JPH0257681B2 - - Google Patents
Info
- Publication number
- JPH0257681B2 JPH0257681B2 JP58139128A JP13912883A JPH0257681B2 JP H0257681 B2 JPH0257681 B2 JP H0257681B2 JP 58139128 A JP58139128 A JP 58139128A JP 13912883 A JP13912883 A JP 13912883A JP H0257681 B2 JPH0257681 B2 JP H0257681B2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- grooves
- recess
- lead wire
- recesses
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Thermistors And Varistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】
イ 産業上の利用分野
この発明は半導体素子等の電子部品の素子本体
にリード線を半田付け接続する方法で、詳しくは
複数の素子本体にリード線を一括して半田付けす
る方法に関する。[Detailed Description of the Invention] A. Field of Industrial Application This invention relates to a method for connecting lead wires to the element bodies of electronic components such as semiconductor elements by soldering. Regarding how to attach.
ロ 従来技術及び発明が解決しようとする問題点
例えばサーミスタは第１図及び第２図に示すよ
うにチタン酸バリウム等のプレート状素子１の両
面に１本ずつリード線２，３を半田４，４で接続
して電極の取出しを行つた後、素子１を外装樹脂
材５で封止した構造が一般的である。従来この種
サーミスタの需要が少ないため、その構造は手作
業で行われているが、最近サーミスタの需要が伸
びて手作業による製造が量産的、コスト的に不適
になりつつあるのが現状である。B) Problems to be Solved by the Prior Art and the Invention For example, in a thermistor, as shown in FIGS. A common structure is that the element 1 is sealed with an exterior resin material 5 after the electrodes are taken out by connecting the elements 1 to 4. Conventionally, there was little demand for this type of thermistor, so their construction was done by hand, but as the demand for thermistors has increased recently, manual manufacturing is becoming unsuitable for mass production and cost. .
即ち、サーミスタの素子１は１mm角前後と非常
に小さく、この素子１へのリード線２，３の半田
付けは拡大鏡を使つて拡大した像を目で観察しな
がら作業者が１本ずつ半田ゴテを使つて行つてい
た。そのため作業性が極めて悪く、また作業者の
熟練度に半田付けの良否が大きく左右されて歩留
りが悪く、結果的にサーミスタを高価にしてい
た。 In other words, the thermistor element 1 is very small, about 1 mm square, and the lead wires 2 and 3 are soldered to the element 1 one by one by the operator while visually observing the magnified image using a magnifying glass. I used a trowel to do it. As a result, workability is extremely poor, and the quality of soldering is largely dependent on the skill level of the worker, leading to poor yields and, as a result, thermistors becoming expensive.
ハ 問題点を解決するための手段
本発明は上記サーミスタの素子の如き小形素子
へのリード線接続の問題点に鑑みてなされたもの
で、次の治具を使つたパツチ処理可能な方法を提
供する。C. Means for Solving the Problems The present invention was made in view of the problems of connecting lead wires to small elements such as thermistor elements, and provides a patch processing method using the following jig. do.
上記治具は表裏両面に素子が嵌まる複数の凹部
と、各凹部の底面を横切る複数の第１溝と、各凹
部の上端開口を横切る複数の第２溝と、各凹部の
底面に真空吸着孔を有し、次の(a)〜(d)の各工程で
素子へのリード線接続を一括して行う。 The above jig has a plurality of recesses into which the elements fit on both the front and back surfaces, a plurality of first grooves that cross the bottom of each recess, a plurality of second grooves that cross the upper end opening of each recess, and vacuum suction on the bottom of each recess. It has a hole, and lead wires are connected to the device at once in each of the following steps (a) to (d).
(a) 上記治具の表裏両面の各第１溝に所望のリー
ド線（第１リード線）を巻き付け等で嵌入す
る。(a) A desired lead wire (first lead wire) is inserted into each of the first grooves on both the front and back surfaces of the jig by winding or the like.
