JPH0350044Y2 - - Google Patents
Info
- Publication number
- JPH0350044Y2 JPH0350044Y2 JP1987043695U JP4369587U JPH0350044Y2 JP H0350044 Y2 JPH0350044 Y2 JP H0350044Y2 JP 1987043695 U JP1987043695 U JP 1987043695U JP 4369587 U JP4369587 U JP 4369587U JP H0350044 Y2 JPH0350044 Y2 JP H0350044Y2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- recess
- electronic component
- series
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000853 adhesive Substances 0.000 claims description 43
- 230000001070 adhesive effect Effects 0.000 claims description 43
- 239000000463 material Substances 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000428 dust Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Description
【考案の詳細な説明】
産業上の利用分野
本考案は電子部品の自動実装に適用するべく、
プリント基板の板面に搭載する電子部品の外部端
子を導電パターンに半田付け固定する表面実装型
の電子部品をキヤリアテープで多連状にテーピイ
ング保持する表面実装部品連のの改良に関するも
のである。[Detailed description of the invention] Industrial application field This invention is applied to automatic mounting of electronic components.
This invention relates to an improvement in a series of surface-mounted electronic components, in which external terminals of electronic components mounted on the board surface of a printed circuit board are soldered and fixed to conductive patterns, and are held in multiple series with carrier tape.
従来の技術
従来、この種の電子部品連においては電子部品
をプリント基板の板面に半田付け固定するまで電
子部品を仮止め固定する粘着剤を備え、その粘着
剤で電子部品をキヤリアテープに接着固定したも
のが知られている（特開昭59−194498号）。この
電子部品連は凹凸状にエンボス成形されたキヤリ
アテープの電子部品を収容する凹所の底面に粘着
剤を剥離可能に直接備えるものであり、その粘着
剤の上側に付着させて電子部品を凹所内に備付け
るよう構成されている。Conventional technology In the past, this type of electronic component series was equipped with an adhesive that temporarily fixed the electronic component until it was soldered to the surface of the printed circuit board, and the electronic component was bonded to the carrier tape using the adhesive. A fixed type is known (Japanese Patent Application Laid-open No. 194498/1983). This series of electronic components has a removable adhesive directly attached to the bottom of the concave part of the carrier tape which is embossed in a concave and convex shape to accommodate the electronic components. It is configured to be installed within the facility.
考案が解決しようとする課題
然し、この表面実装部品連では粘着剤を凹所の
底面に直接付着するものであため、その粘着剤の
厚みに応じて電子部品の凹所内高さが定まるから
粘着剤の厚みが正確に管理されていないと、昇降
動する吸着ノズルで電子部品を凹所内より摘出す
るときに電子部品をノズル先端で過剰に突き或い
は電子部品をノズル先端で吸持できない事態が生
ずる。また、粘着剤の厚み面が凹所の空間内で外
気に晒されるため、凹所をカバーテープ等で被覆
しなければ粘着剤の露出部分に塵埃が付着するな
どの虞れもある。Problems that the invention aims to solve: However, in this series of surface mount components, the adhesive is directly attached to the bottom of the recess, and the height of the electronic component inside the recess is determined by the thickness of the adhesive. If the thickness of the agent is not accurately controlled, when an electronic component is extracted from a recess with a suction nozzle that moves up and down, the electronic component may be pushed excessively by the nozzle tip, or the electronic component may not be suctioned by the nozzle tip. . Furthermore, since the thick side of the adhesive is exposed to the outside air within the space of the recess, there is a risk that dust may adhere to the exposed portion of the adhesive unless the recess is covered with a cover tape or the like.
課題を解決するための手段
本考案に係る表面実装部品連においては、キヤ
リアテープの電子部品を収容する凹所の底面に比
較的小さな窪み部を設け、その窪み部に基板仮止
め用の粘着剤を充填し、この粘着剤で電子部品を
キヤリアテープの凹所内に付着保持すると共に、
その電子部品で粘着剤を窪み部内に封入すること
により構成されている。Means for Solving the Problems In the surface mount component series according to the present invention, a relatively small recess is provided at the bottom of the recess for accommodating the electronic component of the carrier tape, and an adhesive for temporarily fixing the board is applied to the recess. This adhesive holds the electronic components in the recesses of the carrier tape, and
It is constructed by sealing an adhesive into a recessed part using the electronic component.
