JPH0262773U - - Google Patents

Info

Publication number
JPH0262773U
JPH0262773U JP14153788U JP14153788U JPH0262773U JP H0262773 U JPH0262773 U JP H0262773U JP 14153788 U JP14153788 U JP 14153788U JP 14153788 U JP14153788 U JP 14153788U JP H0262773 U JPH0262773 U JP H0262773U
Authority
JP
Japan
Prior art keywords
resistance layer
conductor lands
arrangement direction
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14153788U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14153788U priority Critical patent/JPH0262773U/ja
Publication of JPH0262773U publication Critical patent/JPH0262773U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP14153788U 1988-10-28 1988-10-28 Pending JPH0262773U (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14153788U JPH0262773U (ko) 1988-10-28 1988-10-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14153788U JPH0262773U (ko) 1988-10-28 1988-10-28

Publications (1)

Publication Number Publication Date
JPH0262773U true JPH0262773U (ko) 1990-05-10

Family

ID=31406688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14153788U Pending JPH0262773U (ko) 1988-10-28 1988-10-28

Country Status (1)

Country Link
JP (1) JPH0262773U (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3386281A4 (en) * 2016-04-06 2019-03-06 Mitsubishi Heavy Industries Thermal Systems, Ltd. WIRING SUBSTRATE, WIRING SUBSTRATE ATTACHED TO AN ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE ATTACHED TO AN ELECTRONIC COMPONENT

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61140193A (ja) * 1984-12-13 1986-06-27 松下電器産業株式会社 プリント配線板
JPS6226074B2 (ko) * 1979-05-17 1987-06-06 Tokyo Shibaura Electric Co

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6226074B2 (ko) * 1979-05-17 1987-06-06 Tokyo Shibaura Electric Co
JPS61140193A (ja) * 1984-12-13 1986-06-27 松下電器産業株式会社 プリント配線板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3386281A4 (en) * 2016-04-06 2019-03-06 Mitsubishi Heavy Industries Thermal Systems, Ltd. WIRING SUBSTRATE, WIRING SUBSTRATE ATTACHED TO AN ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE ATTACHED TO AN ELECTRONIC COMPONENT

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