(b) 上記治具の先ず表面の各凹部に１個ずつ素子
を半田を介して真空吸着で嵌入し、次に治具の
裏面の各凹部に素子を真空吸着で嵌入する。こ
の素子嵌入は別の素子整列治具を使う等して行
えばよく、また各凹部内に先に嵌入された第１
リード線と素子の少くとも一方に予備半田処理
をしておく。(b) First, one element is fitted into each recess on the front surface of the jig by vacuum suction via solder, and then the element is fitted into each recess on the back surface of the jig by vacuum suction. This element insertion can be done by using another element alignment jig, or the first element inserted into each recess first.
Pre-solder at least one of the lead wire and the element.
(c) 上記治具の第２溝に所望のリード線（第２リ
ード線）を巻き付ける等で嵌入する。この場合
も素子と第２リード線との少くとも一方に予備
半田処理をしておく。(c) Fit a desired lead wire (second lead wire) into the second groove of the jig by winding it or the like. In this case as well, preliminary soldering is applied to at least one of the element and the second lead wire.
(d) 治具全体を加熱炉に通して各凹部内の素子の
表裏両面にある予備半田を溶融させて第１、第
２リード線を同時に半田付け接続する。(d) Pass the entire jig through a heating furnace to melt the preliminary solder on both the front and back sides of the element in each recess, and simultaneously solder and connect the first and second lead wires.
以上の各工程により素子が小形でもパツチ処理
が容易で、従つて量産性の大幅な改善が図れる。 Through each of the above steps, patch processing is easy even if the device is small, and therefore mass productivity can be greatly improved.
ニ 実施例
本発明で使用する上記治具の一実施例を第３図
乃至第７図を参照しながら説明すると、６は矩形
平板状の治具、７，７…は治具６の表面m1の中
央部に２列配置で等間隔で形成された複数の凹
部、８，８…は治具６の裏面m2に上記凹部７，
７…と同配列で同数、同一形状で形成された凹部
で、各凹部７，７…、８，８…には例えば上記サ
ーミスタの素子１が１個ずつ嵌入される形状大の
ものである。９，９…及び１０，１０…は第３図
におけるＡ−Ａ線及びＢ−Ｂ線で切断した断面を
示す第５図及び第６図から判るように、治具６の
表裏両面m1，m2に各凹部７，７…、８，８…の
横に並ぶ２つの底面を横切る方向且つ深さh1で形
成された複数条の平行な第１溝、１１，１１…及
び１２，１２…は同様に第５図及び第６図の通り
治具６の表裏両面m1，m2に各凹部７，７…、
８，８…の横に並ぶ２つの上端開口を横切る方向
且つ深さh2で形成された複数条の平行な第２溝で
ある。１３，１３…は第５図のＣ−Ｃ線で切断し
た第７図のように各凹部７，７…、８，８…の底
面に開口する真空吸着孔で、各々は外部の真空ポ
ンプ１４に連結される。尚第７図で図番１７及び
１７′は後述する。各第１溝９，９…、１０，１
０…は１本の第１リード線１５が嵌入される幅を
持ち、各第２溝１１，１１…、１２，１２…は１
本の第２リード線６が嵌入される幅を持ち、この
両者の幅は通常同じで第１、第２リード線１５，
１６も同一線径のものが用いられる。尚第１溝
９，９…、１０，１０…及び第２溝１１，１１
…、１２，１２…は第５図乃至第７図のいずれに
も示されている。また治具６は図示しないが外部
支持体で上下反転可能に支持される。D. Example An example of the above-mentioned jig used in the present invention will be described with reference to FIGS. A plurality of recesses 8, 8 , .
