JPH026094A - Method and device for inputting of position information - Google Patents

Abstract

PURPOSE:To speed up repair by setting the reference point on a drawing indicating a repair point and the corresponding point on a chip, converting the distance between the reference point on the drawing and the repair point by the drawing magnification to the actual distance on the chip and retrieving the repair point. CONSTITUTION:A layout drawing 3 to be inputted is mounted on the table 1 and an LSI chip 48 is set on an X-Y stage having a driving device 12. The corresponding point 49 on the chip 48 for the reference point O on the drawing 3 is previously set at the center C of a monitor device 14. The repair point P on the drawing 3 is then assigned and the data of the point P is computed together with the data of the reference point O by an arithmetic unit 10 to determine the distance between the points O and P on the drawing 3. Further, the arithmetic unit 10 computes the actual distance between the correspondent points of the points O and P on the chip 48 from the magnification of the drawing 3 and drives the X-Y stage 49 to determine the repair point. Since the repair point is easily obtd., the repair work is speeded up.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method and device for inputting position information, and in particular, when repairing (disconnecting or connecting) an LSI,
The present invention relates to a location information input method and device suitable for automatically storing, searching, and moving to a predetermined location based on a simple location information instruction.

[Conventional technology]

As the performance and speed of semiconductor integrated circuits (LSIs) have increased, they have become smaller and more highly integrated. It is inviting Under such circumstances, it is necessary to identify the defective part on the prototype LSI chip and repair the defective wiring by cutting the wiring existing in that part or by forming wiring in an arbitrary part. If an LSI with perfect operation is manufactured, subsequent characteristic evaluations and design changes can be carried out quickly.

As for the conventional technology related to LSI repair, for example, Extended Abstracts of the Seventeenth Conference on Solid State Devices and Materials, Tokyo, 1985, pp. 193 to 196
:racts of the 17th Conference
ence onSolid 5tate Device
s and Materials, Tokyo.

1985, ppl, 93-196) discusses a method for connecting arbitrary points. For this purpose, Mo (Co) and vapor are introduced into the LSI chip installed on the X-Y stage, a Mo film is deposited by a photochemical reaction caused by laser light irradiation, and the MO wiring is made by moving the X-Y stage. Laser CV D (C
Hamical Vapor Deposition)
The technique is shown.

Further, for example, Japanese Patent Laid-Open No. 119853/1983 discloses a technique of burying through holes with a conductive material using laser CVD technology.

If a protective film or multilayer wiring is formed, a window is opened in the insulating film between Jff1 and the laser CVD
By using technology to fill the holes (windows) with conductive material and then forming wiring, it is possible to connect any points.

However, with the miniaturization and multilayering of wiring within LSI chips,
The window openings required for connections have to be made smaller and have higher aspect ratios. For this reason, especially when embedding a conductive material in the window opening, it is necessary to accurately align the window opening and the laser beam irradiation position, so high precision positioning is essential.

As a conventional technique related to positioning, for example, Japanese Patent Application Laid-open No. 53
2. Description of the Related Art As disclosed in Japanese Patent No. 90955, an autoaligner used in manufacturing LSI is known.

[Problem to be solved by the invention]

In the above conventional technology (aligner technology), in the circuit pattern exposure process in the LSI manufacturing process, alignment marks (alignment marks) on a wafer or chip mounted on an X-Y stage and a mask for the circuit pattern to be transferred are used. The wafer or chip and the circuit pattern are brought into a desired positional relationship by adjusting until the positional deviation with the pattern becomes zero.

The alignment procedure is as follows. First, since the approximate position of the alignment mark on the wafer or chip is known based on the design data, this position information is used to move the X-Y stage (roughly (This is called alignment or pre-alignment.) Next, the center of the alignment mark is captured optically, the amount of deviation is accurately detected by means such as image processing, and the XY stage is finely adjusted so that this deviation becomes zero (referred to as fine alignment).

As described above, aligner technology is effective for highly accurate position detection of alignment marks whose approximate positions are known in the LSI manufacturing process, but when repairing any part of a completed chip, This will cause the following inconvenience.

