JPH0263557U - - Google Patents

Info

Publication number
JPH0263557U
JPH0263557U JP14194388U JP14194388U JPH0263557U JP H0263557 U JPH0263557 U JP H0263557U JP 14194388 U JP14194388 U JP 14194388U JP 14194388 U JP14194388 U JP 14194388U JP H0263557 U JPH0263557 U JP H0263557U
Authority
JP
Japan
Prior art keywords
photoelectric conversion
conversion element
resin material
image sensor
contact image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14194388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14194388U priority Critical patent/JPH0263557U/ja
Publication of JPH0263557U publication Critical patent/JPH0263557U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の実施例を示した断面簡略図、
第2図は第1図の斜視簡略図である。 3……センサ基板(高抵抗基体)、4……個別
電極、5……半導体薄膜、6……透明導電膜、8
……Alパターン(樹脂材との接着性にすぐれた
材料)、9……シリコーン樹脂(樹脂材)、11
……光電変換素子。
FIG. 1 is a simplified cross-sectional view showing an embodiment of the present invention;
FIG. 2 is a simplified perspective view of FIG. 1. 3...Sensor substrate (high resistance base), 4...Individual electrode, 5...Semiconductor thin film, 6...Transparent conductive film, 8
...Al pattern (material with excellent adhesion to resin material), 9...Silicone resin (resin material), 11
...Photoelectric conversion element.

Claims (1)

【実用新案登録請求の範囲】 高抵抗基体と、 この高抵抗基体の一主面上に配置された光電変
換素子と、 この光電変換素子を封止する樹脂材とを少なく
とも備えた密着イメージセンサにおいて、 前記光電変換素子の略外周には、前記樹脂材と
の接着性にすぐれた材料が配置されていることを
特徴とする密着イメージセンサ。
[Claims for Utility Model Registration] A contact image sensor comprising at least a high-resistance base, a photoelectric conversion element disposed on one main surface of the high-resistance base, and a resin material for sealing the photoelectric conversion element. . A close contact image sensor, wherein a material having excellent adhesiveness to the resin material is disposed approximately on the outer periphery of the photoelectric conversion element.
JP14194388U 1988-11-01 1988-11-01 Pending JPH0263557U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14194388U JPH0263557U (en) 1988-11-01 1988-11-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14194388U JPH0263557U (en) 1988-11-01 1988-11-01

Publications (1)

Publication Number Publication Date
JPH0263557U true JPH0263557U (en) 1990-05-11

Family

ID=31407461

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14194388U Pending JPH0263557U (en) 1988-11-01 1988-11-01

Country Status (1)

Country Link
JP (1) JPH0263557U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11973949B2 (en) 2010-10-01 2024-04-30 Dolby International Ab Nested entropy encoding

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967663A (en) * 1982-10-12 1984-04-17 Hitachi Ltd Semiconductor device
JPS6062278A (en) * 1983-09-14 1985-04-10 Toshiba Corp Image sensor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967663A (en) * 1982-10-12 1984-04-17 Hitachi Ltd Semiconductor device
JPS6062278A (en) * 1983-09-14 1985-04-10 Toshiba Corp Image sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11973949B2 (en) 2010-10-01 2024-04-30 Dolby International Ab Nested entropy encoding

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