The recesses are formed in the same arrangement, in the same number, and in the same shape as the recesses 7, 7, 8, 8, . 9, 9... and 10, 10... are the front and back surfaces m 1 , A plurality of parallel first grooves 11, 11... and 12, 12 formed in a direction transverse to the two bottom surfaces of each recess 7, 7..., 8, 8... and at a depth h 1 in m 2 . Similarly, as shown in FIGS. 5 and 6, the recesses 7, 7, . . . on both sides m 1 and m 2 of the jig 6,
A plurality of parallel second grooves are formed in a direction transverse to two upper end openings lined up side by side and have a depth h2 . 13, 13... are vacuum suction holes opened at the bottoms of the respective recesses 7, 7..., 8, 8... as shown in FIG. 7 taken along line C-C in FIG. connected to. Note that the drawing numbers 17 and 17' in FIG. 7 will be described later. Each first groove 9, 9..., 10, 1
0... has a width into which one first lead wire 15 is inserted, and each second groove 11, 11..., 12, 12... has a width of 1
It has a width into which the second lead wire 6 of the book is inserted, and these two widths are usually the same, and the first and second lead wires 15,
16 also have the same wire diameter. Note that the first grooves 9, 9..., 10, 10... and the second grooves 11, 11
..., 12, 12... are shown in any of FIGS. 5 to 7. Although the jig 6 is not shown, it is supported by an external support so that it can be turned upside down.
次に治具６による本発明の方法を工程毎に説明
する。 Next, the method of the present invention using the jig 6 will be explained step by step.
先ず第８図に示す如く各第１溝９，９…、１
０，１０…に長尺な第１リード線１５を順次嵌入
していく。これは治具６を第８図の矢印方向に回
転させながら１本の長尺な第１リード線１５を端
の第１溝９から始めて１０−９−１０−９…と順
次に嵌入していくようにすれば自動化、高速化が
可能である。 First, as shown in FIG. 8, each first groove 9, 9..., 1
The long first lead wires 15 are sequentially inserted into the wires 0, 10, . . . . This is done by sequentially inserting one long first lead wire 15 starting from the first groove 9 at the end, 10-9-10-9, etc. while rotating the jig 6 in the direction of the arrow in FIG. It is possible to automate and speed up the process if you proceed.
次に真空ポンプ１４を作動させておいて、第９
図に示すように治具６の表面m1を上にして各凹
部７，７…に素子１，１…を１個ずつ挿入し真空
吸着させる。この素子嵌入は例えば第１３図に示
すように、別の素子整列治具１７に素子１，１…
を整列保持させ、この各素子１，１…上にスクリ
ーン印刷等で定量の半田１８，１８…を塗着させ
ておいて、その上に治具６の下にした表面m1を
位置決めして被せ、全体を上下逆に反転させれば
各素子１，１…は凹部７，７…に真空引きされて
吸引され、一括処埋で確実に行える。同様の要領
で治具６の裏面m2の各凹部８，８…にも各素子
１，１…を１個ずつ挿入し真空吸着させる。尚上
述した素子１，１…を各凹部７，７…及び８，８
…に真空吸着させる時には、素子１，１…を吸着
する側と反対側の凹部の真空吸着孔１３，１３…
は、第７図に示すように当て板治具１７′で閉塞
しておく必要がある。 Next, the vacuum pump 14 is operated, and the ninth
As shown in the figure, the elements 1, 1... are inserted one by one into each of the recesses 7, 7... with the surface m1 of the jig 6 facing upward, and are vacuum-adsorbed. For example, as shown in FIG. 13, the elements 1, 1, . . . are inserted into another element alignment jig 17.
are aligned and held, a certain amount of solder 18, 18... is applied by screen printing etc. onto each element 1, 1..., and the surface m1 below the jig 6 is positioned on top of it. If the entire device is placed on top and turned upside down, each element 1, 1... will be evacuated and suctioned into the recesses 7, 7..., making it possible to reliably perform the treatment all at once. In the same manner, each element 1, 1... is inserted one by one into each recess 8, 8... on the back surface m2 of the jig 6 and vacuum-adsorbed. It should be noted that the above-mentioned elements 1, 1... are connected to the respective recesses 7, 7... and 8, 8.