In other words, 4τ where the repair location is an arbitrary location on chip 2
Therefore, it is not immediately clear where this position actually is. Of course, if the location data of the repair points that should be repaired can be obtained from the LSI design data,
■Moving the X-Y stage directly to the repair position according to the position data in the design data, or ■Detecting the alignment mark using the aligner technology and determining the positional relationship between the alignment mark and the repair location (design data The problem does not arise if the X-Y stage is moved from the repair position to the repair position. However, in most cases of repair, the worker marks the parts of the defective wiring that are easy to cut and connect easily on a layout diagram of the wiring on the chip or on a photograph taken with an optical microscope. The location is specified. That is, the position is not specified in the design data. Therefore, where on the actual chip is the location specified on the diagram or photo of Layara 1?
I don't immediately know how to move the stage. In the end, the operator moved the X-Y stage based on his intuition, compared the optical microscope photo showing the repaired area with the image on the chip, and moved the X-Y stage through trial and error until the two matched. The work of manually inputting repair position data is
Previously, this was necessary. However, such a method of inputting position data is not only complicated and time-consuming, but also has the problem of making mistakes in repair parts, which delays LSI development (particularly related to debugging). The challenge was to input location data accurately.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method and apparatus for inputting positional information that can easily and accurately input positional data of a repair location.

[Means to solve the problem]

The above purpose is to use a predetermined point on a layout diagram or optical microscope photograph (hereinafter referred to as "diagram") showing the repair area and a corresponding point on the LSI chip as a reference point. 1 Align the direction of the LSI chip with the diagram, indicate the reference point and repair location on the diagram, read the respective position information, and then calculate the distance between the reference point on the diagram and the designated repair location on the diagram. Using the magnification, convert to the actual distance on the LSI chip, L, and use the monitor to search around a position that is this actual distance away from the reference point on the LSI chip, identify the repair point on the LSI chip, and locate the location. This is accomplished by entering information.

[For production]

In the above configuration, the distance between the reference point on the diagram and the repair location is converted to the actual distance on the LSI chip by the calculation means using the magnification of the diagram, so the distance between the reference point on the LSI chip and the repair location is the actual distance. should be the repair point on the LSI chip. However, in reality, various errors accumulate,
Misalignment occurs.

Therefore, display the above part on the screen of the monitor device.

While looking at the image on the LSI chip, the driving device
The position of the SI chip is finely adjusted to search for the final position of the repaired part on the LSI chip, and the position information is taken in by a reading means.

By doing so, it is possible to easily input the positional information of the repair location.

In addition to the above method, it is also possible to use a computer, CRT, digitizer, etc. to find the repair location on the LSI chip.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 to 5, taking the case of LSI wiring repair as an example.

FIG. 1 is a block diagram of an embodiment of a position information input device according to the present invention, FIG. 2 is a flowchart 1 showing the processing procedure executed by the arithmetic processing unit in FIG. An example of an LSI chip screen displayed on a monitor device in the figure, FIG. 4 is a block diagram of an LSI wiring forming apparatus to which the position information input device shown in FIG. 1 is applied, and FIG. 5 is a position information according to the present invention. FIG. 3 is a configuration diagram of another embodiment of the input device of FIG.

First, the configuration and operation of an embodiment of the present invention will be explained with reference to FIGS. 1 to 3. In FIG. 1, reference numeral 1 denotes a table in which stress sensors 2 arranged in a matrix are embedded. A layout diagram 3 (for example, an LSI layout diagram) to be input is placed on the table 1, and an LSI chip 4 is placed on the X-Y stage 49 connected to the drive device 12.
8, respectively. At this time, the X and Y directions of the layout diagram 3 and the X and Y directions of the LSI chip 48 are made to match. Then, the X-Y stage 49 is driven by operating the direction switch 11 connected to the drive device 12 in advance at a point on the LSI chip 48 that corresponds to the reference point O on the layout diagram 3. , through an optical system including an objective lens 60 whose magnification is set to a predetermined magnification by an optical system magnification switch 9 and an image pickup device 13 to align with the center C of the monitor device 14 . Next, point O on the layout diagram 3 is directly specified using the pointer 4, and the point specifying switch 5 is pressed to instruct the arithmetic processing unit 10 that the point is the reference point.

In this case, the stress sensor 2 and the reference point point 1 to designation switch 5 are connected to the decoder 7, and the decoder 7 detects that the stress sensor 2 corresponding to the location currently pressed by the pointer 4 has been pressed. By detecting this and recognizing that the point designation switch 5 has been pressed, it is determined that it is the point O on the layout diagram 3, and the data of that point O is set in the arithmetic processing unit 10 (second
Step 2+ in the figure). Next, the magnification related to this layout diagram 3 is specified using the magnification setter 8, and this magnification data is set in the arithmetic processing unit 10 (step 22 in FIG.
).

