させた状態でバルブ22を開き処理
槽にコーティング液を入れ、液面が所定レベルから一部
オーバーフローしたところでバルブ22を閉じる。処理
槽5の液面が静止した後、バルブ24を開き、その開度
を液面降下速度が所望の値になるように調整して、コー
ティング液をほぼ一定速度で抜き出す。
First, a substrate 1 such as a plate glass is placed on the holding device 2, and with the substrate 1 and the processing tank 5 in close contact with each other, the valve 22 is opened and the coating liquid is poured into the processing tank, until the liquid level partially overflows from a predetermined level. By the way, valve 22 is closed. After the liquid level in the processing tank 5 becomes stationary, the valve 24 is opened and its opening degree is adjusted so that the rate of drop in the liquid level becomes a desired value, and the coating liquid is extracted at a substantially constant rate.

その後は実施例1のように熱処理槽をして均一厚さのT
iO2膜を得た。
After that, as in Example 1, a heat treatment tank is used to obtain a uniform thickness of T.
An iO2 film was obtained.

以上、好適な実施例により説明したが、本発明はこれら
に限定されるものではなく、種々の応用が可能である。
Although the present invention has been described above using preferred embodiments, the present invention is not limited to these embodiments, and various applications are possible.

本発明により得られる薄膜はTiO□膜以外にも5in
t膜、ZrOz膜、Ah03あるいはこれらの混合膜な
どの光学?!J膜、重クロム酸ゼラチン膜などのホログ
ラム用薄膜等種々のものがあり、従つてコーティング溶
液も種々のものが適用出来る。
In addition to the TiO□ film, the thin film obtained by the present invention is
Optical materials such as t film, ZrOz film, Ah03, or a mixture of these films? ! There are various thin films for holograms such as J film and dichromate gelatin film, and therefore various coating solutions can be applied.

基板には板ガラス以外にも各種のプラスチック板などで
もよく、その形状も平面だけでなく曲面であっても処理
槽の開口部を基板に合致する形状にすればよいので、各
種形状の基板に適用することができる。
The substrate can be made of various plastic plates other than plate glass, and even if the shape is not only flat but curved, the opening of the processing tank can be shaped to match the substrate, so it can be applied to substrates of various shapes. can do.

整流部は実施例のような5角形状のもの以外にも3角形
状など徐々にに絞った構造にするか、第5図に示すよう
に、絞らずに整流部の長さを充分長くして、チューブを
その底面あるいは側面下部に連通させてもよく、また実
施例のように処理槽の背側面下部に付属させる以外にも
処理槽底面に設けてもよいのは勿論である。
In addition to the pentagonal shape of the rectifying section as in the embodiment, the rectifying section may have a triangular shape that is gradually narrowed, or the length of the rectifying section may be made sufficiently long without narrowing, as shown in Fig. 5. It goes without saying that the tube may be connected to the bottom or the lower side of the processing tank, and may be provided on the bottom of the processing tank instead of being attached to the lower part of the back side of the processing tank as in the embodiment.

また、処理槽と整流部を連通ずる開口部面積は大きい方
が流れを乱さないという点では好ましいが、処理槽にコ
ーティング溶液を所定レベルまで入れた後、抜き取る際
の溶液降下速度は膜厚度により決定されるものであり、
この降下速度に対して、開口部における流速が6倍以下
、好ましくは4倍以下になるような面積すなわち処理槽
の断面積の1ノロ以上好ましくは174以上の面積に適
宜選択すればよい。
Furthermore, it is preferable that the area of the opening that communicates the treatment tank and the rectifier be large in order to avoid disturbing the flow, but once the coating solution has been poured into the treatment tank to a certain level, the rate of descent of the solution when withdrawing it will depend on the film thickness. It is decided,
The area may be appropriately selected so that the flow velocity at the opening is 6 times or less, preferably 4 times or less, with respect to this descending speed, that is, the area is 1 or more, preferably 174 or more times the cross-sectional area of the processing tank.

処理槽に、小開口部を形成するために設けた切欠き部は
塵埃などの浮遊物を除去するためにコーティング溶液を
オーバーフローさせる堰として作用するものであり、実
施例のように鋸歯状に切欠くとそれだけ断面積が小さく
なり、オーバーフロー液の流速が大きくなる等の理由に
より広範囲の浮遊物を除去できるので、好ましいが、直
線状のものなど各種の形状のものが使用できる。
The notch provided in the treatment tank to form a small opening acts as a weir for overflowing the coating solution to remove floating matter such as dust, and is cut in a sawtooth shape as in the example. It is preferable that the cross-sectional area becomes smaller and the flow rate of the overflow liquid increases, allowing floating matter to be removed over a wide range. However, various shapes such as a linear one can be used.