When vacuum adsorbing the elements 1, 1..., the vacuum suction holes 13, 13... in the concave portion on the opposite side to the side where the elements 1, 1... are adsorbed
must be closed with a patch plate jig 17' as shown in FIG.
而る後、第１０図に示すように第１リード線１
５と同じ要領で長尺な第２リード線１６を第２溝
１１，１１…、１２，１２…に順次に嵌入する。
この時の状態を第１４図に示す。尚、１９，１９
…は各素子１，１…に予め塗着した半田である。
この時の各素子１，１…は第２リード線１６で押
圧されるので各真空吸着孔１３，１３…の真空引
きを止める。 After that, as shown in FIG.
In the same manner as in step 5, the long second lead wires 16 are sequentially fitted into the second grooves 11, 11..., 12, 12....
The state at this time is shown in FIG. Furthermore, 19,19
... is solder applied in advance to each element 1, 1....
At this time, each element 1, 1... is pressed by the second lead wire 16, so the vacuum suction of each vacuum suction hole 13, 13... is stopped.
次に第１１図に示すように治具６の両側面にリ
ード線仮固定用押板２０，２０を押し当てた状態
で全体を加熱炉（図示せず）に通して各素子１，
１…の半田１８，１８…，１９，１９…を溶融さ
せ、各素子１，１…に両リード線１５，１６を部
分的に一括して半田付けする。 Next, as shown in FIG. 11, the jig 6 is passed through a heating furnace (not shown) with press plates 20, 20 for temporarily fixing the lead wires pressed against both sides of the jig 6, and each element 1,
The solders 18, 18, 19, 19, .
後は例えば第１２図に示すように治具６の表裏
両面m1，m2上の第２リード線１６に横切る方向
でテープ２１，２１を貼布しておいて、３つのカ
ツター２２，２２，２２で両リード線１５，１６
の先ず治具表面m1の両側コーナ部と中央の箇所
とを切断し、続いて治具６を上下反転させて同じ
ように切断する。このようにするとリード線切断
後の各部品はテープ２１，２１で連結された取扱
い便利なテーピング部品として治具６から取り出
されて後工程に送られる。 After that, as shown in FIG. 12, for example, tapes 21, 21 are pasted in a direction transverse to the second lead wires 16 on both sides m 1 and m 2 of the jig 6, and the three cutters 22, 22 are attached. , 22 with both lead wires 15, 16
First, both corner portions and the center portion of the jig surface m 1 are cut, and then the jig 6 is turned upside down and cut in the same manner. In this way, each component after the lead wire has been cut is taken out from the jig 6 as a taped component connected by tapes 21, 21, which is easy to handle, and sent to a subsequent process.
尚、本発明の実施形態例は上記例に限らず、特
に治具の凹部は２列配置以外に格子状配置でより
多数個形成する等の変更が可能である。また素子
はサーミスタの素子に限らず、他の電子部品の素
子であつてもよく、特に素子の片面にのみリード
線接続をするものであれば上記治具の凹部と浅い
方の第２溝のみを利用する使用変更によつてバツ
チ処理が可能である。 Note that the embodiments of the present invention are not limited to the above examples, and in particular, modifications such as forming a larger number of recesses in the jig in a lattice-like arrangement instead of in two rows are possible. In addition, the element is not limited to a thermistor element, but may be an element of another electronic component. In particular, if the lead wire is connected only to one side of the element, only the concave part of the jig and the shallower second groove are used. Batch processing is possible by changing usage using .
ホ 発明の効果
以上説明したように、本発明によれば小形素子
へのリード線接続のバツチ処理が簡単で且つ治具
利用による位置決めで正確になり、歩留り改善や
量産性の大幅な向上化が図れ、電子部品のコスト
ダウン化が可能となる。E. Effects of the Invention As explained above, according to the present invention, batch processing for connecting lead wires to small devices is simple and accurate positioning is achieved using a jig, and yield improvement and mass productivity are greatly improved. This makes it possible to reduce the cost of electronic components.