After that, point the repair location P on the layout diagram 3 with the pointer 4, press the point designation switch 6 for the repair location, and the decoder 7
is operated, and the data of the repair point P is set in the arithmetic processing ¥2 position 10 (step 23 in Fig. 2). From the data and the set magnification of the layout diagram 3, the distance OP is converted into an actual distance on the LSI chip 48, the result is output to the l driving device 12, and according to this distance
The Y stage 49 moves (step 24 in FIG. 2).

When the XY stage 49 moves, a repair position screen is displayed on the monitor device 14 as shown in the screen 31 in FIG. 3(a). At this time, although the repaired area is displayed on the screen, errors due to the arrangement density of the stress sensor 2, the setting accuracy (resolution) of the magnification setter 8, and the setting accuracy of the reference point are accumulated. The center of the monitor screen (the intersection of 32a and 32b in Figure 3) and the center of the repair area (33 in Figure 3)
A wrinkle is formed at the intersection point of a and 33b). Therefore,
The optical system magnification switch 9 sets the objective lens 60 of the optical system to high magnification, and the direction indicator switch 11 switches it to active device!
2), move the X-Y stage 49 to the center of the monitor screen (the intersection of 32a and 32b) as shown in the screen 34 of FIG. 3(b). Make sure that the center of the repaired area (the intersection of 33a and 33b) is located (step 26 in FIG. 2). After adjusting in this way, press the point designation switch 6. The arithmetic processing unit 10 detects that the point designation switch 6 is pressed (step 27 in FIG. 2), and reads the X and Y coordinates of the X-Y stage to capture the position data of the repair point on the LSI chip (step 27 in FIG. 2). Step 28 in FIG. 2).

In this way, the repair location on the actual chip is f + ff j
)′L. In addition, if base 1 (to obtain the repaired area from point H2) cannot be obtained immediately from 4 sheets of Layara 1 to Figures and 1 optical microscope photograph, a combination of It is also possible to use a combination of multiple optical microscopic photographs.In other words, first locate the vicinity of the repair area using the low magnification layout l' and optical microscopic photographs according to the procedure shown in Figure 2. Furthermore, place the high-magnification optical micrograph on Table 1 again, and repeat the procedure shown in Figure 2 to create base 7 (while updating the 6 points one by one).

A desired repair position may be finally obtained.

Next, we will apply the above embodiment to an LSI wiring forming apparatus (laser CVD apparatus), which is one of the energy beam processing apparatuses.
The case will be explained using FIG. 4 as an example.

FIG. 4 shows an L equipped with the position information input device of the second embodiment.
1 is a diagram showing the overall configuration of an SI wiring forming apparatus. In the figure, the same reference numerals as those in FIG. 1 indicate the same or equivalent elements as already explained, and the explanation thereof will be omitted.

First, wiring formation will be explained. In FIG. 4, a load lock chamber 41 is connected to a main chamber 43 via a gate valve 42, and each vacuum pump 44.
4' by pipe 45.45' and valve 46.46
′ is configured to allow exhaust air to flow through the air.

Inside the main chamber 43, a wafer (or chip if necessary) 48a is placed on a sample stage 47, and
It is configured to be movable by a stage 119 and a drive device 12. The wafer (or chip) 48a is supplied into the main chamber 43 together with the sample stage 47 by the transport mechanism 51. In addition, the main chamber 43 includes piping 52.
, a CVD material gas cylinder 54 is connected via a valve 53. The laser beam 56 output from the laser oscillator 55 passes through a shutter mechanism 57 and an output adjustment mechanism 58, is bent by a mirror 59, and is then focused by an objective lens 60a and irradiated onto the wafer 48a through a window 61. Ru. Further, the illumination light 63 from the illumination light 'rX62 passes through a filter 64 and is bent by a mirror 65, and then illuminates the wafer 48a through the objective lens 60a and the window 61. The surface of the wafer 48a includes a mirror 66 and an eyepiece 67.
It can also be observed using the imaging device 68 and the monitor device 14 connected thereto.

Further, the control device 69 controls the shutter mechanism 57 . The configuration is such that the output adjustment mechanism 58, filter 64, etc. can be controlled.

Next, the functions of each part and the procedure for forming wiring will be explained.

A wafer (or chip) 48a on which wiring is to be formed is fixed on a sample stage 47, and placed on an XY stage 49 in the main chamber 43 by a transport mechanism 51.

After the main chamber 43 is sufficiently evacuated by the vacuum pump 44', the valve 46' is closed and the valve 53 is closed.
The gas in the cylinder 54, for example, M O (c O
) G is introduced into the main chamber 43 via the piping 52. The gas pressure of M o (CO)6 is set to a predetermined pressure, for example 0. When the temperature reaches ITorr, the valve 53 is closed.

