JPH0260793A - Semiconductor device for ic card - Google Patents

Semiconductor device for ic card

Info

Publication number
JPH0260793A
JPH0260793A JP63210682A JP21068288A JPH0260793A JP H0260793 A JPH0260793 A JP H0260793A JP 63210682 A JP63210682 A JP 63210682A JP 21068288 A JP21068288 A JP 21068288A JP H0260793 A JPH0260793 A JP H0260793A
Authority
JP
Japan
Prior art keywords
die
chip
young
bonded
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63210682A
Other languages
Japanese (ja)
Inventor
Sunao Fukutake
Yoshito Tanaka
Original Assignee
Hitachi Maxell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Maxell Ltd filed Critical Hitachi Maxell Ltd
Priority to JP63210682A priority Critical patent/JPH0260793A/en
Publication of JPH0260793A publication Critical patent/JPH0260793A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors

Abstract

PURPOSE: To obtain a semiconductor device for IC card with a high IC mechanical strength and operational reliability by a method wherein an IC chip is die- bonded on a substrate with a die bonding material having a Young's modulus less than a specific value, a conductor pattern on the substrate is wire-bonded to the IC chip, and the IC chip is sealed with a sealing material having a Young' s modulus less than a specific value.
CONSTITUTION: As a die-bonding material 11A for die-bonding an IC chip 10 on a die pad 7, a resin having a Young's modulus of 50-kgf/mm2 or less, such as a thermoset silicone resin, is used. By thermally setting the die-bonding material 11A, the IC chip 10 is bonded on a substrate 5 through the die pad 7. After an Au wire 12 is wire-bonded, a sealing material 13A, such as a photo- setting acrylic resin having a young's modulus of 200kgf/mm2 or less is loaded by potting. In this manner, an IC module 3A is completed.
COPYRIGHT: (C)1990,JPO&Japio
JP63210682A 1988-08-26 1988-08-26 Semiconductor device for ic card Pending JPH0260793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63210682A JPH0260793A (en) 1988-08-26 1988-08-26 Semiconductor device for ic card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63210682A JPH0260793A (en) 1988-08-26 1988-08-26 Semiconductor device for ic card

Publications (1)

Publication Number Publication Date
JPH0260793A true JPH0260793A (en) 1990-03-01

Family

ID=16593364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63210682A Pending JPH0260793A (en) 1988-08-26 1988-08-26 Semiconductor device for ic card

Country Status (1)

Country Link
JP (1) JPH0260793A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63233834A (en) * 1987-03-24 1988-09-29 Meiji Gomu Kasei Kk Urethane rubber roll and manufacture thereof
JPH02120840U (en) * 1989-03-15 1990-09-28
JP2000299553A (en) * 1999-04-13 2000-10-24 Ricoh Microelectronics Co Ltd Manufacture of electronic circuit board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63233834A (en) * 1987-03-24 1988-09-29 Meiji Gomu Kasei Kk Urethane rubber roll and manufacture thereof
JPH0669745B2 (en) * 1987-03-24 1994-09-07 株式会社明治ゴム化成 Urethane rubber roll and method for producing the same
JPH02120840U (en) * 1989-03-15 1990-09-28
JP2000299553A (en) * 1999-04-13 2000-10-24 Ricoh Microelectronics Co Ltd Manufacture of electronic circuit board

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