第１図及び第２図は電子部品の一例を示す部分
断面視正面図及び側面図、第３図及び第４図は本
発明で使用する治具の一例を示す平面図及び正面
図、第５図及び第６図は第３図のＡ−Ａ線及びＢ
−Ｂ線に沿う断面図、第７図は第５図のＣ−Ｃ線
に沿う拡大断面図、第８図乃至第１２図は本発明
の方法を説明するための各工程での治具の部分斜
視図と正面図、第１３図は第９図の素子供給工程
の動作例を示す治具部分拡大断面図、第１４図は
第１０図の治具部分拡大断面図である。
１……素子、６……治具、m1……表面、m2…
…裏面、７，８……凹部、９，１０……第１溝、
１１，１２……第２溝、１３……真空吸着孔、１
５……第１リード線、１６……第２リード線。
1 and 2 are a partially sectional front view and a side view showing an example of an electronic component, FIGS. 3 and 4 are a plan view and a front view showing an example of a jig used in the present invention, and FIG. The figure and Figure 6 are lines A-A and B of Figure 3.
7 is an enlarged sectional view taken along line C-C in FIG. A partial perspective view and a front view, FIG. 13 is an enlarged sectional view of a part of the jig showing an example of the operation of the element feeding process of FIG. 9, and FIG. 14 is an enlarged sectional view of a part of the jig shown in FIG. 1...Element, 6...Jig, m 1 ...Surface, m 2 ...
...back surface, 7, 8... recess, 9, 10... first groove,
11, 12...Second groove, 13...Vacuum suction hole, 1
5...First lead wire, 16...Second lead wire.
Claims (1)
部と、各凹部の底面を横切る複数の第１溝及び各
凹部の上端開口を横切る複数の第２溝を有し、前
記各凹部の底面に真空吸着孔を設けた治具の前記
各第１溝に第１リード線を嵌入する工程、前記各
凹部に素子を前記第１リード線との間に半田を介
して真空吸着させて嵌入する工程、前記各第２溝
に第２リード線を前記素子との間に半田を介して
嵌入する工程、全体を加熱炉内で加熱して各凹部
内の素子の表裏両面に第１、第２リード線を同時
に半田付けする工程を含むことを特徴とする電子
部品素子へのリード線接続方法。1. A plurality of recesses into which electronic component elements are fitted on both the front and back surfaces, a plurality of first grooves that cross the bottom surface of each recess, and a plurality of second grooves that cross the upper end opening of each recess, and a plurality of second grooves that cross the top opening of each recess, and A step of fitting a first lead wire into each of the first grooves of a jig provided with a vacuum suction hole, and a step of fitting an element into each of the recesses by vacuum suctioning the element with the first lead wire via solder. , a step of fitting a second lead wire into each of the second grooves via solder between the element and the element; heating the whole in a heating furnace to form the first and second leads on both the front and back sides of the element in each recess; A method for connecting lead wires to an electronic component element, the method comprising the step of simultaneously soldering the wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58139128A JPS6030145A (en) | 1983-07-28 | 1983-07-28 | Connecting method of lead wire to electronic part element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58139128A JPS6030145A (en) | 1983-07-28 | 1983-07-28 | Connecting method of lead wire to electronic part element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6030145A JPS6030145A (en) | 1985-02-15 |
| JPH0257681B2 true JPH0257681B2 (en) | 1990-12-05 |
Family
ID=15238168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58139128A Granted JPS6030145A (en) | 1983-07-28 | 1983-07-28 | Connecting method of lead wire to electronic part element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6030145A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0738835A (en) * | 1993-07-23 | 1995-02-07 | Nec Corp | Simultaneous recording and reproducing device for multi-system signal |
-
1983
- 1983-07-28 JP JP58139128A patent/JPS6030145A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0738835A (en) * | 1993-07-23 | 1995-02-07 | Nec Corp | Simultaneous recording and reproducing device for multi-system signal |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6030145A (en) | 1985-02-15 |
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