Then, the center of the field of view and the center of the laser spot are adjusted in advance so that they match, and after setting the output adjustment mechanism 58 to an appropriate value by a command from the control device 69, the shutter mechanism 57 is driven. A laser beam 56 output from a laser oscillator 55 is irradiated onto the wafer (or chip) 48a. Irradiated wafer (or chip) 48a
An arbitrary location on the surface is heated by irradiation with the laser beam 56, and Mo(CO)- is decomposed and Mo is precipitated. When the XY stage 49 is moved at this time, the precipitated Mo adheres to the film of the chip, forming wiring. By the above procedure, a defective part in the LSI chip can be repaired (connected).

The above is a description of wiring formation, and next, identification of a repair location will be described.

In most LSI repairs, defective wiring is traced using a layerer diagram that plots the wiring on the LSI chip, and repair points (areas that are easy to repair) are written down, or the LSI chip itself that is still under development is optically inspected. Wiring is checked using a microscope, and repair points are marked on an optical microscope photo.

Therefore, the position information input device described above is applied to this wiring forming device, and its operation is as follows. That is, in FIG. 4, the layout diagram 3 or the optical microscope photograph 3' is placed on the table 1 in which the stress sensor 2 is embedded, aligned with the direction of the LSI chip 48 on the X-Y stage 49. The pointer 4, the point designation switch 5.6, and the magnification setter 8 are used to designate the reference point and the repair location on these diagrams, and the distance on the diagram is determined by the arithmetic processing unit 10 on the LSI chip 48. Convert to distance. The XY stage 49 is moved according to the obtained distance, and the repair position on the LSI chip is displayed on the monitor device 14. In accordance with the display screen, the X-Y stage 49 is further moved slightly to find the final repair location, specify the repair location, and perform the wiring formation described above.

As an application example of the present invention, a wiring forming apparatus using laser beam CVD has been described above, but it can also be applied to wiring forming using ion beam CVD, a wiring cutting apparatus using ion beam, or a processing apparatus using electron beam. , it goes without saying that the location information input device of the present invention is applicable.

Next, another embodiment of the present invention will be described with reference to FIG. In FIG. 5, 70 is a computer, 71 is a CRT, 7
2 is a touch panel, 73 is a light pen, 74 is a mouse,
75 is a floppy disk device, 76 is a keyboard, 77
is a hard disk device, 78 is a digitizer, 79 is a digitizing pen, and 80 is a 1-rack ball. The computer 70 has a CRT 71. light pen 73, mouse 74,
Floppy disk device 75, keyboard 76, hard disk device 77, digitizer 78.1-rack ball 8
41 connected with o respectively! It is complete. Further, the computer 70 is connected to the wiring forming apparatus i! ! (not shown).

There are two operating methods in this embodiment.

The first is a layout diagram (or optical microscope photo)
3 onto the digitizer 78, and digitize pen 79.
In this method, the location information of the repair area is input into the computer 70 by operating the . In this case, the magnification and origin are also specified using the digitizing pen 79. Second, all the screen information of the layout diagram (or optical microscope photograph) 3 of the digitizer 78'2 is once input into the computer 70 using the image scan function of the digitizer, the information is displayed on the CRT 71, and the information is displayed on the touch panel 72. 1
- This method involves operating the pen 73 to cause the computer 70 to store the location information of the repair location. At this time, CRT7
In addition to the manual operation of placing drawings, etc. on the digitizer 78, the screen information displayed on the floppy disk device 75 or hard disk device 77 includes the LSI design data itself in advance. This information may be automatically retrieved and displayed. In addition, the location information of the repaired area is sent to computer 7.
0, first display a position designation mark such as a cursor on the CRT 71, then operate the mouse 74, keyboard 76, trackball 80, etc. to move the cursor, etc., and press the mouse 74 switch, keyboard 1-76, etc. Positional information can also be input using the keys or the point designation switch 5.6.

To repair an LSI, as described in the wiring formation procedure above,
The process is carried out in a vacuum chamber, and the equipment itself is located in a clean room. On the other hand, if the method of this embodiment is used, all that is required is to finally send the position information from the computer to the wiring forming device via a communication cable. I can do it.

Further, according to the method of this embodiment, it is possible to simultaneously provide position information to a plurality of repair apparatuses, which has the effect of improving operability and saving labor.