作 用
この表面実装部品連ではキヤリアテープの電子
部品を収容する凹所の底面に比較的小さな窪み部
を設けて基板仮止め用の粘着剤を充填し、その粘
着剤をキヤリアテープの凹所内に収容する電子部
品で封入するものであるから電子部品の凹所内収
容高さを通常通り一定に保てるばかりでなく、粘
着剤が外部に露出しないことにより塵埃が付着す
る等も避けられる。Function: In this series of surface mount components, a relatively small depression is provided at the bottom of the carrier tape that accommodates the electronic components, and an adhesive for temporarily fixing the board is filled in the depression, and the adhesive is inserted into the depression in the carrier tape. Since the electronic components to be accommodated are sealed, not only can the height of the electronic components in the recess be kept constant as usual, but also the adhesion of dust can be avoided because the adhesive is not exposed to the outside.
実施例
以下、添付図面を参照して説明すれば、次の通
りである。Embodiments The following description will be made with reference to the accompanying drawings.
この表面実装部品連は、第１図で示すようにコ
ンデンサ等の如きチツプタイプの電子部品１０を
キヤリアテープ２０で多連状にテーピイング保持
することにより構成されている。キヤリアテープ
２０は電子部品を多連状に保持するベースとなる
テープのみでもよいが、図示実施例では電子部品
を保持するベーステープ２１とベーステープ２１
に被着するカバーテープ２２とから形成すること
もできる。そのベーステープ２１のテープ面に
は、電子部品１０を収容するのに足る深さの凹所
２３……とテープピツチ送りに用いる送り孔２４
……が形成されている。このベーステープ２１に
設ける凹所２３……は第１図で示すようにベース
テープ２１を凹凸状に付形し、或いは第２図で示
すようにベーステープ２１の厚みを凹状に窪ませ
るようエンボス成形することにより形成できる。
その凹所２３……の底面には、粘着剤１１を収容
する比較的小さな窪み部２５……が設けられてい
る。この窪み部２５……は半球形状に形成でき、
電子部品１０がチツプコンデンサ等の微少なもの
であると一つ形成すれば足りる。また、第３，４
図で示すように電子部品１０が三ツ足、カニ足タ
イプ等の大きいものであると、電子部品１０に付
着する粘着剤１１……の数に応じて複数個形成す
るとよい。その各窪み部２５……にはプリント基
板の板面に仮止め粘着剤１１を充填し、この粘着
剤１１で電子部品１０を凹所２３……の底面に付
着保持すると共に、粘着剤１１……が電子部品１
０で窪み部２５……の内部に封入されている。こ
の粘着剤１１としては、80℃程度の熱風第による
加熱で粘着力を発生するシリコン、アクリル系等
の高分子材料を用いるとよい。 As shown in FIG. 1, this surface mount component series is constructed by holding chip-type electronic components 10 such as capacitors in multiple series with carrier tape 20. The carrier tape 20 may be only a tape that serves as a base for holding electronic components in a multi-layered manner, but in the illustrated embodiment, it includes a base tape 21 for holding electronic components and a base tape 21 for holding electronic components.
It can also be formed from a cover tape 22 that is applied to. The tape surface of the base tape 21 has a recess 23 deep enough to accommodate the electronic component 10 and a feed hole 24 used for tape pitch feeding.
...is formed. The recesses 23 provided in the base tape 21 are formed by shaping the base tape 21 into an uneven shape as shown in FIG. It can be formed by molding.
A relatively small recess 25 for accommodating the adhesive 11 is provided at the bottom of the recess 23. This recessed portion 25... can be formed into a hemispherical shape,
If the electronic component 10 is minute, such as a chip capacitor, it is sufficient to form one. Also, the third and fourth
As shown in the figure, if the electronic component 10 is a large one such as a three-legged or crab-legged type, a plurality of adhesives 11 may be formed depending on the number of adhesives 11 attached to the electronic component 10. Each recess 25 is filled with a temporary adhesive 11 on the surface of the printed circuit board, and the adhesive 11 adheres and holds the electronic component 10 to the bottom of the recess 23. ...is electronic component 1
0 and is sealed inside the recessed portion 25. As the adhesive 11, it is preferable to use a polymeric material such as silicone or acrylic material that generates adhesive force when heated with hot air at about 80°C.
