JPH0258339U - - Google Patents
Info
- Publication number
- JPH0258339U JPH0258339U JP13741288U JP13741288U JPH0258339U JP H0258339 U JPH0258339 U JP H0258339U JP 13741288 U JP13741288 U JP 13741288U JP 13741288 U JP13741288 U JP 13741288U JP H0258339 U JPH0258339 U JP H0258339U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mount component
- protrusion
- circuit board
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13741288U JPH0258339U (zh) | 1988-10-20 | 1988-10-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13741288U JPH0258339U (zh) | 1988-10-20 | 1988-10-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0258339U true JPH0258339U (zh) | 1990-04-26 |
Family
ID=31398812
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13741288U Pending JPH0258339U (zh) | 1988-10-20 | 1988-10-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0258339U (zh) |
-
1988
- 1988-10-20 JP JP13741288U patent/JPH0258339U/ja active Pending