JPH0263103A - Trimming apparatus - Google Patents
Trimming apparatusInfo
- Publication number
- JPH0263103A JPH0263103A JP63214420A JP21442088A JPH0263103A JP H0263103 A JPH0263103 A JP H0263103A JP 63214420 A JP63214420 A JP 63214420A JP 21442088 A JP21442088 A JP 21442088A JP H0263103 A JPH0263103 A JP H0263103A
- Authority
- JP
- Japan
- Prior art keywords
- laser
- trimming
- beams
- trimming device
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009966 trimming Methods 0.000 title claims abstract description 61
- 230000010355 oscillation Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 5
- 238000012423 maintenance Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000013307 optical fiber Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
【発明の詳細な説明】
[発明の目的]
(産業上の利用分野)
本発明はトリミング装置に係わり、特にトリミング加工
にレーザ光線を用いたトリミング装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a trimming device, and particularly to a trimming device that uses a laser beam for trimming.
(従来の技術)
例えば、厚膜回路基板の製造において、印刷法で形成し
た印刷抵抗体について、トリミング加工が良く行われる
。つまり、上記構成した厚膜回路の製品化乃至使用に当
り、印刷抵抗体を適宜切削などして、抵抗値を変え、回
路全体としての特性を調整することは良く知られている
。(Prior Art) For example, in the manufacture of thick film circuit boards, trimming is often performed on printed resistors formed by a printing method. That is, it is well known that when commercializing or using the thick film circuit configured as described above, the printed resistor is cut as appropriate to change the resistance value and adjust the characteristics of the entire circuit.
ところで、上記印刷抵抗体等のトリミング用装置として
、例えば、第2図に示すような、レーザトリミングシス
テム乃至レーザトリミング装置が実用に供されている。By the way, as a device for trimming the above-mentioned printed resistor etc., for example, a laser trimming system or a laser trimming device as shown in FIG. 2 is put into practical use.
第2図は上記レーザトリミング装置のブロック図であり
、レーザ光発生装置1、トリミング装置本体2を主要構
成部としている。即ち、発振電源1aとレーザ光発振器
1bとで構成されたレーザ光発生装置1で発生したレー
ザ光は、トリミング装置2に導かれる。一方、トリミン
グ加工2は、トリミング加工する電子部品2aを載置す
るX−Yテーブル2bと、前記トリミング加工される電
子部品2aの特性チエツク等を行う?#1定器2cと、
この測定器2cによる測定結果に基づき、前記レーザ発
生装置1から導かれるレーザ光の通゛過、遮断するシャ
ッターユニットlc、及び電子部品に照射するレーザ光
の角度等変える揺動ミラー2dのドライバー機構2eを
各々駆動制御する駆動制御手段2rとから構成されてい
る。しかして、上記トリミング装置において、トリミン
グする電子部品2aのX−Y方向への移動、揺動ミラー
2dによるレーザ光の照射位置(X−Y方向)の移動は
相対的になされる。FIG. 2 is a block diagram of the laser trimming device, which includes a laser beam generator 1 and a trimming device main body 2 as main components. That is, laser light generated by a laser light generating device 1 composed of an oscillation power source 1 a and a laser light oscillator 1 b is guided to a trimming device 2 . On the other hand, in the trimming process 2, the characteristics of the X-Y table 2b on which the electronic component 2a to be trimmed is placed and the electronic component 2a to be trimmed are checked. #1 regulator 2c,
Based on the measurement result by the measuring device 2c, a shutter unit lc is used to pass or block the laser beam guided from the laser generator 1, and a driver mechanism for the swinging mirror 2d changes the angle of the laser beam irradiated onto electronic components. 2e, and drive control means 2r for controlling the drive of each drive unit 2e. In the above trimming device, the electronic component 2a to be trimmed is moved in the X-Y direction, and the laser beam irradiation position (in the X-Y direction) by the swinging mirror 2d is moved relative to each other.
(発明が解決しようとする課題)
上記の様に、従来のレーザトリミングシステム乃至レー
ザトリミング装置は、レーザ発生装置(レーザー発振器
)1−台に対して、トリミング装置本体2−台の割で構
成され、且つレーザ発振器tbから出力されたレーザ光
を直接トリミング装置本体2に導き、所要のトリミング
を行う様になっている。ところで、上記の様に、トリミ
ング装置本体2−台につきレーザ発振器1b−台を組合
せているため、トリミング装置を複数台設置しようとす
れば、かなりのスペースを要することになる。(Problem to be Solved by the Invention) As mentioned above, the conventional laser trimming system or laser trimming device is configured with one laser generator (laser oscillator) and two trimming device bodies. , and the laser beam output from the laser oscillator tb is directly guided to the trimming device main body 2 to perform the required trimming. By the way, as mentioned above, since 1b laser oscillators are combined for each 2 trimming device bodies, a considerable amount of space will be required if a plurality of trimming devices are to be installed.
