JPH0263201B2 - - Google Patents

Info

Publication number
JPH0263201B2
JPH0263201B2 JP57204131A JP20413182A JPH0263201B2 JP H0263201 B2 JPH0263201 B2 JP H0263201B2 JP 57204131 A JP57204131 A JP 57204131A JP 20413182 A JP20413182 A JP 20413182A JP H0263201 B2 JPH0263201 B2 JP H0263201B2
Authority
JP
Japan
Prior art keywords
pattern
light
yellow
state image
color
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57204131A
Other languages
Japanese (ja)
Other versions
JPS5992563A (en
Inventor
Shigeyuki Uematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57204131A priority Critical patent/JPS5992563A/en
Publication of JPS5992563A publication Critical patent/JPS5992563A/en
Publication of JPH0263201B2 publication Critical patent/JPH0263201B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0216Coatings
    • H01L31/02161Coatings for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02162Coatings for devices characterised by at least one potential jump barrier or surface barrier for filtering or shielding light, e.g. multicolour filters for photodetectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optical Filters (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Color Television Image Signal Generators (AREA)

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明は半導体基板を用いたカラー固体撮像
素子に関し、特にカラー撮像の色特性を向上させ
たカラーフイルタの構成に係わるものである。
DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a color solid-state image sensing device using a semiconductor substrate, and particularly to the configuration of a color filter that improves the color characteristics of color imaging.

〔従来技術〕[Prior art]

一般にこの種の半導体基板を用いたカラー固体
撮像素子は、従来から周知のカラー撮像管に比較
して優れた点が多いが、さらに改良すべき点とし
ては、光感度、ひいては色特性の向上と、ブルー
ミングとかスミヤ現象と呼ばれる画面上の雑音除
去が挙げられる。こゝでこの画面上の雑音の原因
には、種々の考慮が払われ、その対策も講じられ
ているところであるが、根本的には入射光による
電荷発生を減少させる処置が重要である。
In general, color solid-state image sensors using this type of semiconductor substrate have many advantages over conventionally well-known color image pickup tubes, but improvements in light sensitivity and color characteristics still need to be improved. , the removal of on-screen noise called blooming or smearing. Various considerations have been made into the causes of this noise on the screen, and countermeasures have been taken, but fundamentally it is important to take measures to reduce the generation of charges due to incident light.

この入射光によつて半導体基板に生ずる電荷
は、光検出素子の領域におけるものと、それ以外
の領域におけるものとに区分できるが、前者領域
での電荷こそ装置の目的であるから必要であつて
も、後者領域での電荷は全く不必要であり、この
後者領域に入射する光についてはこれを遮断しな
ければならない。この後者領域への光遮断処置を
講じた従来例のカラー固体撮像素子の構成を第1
図に示す。すなわち、この第1図において、シリ
コン半導体基板1上には、拡散層2によりp−n
接合面を形成して感光素子部とし、この感光素子
部に生じた電荷をゲート3によりドレイン4に移
して、垂直信号線5から外部に出力させる。こゝ
で入射光は感光素子部以外の領域においても電荷
を発生するから、これを抑制するために同感光素
子部以外の領域を金属膜6により遮光するが、こ
の金属膜6を形成するために絶縁膜7を必要と
し、これによつて金属膜6付近の構造が盛り上る
ことゝなり、またこのため必然的に感光素子部の
領域に平坦化膜8を付着させてから、これらの上
にカラーフイルタ9,10を形成している。
The charges generated on the semiconductor substrate by this incident light can be divided into those in the area of the photodetector and those in other areas, but the charges in the former area are necessary because they are the purpose of the device. However, the charge in the latter region is completely unnecessary, and the light incident on this latter region must be blocked. The configuration of a conventional color solid-state image sensor that takes measures to block light to this latter region is shown in the first example.
As shown in the figure. That is, in FIG. 1, on the silicon semiconductor substrate 1, the p-n
A bonding surface is formed to form a photosensitive element portion, and charges generated in this photosensitive element portion are transferred to a drain 4 by a gate 3 and outputted to the outside from a vertical signal line 5. Here, since the incident light generates charges in areas other than the photosensitive element, in order to suppress this, the area other than the photosensitive element is shielded from light by the metal film 6, but in order to form this metal film 6, This requires an insulating film 7, which causes the structure in the vicinity of the metal film 6 to bulge, and for this reason, it is necessary to deposit a planarizing film 8 on the area of the photosensitive element, and then apply it over these layers. Color filters 9 and 10 are formed on.

