JPS6268250U - - Google Patents
Info
- Publication number
- JPS6268250U JPS6268250U JP15934485U JP15934485U JPS6268250U JP S6268250 U JPS6268250 U JP S6268250U JP 15934485 U JP15934485 U JP 15934485U JP 15934485 U JP15934485 U JP 15934485U JP S6268250 U JPS6268250 U JP S6268250U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- diode element
- electrode
- terminal connected
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 9
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Details Of Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15934485U JPS6268250U (zh) | 1985-10-17 | 1985-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15934485U JPS6268250U (zh) | 1985-10-17 | 1985-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6268250U true JPS6268250U (zh) | 1987-04-28 |
Family
ID=31083686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15934485U Pending JPS6268250U (zh) | 1985-10-17 | 1985-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6268250U (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0357253A (ja) * | 1989-07-26 | 1991-03-12 | Hitachi Ltd | 半導体装置 |
-
1985
- 1985-10-17 JP JP15934485U patent/JPS6268250U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0357253A (ja) * | 1989-07-26 | 1991-03-12 | Hitachi Ltd | 半導体装置 |