JPH0257574A - Series of electronic parts - Google Patents

Abstract

PURPOSE:To remove pressure sensitive adhesive or adhesive from a carrier tape together with an electronic part by a method wherein an electronic part is secured on the carrier tape with pressure adhesion or adhesive via a lubricant which generates repulsive force due to heat welding. CONSTITUTION:Pressure sensitive adhesive or adhesive is applied at constant intervals on a carrier tape 1 lengthwise via a lubricant 5 having appropriate adhesion and repulsive power due to heat welding. Said pressure sensitive adhesive or adhesive 4 is applied on an electronic part 2 for temporarily securing the part on printed board, as well as it arranges the electronic parts 2 on the carrier tape 1. This constitution permits the pressure sensitive adhesive or adhesive 4 to be peeled off the tape easily when appropriately heated. It is desirable that recesses 3 having a smaller area than the main body 3a of the electronic part 2 are provided at constant intervals lengthwise the carrier tape 1 and the pressure sensitive adhesive or adhesive 4 is filled and attached on the recesses 3 via lubricants 5.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is an improvement in an electronic component series that arranges and holds electronic components along the longitudinal direction of a carrier tape provided with an adhesive or an adhesive for temporary fixing to a printed circuit board. It is related to.

Conventional technology Conventionally, in electronic component series in which electronic components such as capacitors and resistors are held in multiple series with a carrier tape, it is not necessary to pick out the electronic components individually from the carrier tape with a suction head and solder them onto the patterned surface of a printed circuit board. It is known that each electronic component is attached to a carrier tape with an adhesive or an adhesive for temporary fixation until it is fixed (Utility Model Publication No. 56-11438). It is also known that adhesives can be easily peeled off from carrier tapes by subjecting the tape side to which the agent is attached to a mold release treatment or by applying heat treatment to the back side of the carrier tape (Japanese Patent Application Laid-Open No. 1983-1999). No. 179575)
.

Problems to be Solved by the Invention However, in the case of the former among these electronic components, there is a risk that the adhesive or adhesive may peel off from the electronic components and remain on the carrier tape side as they are removed by the suction head. can be,
In addition, in the case of the latter type, it is necessary to prevent the electronic parts from detaching from the carrier tape or shifting due to photographing during transportation, etc., and to prevent the electronic parts from moving away from the carrier tape due to photographing during transportation. It is better to firmly hold the components on the tape surface, but applying release treatment to the carrier tape makes it easier to peel off the adhesive or adhesive from the carrier tape, but it also makes it easier to remove the adhesive or adhesive from the carrier tape. This is undesirable because it does not firmly adhere to the carrier tape, and adhesives or adhesives that firmly adhere electronic components to the carrier tape cannot be easily peeled off as intended if the adhesive is simply heat-treated from the back side of the carrier tape. If a portion of the adhesive remains on the carrier tape or the carrier tape, the amount attached to the electronic component inevitably decreases. In addition, since all of the above-mentioned methods merely hold electronic components on the tape surface by pressing the electronic components onto the adhesive or adhesive applied to the flat tape surface of the carrier tape, the viscosity of the adhesive or adhesive after application may vary. Due to the spread, it is not only difficult to keep the amount of adhesion at two positions constant, but also the adhesive or adhesive tends to bulge out from the main body position of the electronic component and adhere to unnecessary positions such as terminals.

n, the present invention reliably removes adhesives or adhesives that adhere to electronic components by 1IJt! It is an object of the present invention to provide a series of electronic parts that is 11" Q and is improved so that it can be installed in a fixed quantity at a predetermined position.

Means for Solving the Problems In the electronic component series according to the present invention, a release agent is used at regular intervals in the longitudinal direction of the carrier tape, which has an appropriate adhesive strength and which generates mutual repellency when melted by heating. Adhesive or adhesive is attached to the electronic components for temporary fixing to the printed circuit board, and the adhesive or adhesive is used to arrange and hold the electronic components on the tape surface of the carrier tape. In addition, recesses having a relatively smaller planar area than the main body of the electronic component are provided at predetermined intervals along the longitudinal direction of the carrier tape, and the above-mentioned mold release agent is applied to each recess. Adhesive or adhesive is filled and adhered, and this adhesive or adhesive is attached to the electronic components for temporary fixing to the printed circuit board, and the electronic components are arranged and held on the tape surface of the carrier tape with the adhesive or adhesive. It is composed of: In storage, it is preferable to use a mold release agent that melts at low temperatures, and a tack or adhesive that has adhesive strength at room temperature.

Function: In this electronic component series, the release agent generates repellency with the adhesive or adhesive when heated and melted, so the electronic component is firmly fixed to the tape surface of the carrier tape with the adhesive or adhesive via the release agent. The adhesive or adhesive can be easily peeled off from the tape surface together with the electronic components even when the carrier tape is filled with the adhesive or the adhesive, and the amount and position of the adhesive can be kept constant by filling the recesses provided in the carrier tape. In addition, it is possible to prevent it from protruding from the main body of the electronic component or from attaching to an unnecessary position. If you use a release agent that melts at low temperatures and a pressure-sensitive adhesive that is adhesive at room temperature, you can quickly remove the electronic component from the carrier tape with a short heat treatment. This is preferable because it can be temporarily fixed to a printed circuit board immediately.