しかも、前記レーザ発振器1bは、比較的高価で設備費
が嵩むばかりでなく、メンテナンスを要する。Moreover, the laser oscillator 1b is not only relatively expensive and requires high equipment costs, but also requires maintenance.
このメンテナンスについては、レーザ発振器1bの台数
が増える程、そのための時間や、費用を要する。また、
レーザ発生装置1を各レーザトリミング装置本体毎に備
えているため、発振電源1aに対する、冷却水や廃水の
配管施工も多くなり不経済である。Regarding this maintenance, the more the number of laser oscillators 1b increases, the more time and cost it takes. Also,
Since the laser generator 1 is provided for each laser trimming device main body, piping for cooling water and waste water to the oscillation power source 1a is required, which is uneconomical.
[発明の構成]
(課題を解決するための手段)
本発明は、上記事情に対してなされたもので、−台のレ
ーザ発生装置に対して、複数台のトリミング装置本体を
組合せたことを骨子とする。つまり、一つの発振電源と
一台のレーザ発振器を用い発生したレーザ光を複数本に
分け、分けられたレーザ光を、複数台のトリミング装置
本体に導き(送り)、所要のトリミングを行うようにし
たものである。[Structure of the Invention] (Means for Solving the Problems) The present invention has been made in view of the above-mentioned circumstances, and the main point is that a plurality of trimming device bodies are combined with one laser generator. shall be. In other words, the laser beam generated using one oscillation power supply and one laser oscillator is divided into multiple beams, and the divided laser beams are guided (sent) to multiple trimming devices to perform the required trimming. This is what I did.
(作 用)
上記、構成乃至手段を採る本発明のトリミング装置は、
−台のレーザ発振器の駆動により、複数のトリミング装
置本体で、例えば厚膜回路について、各々所要のトリミ
ングを同時に行いうる。(Function) The trimming device of the present invention employing the above configuration or means has the following features:
By driving multiple laser oscillators, it is possible to simultaneously perform required trimming, for example, on thick film circuits, using a plurality of trimming device bodies.
即ち、−台のレーザ発振器から発生したレーザ光は複数
本に分けられ、これら分けられたレーザ光は各々別個の
トリミング装置本体に送られ、且つ、それら各トリミン
グ装置本体におけるトリミングの状態に対応して、レー
ザ光の照射または非照射が適宜制御されて、所要のトリ
ミング加工が行われる。That is, the laser beams generated from the - laser oscillators are divided into a plurality of beams, and each of these divided laser beams is sent to a separate trimming device body, and the beams are adjusted to correspond to the trimming state in each trimming device body. Then, irradiation or non-irradiation of the laser beam is appropriately controlled to perform the required trimming process.
(実施例)
以下第1図を参照して本発明の詳細な説明する。第1図
は、本発明のトリミング装置の一構成例を示すブロック
図で、1は発振電源1a及びレーザ発振器例えばYAG
レーザ発振器1bから成るレーザ発生装置である。(Example) The present invention will be described in detail below with reference to FIG. FIG. 1 is a block diagram showing an example of the configuration of the trimming device of the present invention, in which 1 indicates an oscillation power source 1a and a laser oscillator, such as a YAG
This is a laser generator consisting of a laser oscillator 1b.
2はトリミング装置本体で、被加工体例えば厚膜回路2
aを載置するX−Yテーブル2bと、前記厚膜回路2a
のトリミング状態を検知する測定器2Cと、前記n1定
器2cのn1定結果に基づき、ドライバー機構2eを介
してnrt記X−YテーブルのXYh同への移動制御及
びトリミング加工のためのレーザ光を供給、または遮断
するシャッターユニット(後述)を駆動制御する駆動制
御手段2fとから構成されている。2 is the main body of the trimming device, and the object to be processed, for example, the thick film circuit 2
an X-Y table 2b on which a is placed, and the thick film circuit 2a
A measuring device 2C detects the trimming state of the nrt, and a laser beam for controlling the movement of the nrt X-Y table in the XYh direction and trimming processing based on the n1 constant result of the n1 constant device 2c. and a drive control means 2f that controls the drive of a shutter unit (described later) that supplies or cuts off the power.