また、本発明は部分コーティングに好適であるが、容器
の開口面積を大きくすれれば、すなわち、容器を大型に
すれば、片面全面にコーティングすることも可能である
Further, although the present invention is suitable for partial coating, if the opening area of the container is increased, that is, if the container is made larger, it is also possible to coat the entire surface of one side.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、湿式コーティングにおいて従来、困難
であった部分コーティングをマスキングすることなく、
不要膜の除去も必要ないかあるいは最小限におさえるこ
とを簡便に可能にしたもので、しかも、膜厚の制御が容
易で、均一な膜かえられるので、ヘッドアップデイスプ
レィ用コンバイナー、反射鏡、装飾板など広く、各種の
用途に応用可能なものである。
According to the present invention, there is no need to mask partial coating, which has conventionally been difficult in wet coating.
This makes it easy to eliminate or minimize the need to remove unnecessary films, and the film thickness can be easily controlled and a uniform film can be changed, making it suitable for head-up display combiners, reflectors, It can be used for a wide variety of purposes, including decorative boards.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図、第2図はそれぞれ本発明の実施例1、実施例2
におけるコーティング装置を示す概略斜視図、第3図は
本発明における処理槽を示す斜視図、第4図は先行発明
の処理槽におけるコーティング溶液抜きとり時の流れを
示す図、第5図は本発明の別の実施態様を示す処理槽正
面図(受槽時)である。 1−m−基板    2−−一保持装置4−−− 整流
部   5−m−処理槽8−−− コーティング液供給
槽 9.23.25−m−チューブ 21−−一回収槽  22.24−−−バルブ第2図
FIG. 1 and FIG. 2 are Embodiment 1 and Embodiment 2 of the present invention, respectively.
FIG. 3 is a perspective view showing a processing tank according to the present invention; FIG. 4 is a diagram showing the flow when coating solution is removed from the processing tank according to the prior invention; FIG. It is a front view of a processing tank (at the time of a receiving tank) showing another embodiment. 1-m-substrate 2--holding device 4-- rectifying section 5-m-processing tank 8-- coating liquid supply tank 9.23.25-m-tube 21--1 recovery tank 22.24- --Valve Figure 2

Claims (3)

【特許請求の範囲】[Claims] (1)基板にコーティング溶液を接触させ成膜する薄膜
のコーティング方法において、一側面を開口した構造に
するとともに、整流部をその下方に付属せしめた処理槽
の該開口面を基板に密着させた状態で、該処理槽にコー
ティング溶液を所定レベルまで入れ、その後コーティン
グ溶液を所定速度で抜きとることを特徴とする薄膜のコ
ーティング方法。
(1) In a thin film coating method in which a coating solution is brought into contact with a substrate to form a film, a processing tank having a structure with one side open and a rectifier attached below the opening is brought into close contact with the substrate. A method for coating a thin film, the method comprising: charging a coating solution into the processing tank to a predetermined level, and then withdrawing the coating solution at a predetermined speed.
(2)基板を保持する保持装置と、一側面を該基板に合
致する形状に開口した構造にするとともに、整流部を下
方に付属せしめた処理槽と、昇降自在に設けたコーティ
ング液供給槽を具備するとともに、前記整流部とコーテ
ィング液供給槽の底面をチューブにより連通させたこと
を特徴とする薄膜のコーティング装置。
(2) A holding device that holds the substrate, a processing tank with an opening on one side in a shape that matches the substrate, a processing tank with a flow straightening section attached below, and a coating liquid supply tank that can be raised and lowered. What is claimed is: 1. A thin film coating apparatus, further comprising: a tube that communicates the flow straightening section with the bottom surface of the coating liquid supply tank.
(3)基板を保持する保持装置と、一側面を該基板に合
致する形状に開口した構造にするとともに、整流部を下
方に付属せしめた処理槽を具備するとともに、前記処理
槽にコーティング溶液を供給する供給槽と、前記整流部
底面からコーティング溶液を抜き取る回収槽をそれぞれ
処理槽の上方と下方に設け、該処理槽と、それぞれバル
ブを介してチューブにより連結したことを特徴とする薄
膜のコーティング装置。
(3) A holding device for holding a substrate, a processing tank having a structure in which one side is opened in a shape that matches the substrate, and a rectifying section attached below, and a coating solution is poured into the processing tank. A thin film coating characterized in that a supply tank for supplying and a recovery tank for extracting the coating solution from the bottom of the rectifying section are provided above and below the processing tank, respectively, and are connected to the processing tank by a tube via a valve. Device.
JP63214068A 1988-08-26 1988-08-29 Thin film coating method and apparatus Expired - Fee Related JPH0649168B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP63214068A JPH0649168B2 (en) 1988-08-29 1988-08-29 Thin film coating method and apparatus
IT8921542A IT1231384B (en) 1988-08-26 1989-08-22 PROCEDURE AND DEVICE FOR COATING THE SURFACE OF A PLATE WITH A THIN LIQUID FILM.
DE3927849A DE3927849A1 (en) 1988-08-26 1989-08-23 METHOD AND DEVICE FOR APPLYING A THIN LIQUID FILM TO A SUBSTRATE SURFACE
US07/397,672 US5009933A (en) 1988-08-26 1989-08-23 Method and apparatus for coating thin liquid film on plate surface
KR1019890012135A KR930001507B1 (en) 1988-08-26 1989-08-25 Method and apparatus for coating thin liquid film on plate surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63214068A JPH0649168B2 (en) 1988-08-29 1988-08-29 Thin film coating method and apparatus

Publications (2)

Publication Number Publication Date
JPH0263572A true JPH0263572A (en) 1990-03-02
JPH0649168B2 JPH0649168B2 (en) 1994-06-29

Family

ID=16649716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63214068A Expired - Fee Related JPH0649168B2 (en) 1988-08-26 1988-08-29 Thin film coating method and apparatus

Country Status (1)

Country Link
JP (1) JPH0649168B2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52146451A (en) * 1976-06-01 1977-12-06 Sumitomo Chem Co Ltd Dipping apparatus
JPS5315095A (en) * 1976-07-28 1978-02-10 Toshiba Corp Preparing recurrence reflector having gas layer
JPS58172468U (en) * 1982-05-13 1983-11-17 野尻 健史 Mechanical masking type plating equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52146451A (en) * 1976-06-01 1977-12-06 Sumitomo Chem Co Ltd Dipping apparatus
JPS5315095A (en) * 1976-07-28 1978-02-10 Toshiba Corp Preparing recurrence reflector having gas layer
JPS58172468U (en) * 1982-05-13 1983-11-17 野尻 健史 Mechanical masking type plating equipment

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Publication number Publication date
JPH0649168B2 (en) 1994-06-29

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