JPH0258942U - - Google Patents
Info
- Publication number
- JPH0258942U JPH0258942U JP13716188U JP13716188U JPH0258942U JP H0258942 U JPH0258942 U JP H0258942U JP 13716188 U JP13716188 U JP 13716188U JP 13716188 U JP13716188 U JP 13716188U JP H0258942 U JPH0258942 U JP H0258942U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- circumferential surface
- platen
- pitch
- plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims 2
- 230000002093 peripheral effect Effects 0.000 description 1
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- Electronic Switches (AREA)
Description
第１図は本考案の実施例の概略側面図、第２図
は上記実施例におけるエレメントの配列構造を示
す部分拡大図、第３図は上記実施例の斜視図、第
４図は従来のエレメントの配列構造を示す部分拡
大図、第５図は従来のサーマルヘツドの概略側面
図である。
１……絶縁性基板、２ａ……第１のエレメント
、２ｂ……第２のエレメント、４……プラテン、
４ａ……プラテンの周面、Ａ……第１の平面、Ｂ
……第２の平面、Ｐ……エレメントのピツチ。
Fig. 1 is a schematic side view of an embodiment of the present invention, Fig. 2 is a partially enlarged view showing the arrangement structure of elements in the above embodiment, Fig. 3 is a perspective view of the above embodiment, and Fig. 4 is a conventional element. FIG. 5 is a schematic side view of a conventional thermal head. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2a... First element, 2b... Second element, 4... Platen,
4a... Peripheral surface of platen, A... First plane, B
...Second plane, P...Pitch of element.
Claims (1)
互いに異なつた位置で接する２つの平面の形成さ
れた絶縁性基板と、この絶縁性基板の第１の平面
の上記プラテンの周面に接する接線上に所定のピ
ツチで配列された発熱体からなる第１のエレメン
トと、上記絶縁性基板の第２の平面の上記プラテ
ンの周面に接する接線上に上記第１のエレメント
に対してその配列方向に１／２ピツチ分ずつずら
して配列された発熱体からなる第２のエレメント
とを具備することを特徴とするサーマルヘツド。 an insulating substrate formed with two planes that touch the circumferential surface of a drum-shaped platen at different positions; and a first plane of the insulating substrate on a tangent to the circumferential surface of the platen. a first element consisting of heating elements arranged at a predetermined pitch on the insulating substrate; A thermal head comprising: a second element made of a heating element that is arranged offset by 1/2 pitch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13716188U JPH0258942U (en) | 1988-10-20 | 1988-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13716188U JPH0258942U (en) | 1988-10-20 | 1988-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0258942U true JPH0258942U (en) | 1990-04-27 |
Family
ID=31398336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13716188U Pending JPH0258942U (en) | 1988-10-20 | 1988-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0258942U (en) |
-
1988
- 1988-10-20 JP JP13716188U patent/JPH0258942U/ja active Pending