また、3はレーザ光分岐ユニット部で、前記レーザ発生
装置1とトリミング装置本体2との間に介在し、レーザ
発生装置1で発生したレーザ光を複数本に分け、それら
分けられたレーザ光を、各々対応するトリミング装置本
体2側に送る役割をする。つまり、このレーザ光分岐ユ
ニット部3は、レーザ光の進行軸上に分岐ユニットを成
す複数のハーフミラ−3a1.3a2.3a3が順次配
設されており、これらのハーフミラ−3a+ 、3a2
.3a3によって、各々直進レーザ光Aと反射レーザ光
Bとにとに分岐させる。この点さらに説明すると、レー
ザ発振器tbから直進してきたレーザ光はハーフミラ−
3a1を介して直進したものは次ぎのハーフミラ−3a
2に向かい、反射レーザ光Bはレーザ光の通過遮断を行
うシャッターユニット3b1を介して、前記トリミング
装置本体2に所要のレーザ光を導く光ファイバー 3c
1の入射ユニット3d、に入射される。前記ハーフミラ
−3a2.3axについても同様に、直進光Aと反射光
Bに分岐して、反射光Bは各々シャッターユニット3b
2や3b3を介して、入射ユニット3d2や3d3人射
し、光ファイ/(−3c2や3c3にて導光されて、各
々対応するトリミング装置本体(図示路)に供給される
構成と成っている。ここでトリミング装置本体2等に供
給されるレーザ光は、レーザ光放射ユニット2g1から
照射され所要のトリミング加工に寄与する。Reference numeral 3 denotes a laser beam branch unit, which is interposed between the laser generator 1 and the trimming device body 2, and divides the laser beam generated by the laser generator 1 into a plurality of beams, and divides the divided laser beams into multiple beams. , each plays the role of sending to the corresponding trimming device main body 2 side. That is, in this laser beam branching unit section 3, a plurality of half mirrors 3a1.3a2.3a3 forming a branching unit are sequentially arranged on the traveling axis of the laser beam, and these half mirrors 3a+, 3a2
.. 3a3, each of the laser beams is branched into a straight laser beam A and a reflected laser beam B. To further explain this point, the laser beam traveling straight from the laser oscillator tb is a half mirror.
The one that goes straight through 3a1 is the next half mirror - 3a
2, the reflected laser beam B passes through an optical fiber 3c that guides the required laser beam to the trimming device main body 2 via a shutter unit 3b1 that blocks the passage of the laser beam.
The light is input to the first input unit 3d. Similarly, the half mirror 3a2.3ax is split into straight light A and reflected light B, and the reflected light B is transmitted to each shutter unit 3b.
The light is emitted from the input units 3d2 and 3d3 through the input units 2 and 3b3, guided by the optical fibers /(-3c2 and 3c3, and supplied to the corresponding trimming device bodies (paths shown). Here, the laser light supplied to the trimming device main body 2 and the like is irradiated from the laser light emitting unit 2g1 and contributes to the required trimming process.
なお、上記実施例では、レーザ発振器としてYAGレー
ザー発振器を用いたが、他のレーザ発振器でもよいし、
また、レーザ光分岐ユニット部で各々分けられたレーザ
光を、対応するトリミング装置本体に導光乃至供給する
レーザ光導光路は光ファイバーに限らず他の光学系であ
ってもよい。In addition, in the above embodiment, a YAG laser oscillator was used as the laser oscillator, but other laser oscillators may be used.
Further, the laser beam guide path for guiding or supplying the laser beams separated by the laser beam branching unit to the corresponding trimming device main body is not limited to an optical fiber, and may be any other optical system.
[発明の効果]
上記の様に、本発明のトリミング装置は、−台レーザ発
振器と、複数台のトリミング装置本体とがレーザ光分岐
ユニット部を介して結合された構成を成している。即ち
、複数台のトリミング装置本体に対して、−台のレーザ
発振器から発生したレーザ光が複数本に分岐されて、各
々供給され同時に所要のトリミング加工を行いうる。従
って、例えば、薄膜回路の量産において、それらの薄膜
回路に対して量産的なトリミング加工に適する。[Effects of the Invention] As described above, the trimming device of the present invention has a configuration in which a -base laser oscillator and a plurality of trimming device bodies are coupled via a laser beam branching unit. That is, the laser beams generated from the - laser oscillators are branched into a plurality of beams and supplied to a plurality of trimming apparatus bodies, respectively, so that required trimming can be performed simultaneously. Therefore, for example, in the mass production of thin film circuits, the present invention is suitable for mass production trimming of these thin film circuits.
しかも、複数台のトリミング装置本体に対して、−台の
レーザ発振器で足り、且つ各々所要のトリミング加工が
可能なため、少なくとも低減したレーザ発生装置の分だ
けは、設置スペースを小さく出来るばかりでなく、設備
費の低減やレーザ発生装置乃至レーザ発振器に対するメ
ンテナンスの低減をもたらす等実用上条くの利点がある
。Furthermore, since -1 laser oscillator is sufficient for multiple trimming device bodies, and the required trimming processing can be performed for each, not only can the installation space be reduced, at least by the amount of reduced laser generators. There are many practical advantages, such as reduced equipment costs and reduced maintenance for laser generators and laser oscillators.