従つてこの従来構成の場合、拡散層2による感
光素子部の領域と、これ以外のゲート3,ドレイ
ン4および垂直信号線5の領域とには大きな段差
を生ずることになり、この大きな段差が入射光の
迷路となつて、入射光の一部が基板1内に侵入し
て雑音の原因となる。すなわち、この従来構成で
は迷光の基板内への侵入を防止できず、このため
に基板内で発生した電荷が垂直信号線に作用し
て、画面上にハイライトが広がる現象、つまりブ
ルーミングとかスミヤ現象の発生となる不都合を
有するものであつた。
Therefore, in the case of this conventional configuration, a large step is created between the region of the photosensitive element portion formed by the diffusion layer 2 and the other regions of the gate 3, drain 4, and vertical signal line 5, and this large step is caused by the incident light. A part of the incident light enters the substrate 1 as a maze of light and causes noise. In other words, this conventional configuration cannot prevent stray light from entering the board, and as a result, charges generated within the board act on the vertical signal lines, causing a phenomenon in which highlights spread on the screen, ie, blooming or smearing. This had the disadvantage of causing problems.

〔発明の概要〕[Summary of the invention]

この発明は従来のこのような欠点に鑑み、画像
上に発生する雑音、すなわちブルーミングとかス
ミヤ現象を抑制する目的で、シリコン半導体基板
に迷光となつて侵入する光路を遮断する手段を提
案するものである。
In view of these conventional drawbacks, the present invention proposes a means for blocking the optical path that enters the silicon semiconductor substrate as stray light in order to suppress noise generated on images, that is, blooming and smear phenomena. be.

こゝでカラー固体撮像素子にあつては、いわゆ
る解像度250TV本を実現するのに、おゝよそ20
万個の絵素が形成され、これらすべての撮像機能
が正確に働くかどうかを検査する必要があり、こ
の検査の1つとして顕微鏡による観察がある。す
なわち、受光素子以外の部分を光学的に観察し得
ることが重要な条件になる。そしてまた半導体中
に侵入する光の深さはその波長に依存し、青色は
浅く、かつ緑色から赤色に従つて深く侵入するこ
とが知られており、深部に至つて発生する電界
が、基板に加えられている電界に従つて隣接する
絵素などの電気的影響を与えるのである。
In the case of a color solid-state image sensor, it takes about 20
Tens of thousands of picture elements are formed, and it is necessary to inspect whether all of these imaging functions are working correctly, and one of these inspections is observation using a microscope. That is, it is an important condition that parts other than the light receiving element can be optically observed. It is also known that the depth of light penetrating into a semiconductor depends on its wavelength, with blue being shallower and penetrating deeper from green to red. According to the applied electric field, adjacent picture elements are electrically influenced.

従つてこの発明では、これらの条件を考慮し、
カラーフイルタとして黄色モザイクパターンを使
用する場合、この黄色モザイクパターンにより迷
光の原因となる部分をも同時に被覆して、迷光の
光路遮断をなすようにしたことを特徴とするもの
である。
Therefore, in this invention, taking these conditions into consideration,
When a yellow mosaic pattern is used as a color filter, the yellow mosaic pattern is characterized in that it also covers the area that causes stray light, thereby blocking the optical path of the stray light.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明に係わるカラー固体撮像素子の
一実施例につき、第2図ないし第4図を参照して
詳細に説明する。
Hereinafter, one embodiment of the color solid-state image sensing device according to the present invention will be described in detail with reference to FIGS. 2 to 4.