〔Effect of the invention〕

According to the present invention, it is possible to easily input the positional information of the corresponding position on the actual LSI chip from a specific position in the LSI layerer 1 - diagram or optical microscope photograph. When repairing an LSI chip, it is possible to immediately provide location information of the repaired area to the AWL for wiring repair (cutting or connection).This allows for rapid debugging during LS chip development. It can be carried out.

Further, if the input method according to the present invention is used, remote control becomes possible, so it is possible to completely clean semiconductor repair and to save labor by simultaneously inputting data into multiple devices.

11. Description of the drawings (11-Explanation) Fig. 1 is a (4) diagram of a position information input device which is an embodiment of the present invention, Fig. 2 is a diagram showing the operation of the arithmetic processing unit in Fig. 1. Flowchart 1 showing the processing procedure, FIG. 3 is an example of the screen of the L8 chip displayed on the monitor device in the figure, and FIG. FIG. 5 is a block diagram of a position information input device according to another embodiment of the present invention.

Explanation of symbols 1...Table 2...Stress sensor 3...
・Layout diagram 4...Pointer 5.6...Point 1-designation switch 7...Decoder 8...Magnification setting device 10...
- Arithmetic processing unit 11... Direction switch 12
...Drive device unit 14...Monitor device 48...
LSI chip 49...X-Y stage 70...
Computer 7I...CRT72...Touch panel 73...Light pen 74...Mouse
76... Keyboard 78... Digitizer
79... Digitizing pen 80... 1 ~ Easy ball

Claims (1)

[Scope of Claims] 1. An energy beam processing device characterized by determining the irradiation position of an energy beam on a sample based on positional information specified in a figure such as a drawing or a photograph. 2. An energy beam processing apparatus according to claim 1, characterized in that the energy beam is composed of a laser beam, and a film is formed on the sample by CVD. 3. An energy beam processing apparatus according to claim 2, characterized in that wiring is formed on an LSI. 4. An energy beam processing apparatus according to claim 1, characterized in that the energy beam is an ion beam, and sputter processing is performed on a sample. 5. An energy beam processing apparatus according to claim 4, which processes a fine circuit pattern. 6. An energy beam processing apparatus according to claim 1, characterized in that the energy beam is an ion beam, and a film is formed on the sample by CVD. 7. An energy beam processing apparatus according to claim 6, characterized in that wiring is formed on an LSI. 8. An energy beam processing apparatus according to claim 1, characterized in that the energy beam is an electron beam to process or form a film on a sample. 9. The first part on the drawing or photograph showing the position information on the sample.
A method of specifying a second point on the sample corresponding to the first point from the point and inputting its position information, the method comprising: a predetermined third point on the drawing or photograph; Using the fourth point on the sample indicated by the third point as a reference point, calculate the distance from the third point on the drawing or photograph to the first point on the sample according to the magnification of the drawing or photograph. Convert it to the actual distance of
Determining a position approximately corresponding to the first point on the drawing or photograph, which is away from the fourth point on the sample by the actual distance,
By searching around the location using a monitor device,
A method for inputting position information, comprising specifying the second point. 10. In order to carry out the method for inputting positional information according to claim 9, a drawing or diagram showing a stage movable in the X and Y directions on which a sample is placed and positional information on the sample is provided. A table on which a photograph is placed with the X and Y directions aligned with the sample, and a means for pointing out an arbitrary point on the drawing or photograph placed on the table and outputting positional information of the point. , a means for setting the magnification of the drawing or photograph, inputting the position information of a predetermined reference point on the drawing or photograph and the indicated specific point, and calculating the distance between the reference point and the specific point, an arithmetic processing means for converting the magnification into an actual distance on the sample; and a calculation processing means that calculates a position approximately corresponding to the specific point on the drawing or photograph, which is separated from the reference point on the sample by the actual distance, and calculates a position near the position. 1. A position information input device comprising: a monitor device for searching. 11. Equipped with a computer, a digitizer, a diagram showing position information on the digitizer, and a digitizing pen,
A position information input device characterized in that a predetermined position on the diagram is designated with the digitizing pen, the position information is stored, the predetermined position is searched for, and the position information of the desired position is input. 12. A digitizer, a diagram showing position information on the digitizer, a digitizing pen, a computer, a CRT, a touch panel and a light pen provided on the front of the CRT, or a keyboard, or a mouse, or a trackball. and a predetermined position specifying means including at least one of the above, and after capturing all the position information on the diagram and displaying it on the CRT, specifying a predetermined position on the diagram by any of the predetermined position specifying means. 1. A location information input device that searches for a predetermined location by storing the location information, and inputs location information of the desired location. 13. An LSI wiring repair device comprising the position information input device according to any one of claims 10 to 12.