第1図は本発明に係わるトリミング装置の構成例を示す
ブロック図、第2図は従来のトリミング装置の構成を示
すブロック図である。
1 ・・・レーザ発生装置
■a
b
2「
a1
sb+
c1
・・・発振電源
・・・レーザ発振器
・・・トリミング装置本体
・・・駆動制御手段
・・・レーザ光分岐ユニット部
、3a2.3a3・・・ハーフミラ−
13b2.3b3・・・シャッターユニット、3C2,
3C3・・・レーザ光導光路出願人 株式会
社 東芝FIG. 1 is a block diagram showing an example of the configuration of a trimming device according to the present invention, and FIG. 2 is a block diagram showing the configuration of a conventional trimming device. 1...Laser generator ■a b 2'a1 sb+ c1...Oscillation power source...Laser oscillator...Trimming device body...Drive control means...Laser beam branching unit, 3a2.3a3.・・Half mirror 13b2.3b3・・Shutter unit, 3C2,
3C3...Laser light guide path applicant Toshiba Corporation
Claims (1)
ーザ光を複数本に分光する分岐ユニットと、前記分岐ユ
ニットで複数本に分光されたレーザ光を各別に通過、遮
断する複数のシャッターユニットと、前記各シャッター
ユニットを通過したレーザ光を各別に導光するレーザ光
導光路と、前記各レーザ光導光路を導光されてくるレー
ザ光にてトリミング加工する複数のトリミング装置本体
と、前記各トリミング装置本体からの信号で各対応する
前記シャッターユニットを各々駆動制御する駆動制御手
段とを具備して成ることを特徴とするトリミング装置。a laser generator, a branching unit that splits the laser beam generated by the laser generator into a plurality of beams, a plurality of shutter units that individually pass and block the laser beams split into a plurality of beams by the branching unit; A laser light guide path that separately guides the laser light that has passed through each shutter unit; a plurality of trimming device bodies that trim the laser light guided through each of the laser light guide paths; A trimming device comprising drive control means for driving and controlling each of the corresponding shutter units using a signal.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63214420A JPH0263103A (en) | 1988-08-29 | 1988-08-29 | Trimming apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63214420A JPH0263103A (en) | 1988-08-29 | 1988-08-29 | Trimming apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0263103A true JPH0263103A (en) | 1990-03-02 |
Family
ID=16655493
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63214420A Pending JPH0263103A (en) | 1988-08-29 | 1988-08-29 | Trimming apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0263103A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100740185B1 (en) * | 2006-01-24 | 2007-07-18 | (주)예스레이저 | Apparatus for spectroscope in laser welder |
US7425471B2 (en) | 2004-06-18 | 2008-09-16 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
US7435927B2 (en) | 2004-06-18 | 2008-10-14 | Electron Scientific Industries, Inc. | Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset |
US7629234B2 (en) | 2004-06-18 | 2009-12-08 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling |
US7633034B2 (en) | 2004-06-18 | 2009-12-15 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
US7687740B2 (en) | 2004-06-18 | 2010-03-30 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows |
US7935941B2 (en) | 2004-06-18 | 2011-05-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures |
US8148211B2 (en) | 2004-06-18 | 2012-04-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
US8193468B2 (en) | 2001-03-29 | 2012-06-05 | Gsi Group Corporation | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6266607A (en) * | 1985-09-19 | 1987-03-26 | 株式会社日立製作所 | Laser trimming device |
-
1988
- 1988-08-29 JP JP63214420A patent/JPH0263103A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6266607A (en) * | 1985-09-19 | 1987-03-26 | 株式会社日立製作所 | Laser trimming device |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8193468B2 (en) | 2001-03-29 | 2012-06-05 | Gsi Group Corporation | Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure |
US7425471B2 (en) | 2004-06-18 | 2008-09-16 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
US7435927B2 (en) | 2004-06-18 | 2008-10-14 | Electron Scientific Industries, Inc. | Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset |
US7629234B2 (en) | 2004-06-18 | 2009-12-08 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling |
US7633034B2 (en) | 2004-06-18 | 2009-12-15 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure |
US7687740B2 (en) | 2004-06-18 | 2010-03-30 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows |
US7923306B2 (en) | 2004-06-18 | 2011-04-12 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots |
US7935941B2 (en) | 2004-06-18 | 2011-05-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures |
US8148211B2 (en) | 2004-06-18 | 2012-04-03 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously |
KR100740185B1 (en) * | 2006-01-24 | 2007-07-18 | (주)예스레이저 | Apparatus for spectroscope in laser welder |
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