DESCRIPTION OF THE PREFERRED EMBODIMENTS The following will describe the most preferred embodiments shown in the accompanying drawings.

This electronic component series has electronic components 2 such as chip-type capacitors and resistors arranged and held at regular intervals along the longitudinal direction of the carrier tape 1, and is automatically attached as the carrier tape 1 is fed in pitch. It can be used as a means for supplying electronic components by picking out the electronic components 2 from the carrier tape 1 with the suction head of the machine and mounting them on the surface of a printed circuit board. Further, this electronic component series has a recessed portion 3 having a relatively smaller planar area than the main body portion 2a of the electronic component 2 on the tape surface of the carrier tape 1, and a printed circuit board is temporarily fixed inside the recessed portion 3. The electronic component 2 is adhered to and held on the tape surface of the carrier tape 1 with a pressure-sensitive adhesive (hereinafter simply referred to as "adhesive") 4 that is filled for a purpose. The carrier tape 1 may be made of polypropylene, polyethylene, polyvinyl chloride, polyester, or the like. In addition, a polymeric material such as silicone can be used as the adhesive 4, and if this polymeric material is adhesive at room temperature, the electronic component 2 can be attached to the printed circuit board immediately after being peeled off from the carrier tape 1. This is preferable because it can be temporarily fixed.

The adhesive 4 is filled and adhered to the recesses 3 of the carrier tape 1 via a release agent 5 which is applied in advance to the inner surface of each recess 3. The mold release agent 5 used is one that has a suitable adhesiveness sufficient to hold the electronic component 2 on the tape surface of the carrier tape 1 and also generates repellency with the adhesive 4 by heating and melting. For example, a mixture of organic acid, alcohol, ester and chroman resin can be used. Also,
It is preferable to use a mold release agent 5 that melts at low temperatures; in this case, the electronic component 2 and the adhesive 4 can be peeled off from the carrier tape 1 by a short heat treatment.

As shown in FIG. 1, the mold release agent 5 can be applied directly to the inner surface of the recess 3, and the adhesive 4 can be attached by filling the solidified layer of the mold release agent 5. When forming the two-layer structure, when a silicone-based adhesive is used as the adhesive 4, it is preferable to use a release agent 5 containing coumaron resin as the main component and triphenyl phosphate added, and furthermore, coumaron resin. It is preferable to use a mold release agent 5 containing saligenin or salicyl alcohol as a main component in order to suppress plasticization and increase mutual repellency. Further, as shown in FIG. 2, in order to reinforce the adhesiveness of the release agent 5, an adhesive 6 of the same quality as the adhesive 4 was attached to the bottom layer, and the release agent 5 and the adhesive 4 were filled in an overlapping layer. It can also be formed into a three-layer structure. In the case of this three-layer structure, when a silicone-based adhesive is used as the adhesive 4.6, a release agent 5 containing triphenyl phosphate as a main component and coumaron resin added thereto can be used as the release agent 5.

When manufacturing this series of electronic components, carrier tape 1
Alternatively, as shown in Fig. 3, the hollow part 3 to be filled with the adhesive can be held on the bottom inner surface to hold the electronic component. It is possible to use a carrier tape 1 in which relatively large recesses 7 large enough to accommodate the carrier tape 1 are embossed at regular intervals in the longitudinal direction. The carrier tape 1 is provided with feed holes 8 for tape pitch conveyance at predetermined intervals on the tape surface as shown in FIG. It is also possible to provide insertion holes 9a and 9b for push-up bottles such as the above on the left and right sides of the recess 3 on the bottom surface of the recess 7. Using this carrier tape 1,
Release agent 5. is released from a discharge nozzle that moves up and down as the carrier tape 1 is pitch-fed. Adhesive 4, or adhesive 6, release agent 5. Each material is sequentially filled inside the recess 3 in the order of the adhesive 4. At that time, even if each material 4°5.6 is in a molten state, it will not adhere to the inside of the recess 3 and
Since it is formed with a relatively smaller plane area than the main body 2a of the electronic component 2, it is accommodated inside the recess 3 without protruding greatly from the recess 3, and is deposited at a predetermined position in a substantially large amount. can be done. After that, when the electronic component 2 is inserted inside the recess 7, the adhesive 4 adheres to the main body 2a on the bottom side of the electronic component 2, and the adhesive 4 is used to position the electronic component 2 on the carrier tape 1. It can be held securely on the surface.