第2図はこの実施例による黄色フイルタを含む
モザイクパターンを示しており、緑色(G)パタ
ーン11,シアン色(Gy)パターン12,およ
び黄色(Ye)パターン13の3色パターンから
なつている。
FIG. 2 shows a mosaic pattern including a yellow filter according to this embodiment, and consists of three color patterns: a green (G) pattern 11, a cyan (Gy) pattern 12, and a yellow (Ye) pattern 13.

また第3図,第4図は第2図−,,線
部の断面で、各図中前記第1図と同一符号は同一
または相当部分を示しており、この実施例では、
各色対応の拡散層2以外の部分をすべて黄色
(Ye)パターン13により被覆させたものであ
り、特にこの場合にあつては、緑色(G)パター
ン11とシアン色(Cy)パターン12に対応し
た拡散層以外の部分を除いて遮光膜をも兼ねる黄
色(Ye)パターン13を同時に形成すればよく、
その後、平坦化膜8を形成してから緑色(G)パ
ターン11とシアン色(Cy)パターン12とを
形成すればよい。
Furthermore, FIGS. 3 and 4 are cross-sections taken along lines -,, in FIG. 2, and in each figure, the same reference numerals as in FIG.
All parts other than the diffusion layer 2 corresponding to each color are covered with a yellow (Ye) pattern 13, and in particular in this case, the parts corresponding to the green (G) pattern 11 and the cyan (Cy) pattern 12 are covered. It is sufficient to simultaneously form a yellow (Ye) pattern 13 that also serves as a light shielding film except for the portions other than the diffusion layer.
Thereafter, after forming the flattening film 8, a green (G) pattern 11 and a cyan (Cy) pattern 12 may be formed.

そしてこの実施例の場合、遮光膜をも兼ねる黄
色(Ye)パターン13は、表面凹凸に做つて形
成されるため迷光の侵入が殆んどなく、同パター
ン13上部の浅い領域で緑色,シアン色による電
荷の発生があるのみで、こゝにブルーミングとか
スミヤ現象を大巾に減少できると共に、遮光膜を
黄色(Ye)パターンと同時に形成するために、
結果として全体の製造工程を大巾に簡略化できる
のである。
In the case of this embodiment, the yellow (Ye) pattern 13, which also serves as a light-shielding film, is formed in conjunction with the surface unevenness, so there is almost no stray light entering, and the shallow region above the pattern 13 is colored green and cyan. Blooming and smearing phenomena can be greatly reduced by only generating electric charges due to
As a result, the entire manufacturing process can be greatly simplified.

なお前記実施例においては、黄色(Ye)パタ
ーンと同時に遮光膜を形成しているが、それぞれ
別に形成してもよいことは勿論である。また従来
の金属による遮光膜と併用してもよく、さらに前
記実施例でMOS形以外の形式、例えばCCD形、
CID形などにも適用可能である。
In the above embodiment, the light shielding film is formed at the same time as the yellow (Ye) pattern, but it goes without saying that they may be formed separately. In addition, it may be used in combination with a conventional metal light-shielding film.
It is also applicable to CID type etc.

〔発明の効果〕〔Effect of the invention〕

以上詳述したようにこの発明によるときは、黄
色パターンを含むモザイクパターンを半導体基板
上に形成したカラー固体撮像素子にあつて、黄色
パターン以外のパターンに対応する感光部分を除
く全撮像面に、黄色パターン形成と同時、もしく
は別に遮光膜としての黄色パターンを形成したか
ら、基板内への迷光の侵入を防止できて、ブルー
ミングとかスミヤ現象を抑制でき、かつ素子製造
工程の簡略化を図れるほか、素子自体の信頼性向
上に役立つなどの特長がある。
As detailed above, according to the present invention, in a color solid-state image sensing device in which a mosaic pattern including a yellow pattern is formed on a semiconductor substrate, the entire imaging surface except for the photosensitive portion corresponding to patterns other than the yellow pattern, Since the yellow pattern is formed as a light-shielding film at the same time as the yellow pattern formation or separately, it is possible to prevent stray light from entering the substrate, suppress blooming and smear phenomena, and simplify the device manufacturing process. It has features such as being useful for improving the reliability of the element itself.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例によるカラー固体撮像素子の要
部構成を示す断面図、第2図はこの発明の一実施
例を適用したカラー固体撮像素子の平面モザイク
パターン図、第3図および第4図は第2図−
線部および−線部の断面図である。 1……シリコン半導体基板、2……拡散層(感
光部分)、3……ゲート、4……ドレイン、5…
…垂直信号線、7……絶縁膜、8……平坦化膜、
11……緑色パターン、12……シアン色パター
ン、13……遮光膜を兼ねた黄色パターン。
FIG. 1 is a cross-sectional view showing the main structure of a conventional color solid-state image sensor, FIG. 2 is a plane mosaic pattern diagram of a color solid-state image sensor to which an embodiment of the present invention is applied, and FIGS. 3 and 4. Figure 2-
It is a sectional view of a line part and a - line part. DESCRIPTION OF SYMBOLS 1... Silicon semiconductor substrate, 2... Diffusion layer (photosensitive part), 3... Gate, 4... Drain, 5...
... Vertical signal line, 7 ... Insulating film, 8 ... Flattening film,
11...Green pattern, 12...Cyan pattern, 13...Yellow pattern that also serves as a light shielding film.