このように構成する表面実装部品連では、電子
部品１０をキヤリアテープ２０の各凹所２３……
に挿置した後、キヤリアテープ２０のテープ面に
剥離可能に被着するカバーテープ２２で凹所２３
……を封止させて巻取ることにより自動装着機の
リールに装架することができる。そのキヤリアテ
ープ２０は逐次に繰り出させてピツチ送りする途
上にカバーテープ２２を剥離し、ベーステープ２
１の凹所２３……から電子部品１０を順次に吸着
ヘツドで摘出することによりプリント基板の板面
に装着するようにできる。この取扱い中、電子部
品１０は粘着剤１１で付着されているからベース
テープ２１より脱落することがなく、またカバー
テープ２２を備えず或いはカバーテープ２２を剥
離した後でも粘着剤１１が電子部品１０で封入さ
れているから外気に晒されることがなく、塵埃等
が付着するのも避けられる。 In the series of surface mount components configured in this manner, the electronic components 10 are placed in each recess 23 of the carrier tape 20...
After the carrier tape 20 is inserted into the recess 23 with a cover tape 22 that is releasably attached to the tape surface of the carrier tape 20,
By sealing and winding..., it can be mounted on the reel of an automatic mounting machine. The carrier tape 20 is sequentially fed out and the cover tape 22 is peeled off while being fed in pitches, and the base tape 20 is
By sequentially extracting the electronic components 10 from the recesses 23 . . . 1 using a suction head, they can be mounted on the board surface of the printed circuit board. During this handling, since the electronic component 10 is attached with the adhesive 11, it will not fall off from the base tape 21, and even if the cover tape 22 is not provided or after the cover tape 22 is peeled off, the adhesive 11 will not stick to the electronic component 10. Because it is sealed, it is not exposed to the outside air, and dust and other substances are also prevented from adhering to it.
この電子部品連にシリコン、アクリル系等の如
き高分子材料でなる粘着剤１１を装備するとき
は、粘着剤１１と共に電子部品１０を吸着ヘツド
でベーステープ２２から取り出した後、プリント
基板に装着するまでの間に粘着剤１１に加熱処理
を加えることにより固相状態から軟化させて粘着
力を発生させるとよい。その後にプリント基板の
板面に圧接すると、粘着力を生じた粘着剤１１で
電子部品１０をプリント基板の板面に仮止め固定
できる。この粘着剤１１による仮止め状態で、プ
リント基板を半田付け固定すれば、電子部品１０
の外部端子をプリント基板の導電パターンに確実
に半田付け固定することができる。 When the electronic component series is equipped with an adhesive 11 made of a polymeric material such as silicone or acrylic, the electronic component 10 and the adhesive 11 are taken out from the base tape 22 by a suction head and then attached to a printed circuit board. In the meantime, it is preferable that the adhesive 11 is subjected to heat treatment to soften it from a solid state and generate adhesive force. When the electronic component 10 is then pressed against the surface of the printed circuit board, the electronic component 10 can be temporarily fixed to the surface of the printed circuit board using the adhesive 11 that has developed adhesive force. If the printed circuit board is soldered and fixed in the temporarily fixed state with this adhesive 11, the electronic component 10
The external terminals can be reliably soldered and fixed to the conductive patterns on the printed circuit board.
