JPH0262735U - - Google Patents

Info

Publication number
JPH0262735U
JPH0262735U JP14127088U JP14127088U JPH0262735U JP H0262735 U JPH0262735 U JP H0262735U JP 14127088 U JP14127088 U JP 14127088U JP 14127088 U JP14127088 U JP 14127088U JP H0262735 U JPH0262735 U JP H0262735U
Authority
JP
Japan
Prior art keywords
semiconductor device
groove
hole
round bar
bar lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14127088U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14127088U priority Critical patent/JPH0262735U/ja
Publication of JPH0262735U publication Critical patent/JPH0262735U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP14127088U 1988-10-28 1988-10-28 Pending JPH0262735U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14127088U JPH0262735U (zh) 1988-10-28 1988-10-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14127088U JPH0262735U (zh) 1988-10-28 1988-10-28

Publications (1)

Publication Number Publication Date
JPH0262735U true JPH0262735U (zh) 1990-05-10

Family

ID=31406198

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14127088U Pending JPH0262735U (zh) 1988-10-28 1988-10-28

Country Status (1)

Country Link
JP (1) JPH0262735U (zh)

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