Claims (1)

【特許請求の範囲】[Claims] 1 黄色パターンを含むモザイクパターンを半導
体基板上に形成したカラー固体撮像素子におい
て、前記黄色パターン以外のパターンに対応する
感光部分を除く全撮像面に、黄色パターン形成と
同時、もしくは別に遮光膜としての黄色パターン
を形成したことを特徴とするカラー固体撮像素
子。
1. In a color solid-state image sensor in which a mosaic pattern including a yellow pattern is formed on a semiconductor substrate, a light-shielding film is applied to the entire imaging surface excluding the photosensitive portion corresponding to patterns other than the yellow pattern, either simultaneously with the formation of the yellow pattern or separately. A color solid-state image sensor characterized by forming a yellow pattern.
JP57204131A 1982-11-18 1982-11-18 Color solid-state image pickup element Granted JPS5992563A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57204131A JPS5992563A (en) 1982-11-18 1982-11-18 Color solid-state image pickup element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57204131A JPS5992563A (en) 1982-11-18 1982-11-18 Color solid-state image pickup element

Publications (2)

Publication Number Publication Date
JPS5992563A JPS5992563A (en) 1984-05-28
JPH0263201B2 true JPH0263201B2 (en) 1990-12-27

Family

ID=16485342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57204131A Granted JPS5992563A (en) 1982-11-18 1982-11-18 Color solid-state image pickup element

Country Status (1)

Country Link
JP (1) JPS5992563A (en)

Also Published As

Publication number Publication date
JPS5992563A (en) 1984-05-28

Similar Documents

Publication Publication Date Title
CN102396066A (en) Solid-state image sensing apparatus
JPH10189929A (en) Solid state image sensor
JP2009218382A (en) Solid state imaging device, manufacturing method thereof and imaging device
JP2007042933A (en) Solid-state imaging element and imaging device
JP3180748B2 (en) Solid-state imaging device
KR100193410B1 (en) Solid-state imaging device
JP4264249B2 (en) MOS type image sensor and digital camera
JPH04364779A (en) Solid state image sensor
US10672811B2 (en) Image sensing device
KR20090056431A (en) Image sensor and method for manufacturing thereof
JPH0263201B2 (en)
JPH05175471A (en) Solid-state image sensing device
JPH11354763A (en) Solid state image sensor and fabrication of color filter array
JPH03276677A (en) Solid-state image sensing element
JP3138502B2 (en) Solid-state imaging device
JPH0794694A (en) Solid state image sensor
JPS5972164A (en) Solid-state image-pickup device
KR100555480B1 (en) Solid static pick-up device having microlens and method for manufacturing the same
JP2698293B2 (en) Method for manufacturing solid-state imaging device
JP3128851B2 (en) Solid-state imaging device
JPH04129268A (en) Solid-state image sensor
JP2005353799A (en) Linear sensor
JP2956092B2 (en) Solid-state imaging device and method of manufacturing the same
JPS6386474A (en) Solid-state image sensing device
JP2663476B2 (en) Solid-state imaging device