上述した粘着剤１１……は、第５図ａで示すよ
うに電子部品連の製造工程で液状の粘着剤１１を
ポリプロピレン等の軟質樹脂で形成したベーステ
ープ２１の窪み部２５……に充填した後、その粘
着剤１１が未硬化時に第５図ｂで示す如く電子部
品１０をベーステープ２１の凹所２３……内に挿
置すれば、電子部品１０を凹所２３……の内部に
定着させて止着保持できる。また、この装着時の
摘出にあたつては第６図で示すように吸着ヘツド
Ｈで電子部品１０を吸持することにより上昇動す
るのに同調させ、突上げピンＰで窪み部２５……
の半球形を反転させる如く押圧すれば粘着剤１１
と共に電子部品１０を摘出できる。その粘着剤１
１でも、上述した如く電子部品１０をプリント基
板に仮止め固定できるようになる。 The above-mentioned adhesive 11 is obtained by filling the recesses 25 of a base tape 21 made of a soft resin such as polypropylene with the liquid adhesive 11 in the manufacturing process of an electronic component series, as shown in FIG. 5a. After that, when the adhesive 11 is not cured, if the electronic component 10 is inserted into the recess 23 of the base tape 21 as shown in FIG. 5b, the electronic component 10 is fixed inside the recess 23. It can be held securely. In addition, when removing the electronic component 10 during installation, as shown in FIG. 6, the suction head H sucks the electronic component 10 in synchronization with the upward movement, and the push-up pin P is used to tap the recessed portion 25...
Press to invert the hemisphere of the adhesive 11.
At the same time, the electronic component 10 can be extracted. The adhesive 1
1, the electronic component 10 can be temporarily fixed to the printed circuit board as described above.
考案の効果
以上の如く、本考案に係る表面実装部品連に依
れば、実装基板に仮止めする粘着剤を備えても、
電子部品をキヤリアテープの凹所内に通常絡通り
一定高さに挿置できるばかりでなく、塵埃等が粘
着剤に付着せずしかも電子部品を確実に収容保持
することを可能にするものである。Effects of the invention As described above, according to the surface mount components according to the invention, even if the surface mount components are provided with an adhesive for temporary attachment to the mounting board,
This not only allows electronic components to be inserted into the recesses of the carrier tape at a constant height in a normal manner, but also allows the electronic components to be reliably accommodated and held without dust or the like adhering to the adhesive.
第１図は本考案に係る表面実装部品連の側断面
図、第２図は同部品連の変形例を示す側断面図、
第３及び第４図は同部品連で保持可能な表面実装
部品の別例を示す底面図、第５図ａ，ｂは第１図
で示す部品連の製造工程を示す説明図、第６図ａ
〜ｄは同部品連の電子部品摘出工程を示す説明図
である。
１０：電子部品、１１：粘着剤、２０：キヤリ
アテープ、２１：ベーステープ、２２：カバーテ
ープ、２３：凹所、２５：窪み部。
FIG. 1 is a side sectional view of a series of surface mount components according to the present invention, and FIG. 2 is a side sectional view showing a modification of the same series of components.
3 and 4 are bottom views showing other examples of surface mount components that can be held in the same component series, FIGS. 5 a and b are explanatory views showing the manufacturing process of the component series shown in FIG. 1, and FIG. 6 a
- d are explanatory diagrams showing the electronic component extraction process of the same component series. 10: Electronic component, 11: Adhesive, 20: Carrier tape, 21: Base tape, 22: Cover tape, 23: Recess, 25: Recess.