In the electronic component series configured in this way, the electronic components 2 are securely held on the tape surface of the carrier tape 1 by the adhesive 4, so that they can be wound onto a reel and manufactured as an electronic component series without applying a cover tape. Moreover, even when the carrier tape 1 is pitch-fed through the feed hole 8 in order to apply the electronic component series to automatic mounting, the electronic component 2 does not separate from the tape surface or dance, causing positional deviation. When mounting this electronic component, heat treatment is applied from the back side of the carrier tape 1 while feeding the carrier tape 1 in pitch.
By melting the mold release agent 5 in a short time, the adhesive 4 (6)
and generate repellency. In this state, when the electronic component 2 is attracted to the suction head of the automatic mounting machine and the suction head is moved upward, the adhesive 4 easily separates from the mold release agent 5 due to mutual repellency and is non-wetting. The carrier tape 1 can be removed while remaining attached to the electronic component 2 without being contaminated. At the time of this separation, if the electronic component 2 is auxiliarily pushed up by pushing up pins provided on the left and right sides below the conveyance path of the carrier tape 1 upward from the insertion holes 9a and 9b, the electronic component 2 can be pushed up with the adhesive 4. can be taken out more reliably. If the adhesive 4 is sticky at room temperature, the extracted electronic component 2 can be temporarily fixed with the adhesive 4 by immediately lowering the suction head to a predetermined position on the printed circuit board. Especially electronic parts 2
By soldering between the terminal portions 2b, 2c and the conductive pattern of the printed circuit board, the electronic component 2 can be mounted and fixed on the printed circuit board. Since the electronic component 2 is sometimes fixed to the printed circuit board with the adhesive 4 during this soldering, there is no possibility that the electronic component 2 will fall off from the printed circuit board.

As a specific example of this electronic component series, a silicon-based adhesive is used as an adhesive, and a mold release agent is made of coumaron resin (69%) as the main component, with triphenyl phosphate (30%) and saligenin (1%) added. Two-layer structure (Test Example 1)
We measured the suitability of a three-layer structure (Test Example 2) in which triphenyl phosphate as the main component and coumaron resin was added, sandwiched between a mold release agent and a silicone adhesive (Test Example 2). It was as shown in the table.

As is clear from this table, under normal conditions, electronic components can be attached and held on the carrier tape with sufficient adhesive force, and when the release agent is melted to generate repellency with the adhesive, it is extremely reciprocal. Since the adhesive force between carrier tapes can be reduced, electronic components can be reliably removed from the carrier tape while the adhesive remains attached to the electronic components. In addition, the electronic components of Test Example 1 were temporarily fixed to the printed circuit board with an adhesive, but the soldering process was performed at a soldering temperature of 230°C and 250°C.
Even when the conditions were changed to 270° C. and solder immersion time of 5 and 10.15 seconds, the electronic components did not fall off.

Effects of the Invention As described above, according to the electronic component series of the present invention, even if the electronic component is firmly bonded and held to the carrier tape by the adhesive or adhesive, the adhesive or adhesive will repel each other due to heating and melting. Since the adhesive is held on the carrier tape via a release agent that generates a release agent, the repellency with the release agent allows the adhesive to be reliably released from the carrier tape along with the electronic components. If you use a low-temperature adhesive as the adhesive and a room-temperature adhesive as the adhesive, it will be possible to quickly process the removal of electronic components and temporary fixing to the printed circuit board. By filling the provided recesses with adhesive or adhesive, it is possible to provide a fixed amount of adhesive or adhesive at a predetermined position on the carrier tape to temporarily fix electronic components.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram of the configuration of an electronic component series according to one embodiment of the present invention, FIG. 2 is an explanatory diagram of the configuration of an electronic component series according to another embodiment of the present invention, and FIG. FIG. 4 is a cross-sectional view of a carrier tape applicable to constructing a series of parts, and is an explanatory diagram of a process when electronic parts are arranged and held using the same carrier tape. 1: carrier tape, 2: electronic component, 2a: main body, 3
: hollow part, 4: adhesive or adhesive, 5: 11: molding agent.

Claims (4)

[Claims] (1) At regular intervals in the longitudinal direction of the carrier tape (1), adhesive or adhesive (4) is applied via a release agent (5) that has appropriate adhesive strength and generates mutual repellency when melted by heating. This adhesive or adhesive (4) is attached to the electronic component (2) for temporary fixing to the printed circuit board, and the electronic component (2) is attached to the carrier tape ( 1) A series of electronic parts characterized by being arranged and held on the tape surface. (2) Recesses (3) having a relatively smaller planar area than the main body (2a) of the electronic component (2) are provided at predetermined intervals along the longitudinal direction of the carrier tape (1), and each recess is provided at predetermined intervals. Adhesive or adhesive (4) is filled and adhered to part (3) via a release agent (5) that has appropriate adhesive strength and generates mutual repellency when melted by heating, and this adhesive or adhesive The agent (4) is attached to the electronic components (2) for temporary fixing to the printed circuit board, and the adhesive or adhesive (4) is used to hold the electronic components (2) in an array on the tape surface of the carrier tape (1). A series of electronic components characterized by: (3) The electronic component series according to claim 1 or 2, characterized in that the mold release agent (5) is one that melts at a low temperature. (4) Claim 1 characterized in that the adhesive or adhesive (4) is made of an adhesive having adhesive strength at room temperature.
Or the electronic parts series described in 2.