Claims (1)
の底面に比較的小さな窪み部を設け、その窪み
部に基板仮止め用の粘着剤を充填し、この粘着
剤で電子部品をキヤリアテープの凹所内に付着
保持すると共に、その電子部品で粘着剤を窪み
部内に封入したことを特徴とする表面実装部品
連。 (2) 上記粘着剤が、加熱で粘着力を発生するシリ
コン、アクリル系等の高分子材料でなるところ
の実用新案登録請求の範囲第１項記載の表面実
装部品連。 (3) 上記窪み部が、電子部品に付着する粘着剤の
数に応じて各凹所の底面に一つまたは複数個設
けられているところの実用新案登録請求の範囲
第１項記載の表面実装部品連。 (4) 上記凹所が、キヤリアテープのテープ面に剥
離可能に被着されたカバーテープで封止されて
いるところの実用新案登録請求の範囲第１項記
載の表面実装部品連。[Scope of Claim for Utility Model Registration] (1) A relatively small recess is provided at the bottom of each recess that accommodates the electronic components of the carrier tape, and the recess is filled with an adhesive for temporarily fixing the board. A series of surface mount components characterized in that an electronic component is adhered and held in a recess of a carrier tape with an adhesive, and an adhesive is sealed in the recess with the electronic component. (2) The series of surface mount components according to claim 1, wherein the adhesive is made of a polymeric material such as silicone or acrylic that generates adhesive force when heated. (3) The surface mounting according to claim 1, wherein one or more recesses are provided on the bottom surface of each recess depending on the number of adhesives attached to the electronic component. Part series. (4) The series of surface mount components according to claim 1, wherein the recess is sealed with a cover tape releasably attached to the tape surface of the carrier tape.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043695U JPH0350044Y2 (en) | 1987-03-25 | 1987-03-25 | |
| CA000558726A CA1322271C (en) | 1987-02-25 | 1988-02-11 | Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series |
| GB8803125A GB2203676B (en) | 1987-02-25 | 1988-02-11 | Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series |
| DE3805572A DE3805572C2 (en) | 1987-02-25 | 1988-02-23 | Carrier tape for electronic components and method for producing a sequence of electronic components |
| FR8802304A FR2611189A1 (en) | 1987-02-25 | 1988-02-25 | SUPPORT STRIP FOR ELECTRONIC CIRCUIT ELEMENTS AND METHOD FOR MANUFACTURING A SERIES OF ELECTRONIC CIRCUIT ELEMENTS |
| US07/481,756 US5089314A (en) | 1987-02-25 | 1990-02-15 | Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987043695U JPH0350044Y2 (en) | 1987-03-25 | 1987-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63149864U JPS63149864U (en) | 1988-10-03 |
| JPH0350044Y2 true JPH0350044Y2 (en) | 1991-10-25 |
Family
ID=30860796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987043695U Expired JPH0350044Y2 (en) | 1987-02-25 | 1987-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0350044Y2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009081648A1 (en) * | 2007-12-21 | 2009-07-02 | Murata Manufacturing Co., Ltd. | Method for manufacturing element mounting substrate |
| JP7128637B2 (en) * | 2018-03-16 | 2022-08-31 | 太陽誘電株式会社 | Electronic components with interposers |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59174498A (en) * | 1983-03-18 | 1984-10-02 | 東急車輌製造株式会社 | Preventive device for oil mixing of tank lorry, etc. |
-
1987
- 1987-03-25 JP JP1987043695U patent/JPH0350044Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59174498A (en) * | 1983-03-18 | 1984-10-02 | 東急車輌製造株式会社 | Preventive device for oil mixing of tank lorry, etc. |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63149864U (en) | 1988-10-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5089314A (en) | Carrier tape for electronic circuit elements and method of manufacturing an electronic circuit element series | |
| KR910004797B1 (en) | Mini-electronic device and its manufacturing method | |
| US4366342A (en) | Conductively coated embossed articles | |
| CA1128674A (en) | Method of mounting electronic components | |
| JPS63237500A (en) | Method of mounting surface mount component onto board | |
| US4873397A (en) | Electronic circuit element | |
| JPH0350044Y2 (en) | ||
| JP5812891B2 (en) | Carrier tape, electronic component series, and electronic component mounting method | |
| JPH037317Y2 (en) | ||
| JPH0129233B2 (en) | ||
| JPS6135696B2 (en) | ||
| JPS635817Y2 (en) | ||
| JPS6011680Y2 (en) | Chip-shaped electronic components | |
| JPH057160Y2 (en) | ||
| JPH04114876A (en) | Electronic component assembly and manufacture of electronic apparatus using same | |
| JPH0429557Y2 (en) | ||
| JPS5821811B2 (en) | Coating method and coating support for electrical equipment parts | |
| JPH0257574A (en) | Series of electronic parts | |
| JPH11165786A (en) | Structure of tape-like packaged body for electronic parts | |
| JPH051640B2 (en) | ||
| JPH06286763A (en) | Carrier tape and manufacture thereof | |
| JPH0810218Y2 (en) | Hybrid integrated circuit module | |
| JPS5814622Y2 (en) | soldering jig | |
| JP2532448B2 (en) | Electronic component automatic mounting machine | |
| JPS59228738A (en) | Semiconductor device |